WISDOM WP6 Manufacturability, Scalability and Functionality Study Start M0, End M35 WP leader is CIP Objectives –Assessment of manufactureability of the.

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Presentation transcript:

WISDOM WP6 Manufacturability, Scalability and Functionality Study Start M0, End M35 WP leader is CIP Objectives –Assessment of manufactureability of the sub-systems used in the optical firewall –Establishing the optimum balance between optical and electronic processing for the firewall function –Platform scaleability & functionality

WISDOM WP6 Manufacturability –Self-correcting daughterboard design now implemented –Discussions with flip chip bonding tool manufacturer about wafer scale bonding tool development Scalability –Higher speed SOA based devices Bandgap shifted Functionality

Manufactureability Self correcting daughterboard design –Errors in size of mechanical front and side stops now self-correcting –Submount alignment against inside edge of aperture in motherboard –Higher level of process tolerance SOA array SOA to DB alignment DB to MB alignment Effect of over / undersize of front / side stops on alignment

Functionality ‘Substrate free’ thin film filter development –Strain compensated filter design –Substrate removal –‘substrate free’ design inserted into slot in waveguides (30 micron or so thick) –Filter wavelength optimisation required as spectral shift post filter removal

Next 6 months Continue to gather data on existing electronic systems –Cost, power consumption, capacity Develop cost model for integrated pattern matching circuit –Indicative cost of control electronics?