Welcome to ChipMOS Quality Laboratory

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Presentation transcript:

Welcome to ChipMOS Quality Laboratory Laboratory instrument introduction-----1:30~2:00 SAT instrument operation ----------------2:00~3:00 COF defect sample inspection (OM/Decapsulation/SEM) --------------- 3:00~3:30 COF electrical measurement ----------- 3:30~4:00 COF mechanical test (die strength) --- 4:00~4:30

Failure Analysis Procedure SAT Picture XRM Image SEM Photo LCM Photo Hot Spot (Defect)

Scanning Acoustic Tomograph Inspection Die Surface Delamination Mode TSOPII 50L Die Crack Mode mBGA 70B 2 1

COF Defect Location and Decapsulation COF (48mm) Peeling from tape after decapsulation Fuming Nitric Acid (100%) Room temperature 30mins Rinse by acetone

Optical Microscope (OM) Inspection after Decapsulation 50X Stereo OM 200X 500X

Scanning Electron Microscope (SEM) Inspection and Energy Dispersive X-ray (EDX) Detection SEM

Electrical Measurement (COF/Chip) Probe station Curve tracer I (mA) I (mA) I (mA) Short Pass Open V (v) V (v) V (v)

Mechanical Test (Die Strength)