Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University, Japan)

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 2 Communication with Hamamatsu Idea of test setup for mass production DAQ –Overall plan –Connecting to EUDAQTopics

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 3 Hamamatsu said: –8 inch is possible, but not desired for HPK standard thickness is  m extra cost for thinner (due to grinding) resistivity is smaller (  more bias voltage) simple patterns only –6 inch: sensors of 320 and 500  m thickness cost almost the same 650  m, 10-15% raise on cost < 300  m, 70% raise on cost 70,000 chips/year (ILD DBD: ~ 5 years) 500  m, 6 inch currently seems the best thicker & bigger sensors

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 4 1.Chips from Hamamatsu –IV/CV tested in Hamamatsu 2.Laser scan on every pixel on bare chips –Crosstalk (connecting pixels) –Operable gain (not precise) 3.Glued to PCB/SKIROC, making slabs 4.Test with RI source ( 57 Co or 90 Sr) –Gain calibration –Noise Test stand for mass production

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 5 Plan of laser scan XYZ stage Si sensor Springs or conductor sheet PCB with many holes Electrode Laser beam Put the IR laser beam at every gap between the pixels using XYZ stage Check gain (roughly) and leakage (connecting) pixel on each pixel before gluing Should be short time eg. 2 sec/gap, 300 pad/day (can be loosen if we have multiple stations) Laser beam readout (SKIROC?)

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 6 Calibration of gain and noise with electronics 90 Sr (2.28 MeV (Max) e - ) –MIP-like signals (non-monochromatic) –Dependence on angle to source 57 Co (122 & 136 keV (10%)  ) life: 0.7 yr –quasi-Monochromatic gamma, easy to calibrate –only ~2% stops at 500  m silicon: scattering background < 1 hour of accumulation time required Slab test with RI source slabs source

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 7 57 Co will arrive in Oct. 90 Sr already available XYZ automated stage: order soon PCB with holes: should design DAQ: firstly CAMAC with non-full channel (eg. 16 channels) Plan to establish them within this fiscal year (~Mar. 2015) DAQ with SKIROC: next fiscal year Plan to assemble a test station

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 8 DAQ

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 9 DAQ in Kyushu now

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 10 Ongoing 1.Online monitor (talk by H. Hirai) 2.Connection to external framework (EUDAQ or others) Planned after looking at new calicoes 1.Flexible logging system 2.C++ support module 3.Enforce analysis/debugging DAQ development plans in Kyushu

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 11 Structure Data format (LCIO) Schedule/Plan Topics about EUDAQ connection

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 12 EUDAQ structure Calice Producer calicoes / others TCP connection

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 13 1.Store ‘hit’-like objects We have ‘CalorimeterHit’ class in LCIO Need threshold – not always suitable for low- level analysis (cross talk etc.) 2.Store simple array of raw data  planned More flexibility; hit-like data can be created from the raw array Need more steps for high-level analysis No specific LCIO structure, use LCGenericObject with attachment class Data format in LCIO

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 14 LCIO: GenericObject LCIO Event  1 ROC - LCIO collections  1 types of data (SiADC, ScADC, ScTDC etc.) -LCIO objects LCGenericObject  1 chip of data LCGenericObject can save one array (int, float, double) dataDescription in every object can be used for tags, eg. “LDA=1;DIF=2;BX=10;”

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 15 Current status Succeeded to run EUDAQ with CaliceProducer producing dummy data encoded to LCIO object and save to LCIO file using DataCollector Ready to attach to calicoes/others

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 16 EUDAQ part Writing TCP adapter Converter from raw to LCIO (if needed) calicoes part Attachment of calicoes to output data to TCP Integration and test Testbeam at CERN: 26 Nov. – 8 Dec. Things to do

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 17 We started to work on DAQ (Thanks to LLR and DESY for sending us setup) Our first target is the testbeam Nov.-Dec. Base software is updating: we’d like to adapt to it We’ll also work on prototype of test facilitySummary

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 18

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 19 ROC control on TB mode piconf calicoes/pyrame Sc hardwareSi hardware Sc dataSi data Event builder CCC next ROC Event builder will control next ROC Need to modify piconf/CCC

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 20Image Run control piconf calicoes/pyrame Sc hardwareSi hardware Sc dataSi data Event builder LCIO file(s) Event display start/stop EUDAQ start/stop

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep page 21 Aims Assure all data are correctly arrived Assure ROC # is consistent on the whole system Common format for Si/Sc cal data Assure run ID Inputs idea a: common LCIO objects idea b: raw + converter  First to implement piconf seems to have no output formatter Data Collector