Ray Thompson Calice meeting Mar 07 Ray Thompson WP4 aims: look at Mechanical/Thermal/ Assembly issues Utilise Atlas SCT experience effort weighted to latter.

Slides:



Advertisements
Similar presentations
Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.
Advertisements

CALICE Dave Bailey. Aims and Objectives Develop the technology to build a high- resolution tracking calorimeter for ILC experiments Main thrusts: –Testbeam.
0ATLAS Pixel Mechanics meeting at LBNL 13 April 2000 P.Netchaeva, INFN/Genoa Study of bump stresses The aim of this study is to check the effect of stresses.
Hybridization studies at Fermilab Prototype detectors –Readout chip mated to sensor –Experiences with both single dies and 4” and 6” wafers using Indium.
Victoria04 R. Frey1 Silicon/Tungsten ECal Status and Progress Ray Frey University of Oregon Victoria ALCPG Workshop July 29, 2004 Overview Current R&D.
Mechanical Status of ECAL Marc Anduze – 30/10/06.
CCD-style imaging for the JCMT. SCUBA-2 technology  the ability to construct large format detector arrays  signal readouts that can be multiplexed To.
1 CMS week 15/03/05, Module Production Meeting, Dean White - UCSB Status of Sensor Bias Connection Dean White For the US CMS Group.
Microelectronics Processing
CALICE: WP4 Thermal and Mechanical Roger Barlow Cambridge 10 September 2005.
Module Production for The ATLAS Silicon Tracker (SCT) The SCT requirements: Hermetic lightweight tracker. 4 space-points detection up to pseudo rapidity.
Placing glue dots 18 x 18 (324) dots on 5mm grid takes ~5min.
Fig 10: I-V characteristics of Au/PDNC/Al/Au junction. This shows that the molecule has rectification towards the positive bias. Current (A) M I A M I.
3D PACKAGING SOLUTIONS FOR FUTURE PIXEL DETECTORS Timo Tick – CERN
CMS - PAVIA1 Engineering Design Review RPC - BAKELITE.
Power Electronic Devices Semester 1 Lecturer: Javier Sebastián Electrical Energy Conversion and Power Systems Universidad de Oviedo Power Supply Systems.
Procedure for Pro4 using Keithley
Mickael Frotin– 15/01/2010 ECAL MACHANICAL R&D ECAL meeting - PARIS 1.
STFC Technology undulator manufacture and measurement James Rochford On behalf of the Helical collaboration.
CMS ECAL End Cap Meeting CERN 19 June to 23 June 2000 A.B.Lodge - RAL 1 ECAL End Cap High Voltage Cards and 2000 Electrical/Thermal Model. Progress on.
Situation with industry
Design of Concrete Structure I Dr. Ali Tayeh First Semester 2009 Dr. Ali Tayeh First Semester 2009.
LPNHE activities Contribution in the development of an assembly line for highly granular calorimeters with semiconductor readout Gluing robot system Metrology.
Marc Anduze – 09/09/2008 Report on EUDET Mechanics - Global Design and composite structures: Marc Anduze - Integration Slab and thermal measurements: Aboud.
Mechanical Status of EUDET Module Marc Anduze – 05/04/07.
Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 1 Vaclav Vrba Institute of Physics, AS CR, Prague CALICE ECal Status Report.
Ray Thompson Manchester Xmas Meeting 20/21 Dec 06 Ray Thompson, Julian Freeston, Andy Elvin WP4 aims: look at Mechanical/Thermal/ Assembly issues Utilise.
Ray Thompson Calice meeting UCL 6 Mar 06 WP4 aims: look at Mechanical/Thermal/ Assembly issues effort weighted to latter end of period Glue Assembly WP4.
Silicon /pcb assembly R Thompson, J Freestone LAL 3 June 08.
IPC Thermal Transfer Components, which for thermal reasons require extensive surface contact with the board or with a heatsink mounted on the.
The LHCb Outer Tracker Front End, what does it look like and what is the status Talk for the LHCb Electronics Working Group /TS A Collaboration.
Andy Blue Glasgow Update. Andy Blue WP3 Meeting Summary ESD Protection –Part all arrived and installed Compressed Air Controls –New lines and panel being.
Status of Hamamatsu Silicon Sensors K. Hara (Univ of Tsukuba) Delivery leakage current at 150V & 350V number of defect channels wafer thickness & full.
PS Module Gluing Tests USCMS Outer Tracker Workshop Ulrich Heintz, Meenakshi Narain, Bill Patterson, Sinan Sagir, Adam Lanman, Eric Spencer, Juan Trenado,
EPSRC Portfolio Partnership in Complex Fluids and Complex Flows Nanoscale Charge Writing on SnO 2 The ability to selectively position nanoscale objects.
Hybrid Mechanical/Thermal Design Ray Thompson / Manchester FP420 meeting Torino 11/12 July 06.
Interconnection in IC Assembly
Towards a 1m 3 Glass RPC HCAL prototype with multi-threshold readout M. Vander Donckt for the CALICE - SDHCAL group.
David Bailey Gluing. Silicon /pcb assembly Previously Using Sony Robot and precision dispenser Have established acceptable glue dot parameters Dot electrical.
1 R&D Advances: SiW Calorimeter LCWS 2010 Beijing SiD Concept Meeting March 28, 2010 John Jaros for SiD SiW Group (thanks to Ray, Ryan, Mani, and Marco.
22 Aug Ageing studies: the Miracle HV training.
Possible types of module Si/W CALORIMETER CONCEPT Si/W CALORIMETER CONCEPT G.Bashindzhagyan Moscow State University June 2002 Internal structure (not in.
Hybrid Mechanical/Thermal Design FP420 Ray Thompson Julian Freestone, Andy Elvin.
MEMS Packaging ד " ר דן סתר תכן וייצור התקנים מיקרומכניים.
18/02/20161 ASU Mechanical aspects Julien Bonis
Marc Anduze – CALICE Meeting – KOBE 10/05/07 Mechanical R&D for Technological EUDET ECAL Prototype.
Terra-Pixel APS for CALICE Progress meeting 10 th Nov 2005 Jamie Crooks, Microelectronics/RAL.
Pixel upgrade test structure: CO 2 cooling test results and simulations Nick Lumb IPN-Lyon MEC Meeting, 10/02/2010.
Conductive glue tests. J.Wickens 12/7/04 Used small pieces of HV kapton cut from redundant (old) stock, glued to silicon test structures from Karlsruhe.
Ageing tests of VCSELs in non-hermetic 85/85 condition Ageing tests of VCSELs in non-hermetic 85/85 condition S. Hou, 2014/08/26 Academia Sinica.
5 May 2006Paul Dauncey1 The ILC, CALICE and the ECAL Paul Dauncey Imperial College London.
DESY, 8 Dec 2005J. Cvach, prekick-off JRA3 JRA3 Institute of Physics ASCR Prague 1.ECAL, VFCAL (V. Vrba) 2.HCAL (J. Cvach) 3.Exchange in NA2 (travels 8.5.
FP420 Hybrid Mechanical Design Ray Thompson / Manchester Manchester Xmas O7 Ray Thompson Julian Freestone, Andy Elvin.
(8”x8”) MCPs Resistance Optimization by ALD Sept 20, 2011 Anil Mane, Jeffrey Elam.
PIXEL 2000 P.Netchaeva INFN Genova 0 Results on 0.7% X0 thick Pixel Modules for the ATLAS Detector. INFN Genova: R.Beccherle, G.Darbo, G.Gagliardi, C.Gemme,
SiW Electromagnetic Calorimeter - The EUDET Module Calorimeter R&D for the within the CALICE collaboration SiW Electromagnetic Calorimeter - The EUDET.
Marc Anduze – EUDET Meeting – PARIS 08/10/07 Mechanical R&D for EUDET module.
GRPC development in Lyon
Rev:A ( check-->19 pages document)
T. Bowcock University of Liverpool
On Wafer Ion Flux Sensors
Hybridization Studies: SU8, Assembly
Sapphire Fused Silica and EP30-2
Mechanical aspects of SiW Ecal PCBs
detector development readout electronics interconnects bump bonding
Hybrid Mechanical/Thermal Design ideas
BONDING The construction of any complicated mechanical device requires not only the machining of individual components but also the assembly of components.
A Large-Conductance Anion Channel of the Golgi Complex
WP4 Dave Bailey 5th May 2006.
Possible types of Si-sensor: SILICON CALORIMETRY FOR A LINEAR COLLIDER G.Bashindzhagyan, Il Park August Silicon sensor.
Presentation transcript:

Ray Thompson Calice meeting Mar 07 Ray Thompson WP4 aims: look at Mechanical/Thermal/ Assembly issues Utilise Atlas SCT experience effort weighted to latter end of period conducting Glues Assembly concepts Calice WP4

Silver filled 2 part epoxy ( no mass loss no voids) Ag has high ~1/1000 solid Ag -interconecting particles choose particle size, viscosity,cure temp EPO-tek 4110 Areas of interest - resistance aging Interface problems oxide layer at Al/Ag interface Production wafers old CTE mismatch Si /PCB - glue flexible Glass transition temp CTE change 50 x10-6 to 150 x10-6 Corrosion/electro chemistry – Ok for N2 atmosphere Glue effects on wafer passivisation Conducting Glues Ray Thompson Calice meeting Mar 07

Resistance measurements Keithley 236 SMU or 2000 DVM Labview Glue test set up Ray Thompson Calice meeting Mar 07 Glue Robot 3x3 3mm square pixels Standard 6X6 10mm square pixels Prague wafers Programmable Environmental chamber

Ray Thompson Calice meeting Mar 07 Pc board / gold Resistance snake Tests  R 0.1 ohm/50 dots pcb Silicon pads By probing Rear Pcb pads can measure the resistance of individual glue dot joint pairs or the total resistance of the snake R R total

Spacers to define height Kapton Spacers to define height Ray Thompson Calice meeting Mar 07

Long term Thermal Cycling 72 dot Snake test – continually powered 500 hr 20 to 70 degrees 1deg/min - Slow reduction in resistance over 100 hr then stable at ~ 1 ohm /dot - Resistance change each cycle as result of expansion / contraction - No evidence for beginnings of joint failure Temp cycle 72 dot Resistance R o Time hrs R ohms Ray Thompson Calice meeting Mar 07

“Virgin” glue joints show initial training behaviour Cured for some days no previous bias applied On first application of voltage IV curve can show high resistance at low voltage typically <500 mv then chaotic transitions to lower resistance states as the is voltage increased. Finally a step transition to “ normal “ state ~1 ohm typically at a few volts. Once this state has been established it seems permanent. The mechanism is probably a complex mixture of punch though of nanometer scale oxide interface films and mechanical breakthrough due to expansion by localised heating Initial resistance measurements with low voltage sources - many DVMs - can give very misleading results. This is consistent with our Atlas experience – few volts needed for initial measurement. Some evidence oxide films can restablish them selves if detectors left unbiased for months in normal air– can be ‘reset’ by few volts. Dot pair IV curves showing transition to low resistance Corresponding Resistance plot

Thermal Cycling Tests show no indications of beginnings of joint failure Where now? Summary ‘Virgin’ glue joints can show initial high resistance behaviour at low bias Bias > few volts enables conducting paths to be established Care needed when making DVM measurements Consistent with Atlas observations Wrap up glue studies Move on to assembly studies Ray Thompson Calice meeting Mar 07