BNL Role In ITK 1.Current R&D Roles 2.Proposed Production Role 3.Activities now until TDR (early 2017) 4.Resources and Infrastructure 5.Personnel 1 D. Lynn (BNL), US ITK Meeting, SLAC, July 8 th, 2015 Photo by P. Kuczewski

Current R&D Activities 1.Stave core —Stave core design and construction —Stave core characterization and quality control techniques —Stave core electrical grounding issues and quality control test method —Material irradiations 2. High Voltage Multiplexing —GaN Switches (previously SiC and MEMs as well) —Vertical silicon JFET with 3D trench implants on high resistivity silicon —Bias current measuring circuit —System issues —Irradiations 3. Other —3D Trench detector for high radiation environments 2

Proposed Production Role 1.BNL will become one of three sites for module production 2.Become site for stave assembly (i.e. mounting of modules onto stave cores, and test) 3.If the HV Multiplexing switch is deemed sufficiently reliable, then supply and test HV switches to be mounted on power board 4.Provide support/expertise to collaborating universities 3

Activities now until TDR (early 2017) 5. Stave core —Electrical design of core; Electrical core QC test development —Help transition fabrication to Yale —Help transition delamination detection and IR imaging techniques to Iowa State 6. High Voltage Multiplexing —Continue assessment of candidate switches —Arrange large scale irradiation of top candidates 4

Activities now until TDR (early 2017) 1.Develop infrastructure for stave and module assembly 2.Build multiple dummy and at least one working module by end of Build > 10 modules by end of Assembly multiple modules onto stave core and test by end of

Resources and Infrastructure BNL Omega group (Hong Ma, PI) submitted proposal to BNL for Program Development (PD )Funds Purpose was to obtain funds to hire another physicist to help prepare for BNL’s production roles. Plan to hire a postdoc with these funds as well (search in progress) Funds are also to be use to develop infrastructure (especially cleanroom) to build modules and staves. As a result we hired Gerrit van Nieuwenhuizen (formerly of MIT, STAR : Led the STAR Intermediate Silicon Tracker (IST) project) in February, 2015 Gerrit has begun the preliminary work on infrastructure needs and specifications. As a result of BNL’s commitment to the silicon strip project, DOE is providing base funds for us to hire a assistant physicist to work on the project as well (search in progress) 6

7 Cleanroom Infrastructure We need to renovate lab space in which we wish to put the hard walled cleanroom PD funds not sufficient. We are working towards obtaining another source of lab funds Hard wall clean room will have 800 square feet of class 10k assembly space Additional space exists in large lab for gowning, testing, etec. Other sources of cleanroom lab space may be available if necessary Large lab space needing renovation Example of a hard wall cleanroom under construction Sketch of lab space housing cleanroom

Cleanroom layout for simultaneous module and stave assembly 8 Elements are based upon known dimensions, e.g. stave assembly station based upon RAL module assembly station

Hybrid assembly infrastructure 9 Have just recently begun setting up temporary “cleanish” room for hybrid assembly Recently have begun initial gluing trial. Tooling provide by Liverpool

First ‘chip’ to hybrid ‘gluing’ tests ● picking and aligning chips ● looks good on vacuum jig ● clamp stencil and apply ‘glue’ ● ugh, ‘chips’ sticking to stencil ● this is probably caused by the clamping which bows the stencil too much ● followed Mike Wormald’s advice and held stencil by hand when applying glue 10 Hybrid assembly infrastructure

New equipment for module assembly and test ● Thermo electric cooler goes down to -25 degC (idea is for an inexpensive module chiller; may attempt to get done to -40 C) ● bought plasma cleaner (to be used before on kapton hybrids and stave cores 11

12 Personnel —David Lynn (physicist)100% —Gerrit van Nieuwenhuizen (physicist)100% —Phil Kuczewski (electrical technician)75% —Russ Burns (mechanical technician)70% —Assistant physicist (to be hired)50% —Postdoc (to be hired)75%

13 Backup

Second ‘chip’ to hybrid ‘gluing’ tests —picking and aligning chips —looks good on vacuum jig —clamp stencil and apply ‘glue’ —ugh, ‘chips’ sticking to stencil —this is probably caused by the clamping which bows the stencil too much —followed Mike Wormald’s advice and held stencil by hand when applying glue —Nice ‘glue’ spots —Next is to test with real glue —and make a piece for wire bonding —Expected to be ready with ‘hybrid’ testing in September 14 Hybrid assembly infrastructure