1 Internal Alignment of VXD3 Overview VXD3 at SLD Observing misalignments with the track data Matrix technique to unfold alignment corrections Comments.

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Presentation transcript:

1 Internal Alignment of VXD3 Overview VXD3 at SLD Observing misalignments with the track data Matrix technique to unfold alignment corrections Comments on SiD tracker alignment David Jackson Oxford University / RAL SiD Tracking Meeting SLAC 25 th March 2005

2 SOUTHNORTH

3 Rigid Body Alignment in 3D:, 3 translation + 3 rotation parameters Global Alignment: Internal Alignment: 1 x 96 x = 6 parameters = 576 parameters (align to CDC) (mainly internal to VXD3) CCD single hit resolution < 5μm, Optical survey precision ~ 10μm

4 Apparent hit position on a CCD due to misalignment. NORTHSOUTH

5 The CCDs themselves provide the most precise measurements of the track trajectory Construct internal constraints with track fixed to two CCD hits and measure ‘residual’ to the third All CCDs in for each residual type contribute to the residual in proportion to a lever-arm weight In ‘overlap’ regions only 2 CCDs contribute a significant weight VXD3 ‘doublets’, ‘shingles’ and ‘triplets’ connected the North/South halves, CCDs within each layer and the three layers of the detector respectively. DOUBLETS SHINGLES TRIPLETS

6 …three further residual types were added

7 A total of 700 polynomial fits to residual distributions like… Functional forms of residual distributions for 3D rigid body misalignments:

8 The two fits to one shingle regionThe two fits to each of two triplet regions (one triple on left, the other on right) The above shingle conforms very well to the predicted functional forms Vertical scatter is due to the intrinsic spatial hit resolution of the CCDs Removal of outlayers is shown by the red circles on the triplet fits

9 Internal Alignment Matrix Equation I Weight matrix – determined to an extremely good approximation from the known ideal geometry The residual fits involve a large number of related simultaneous linear equations in the unknown alignment parameters; these are organised into a single matrix equation Coefficients measured in residual fits Alignment corrections to be determined

10 Singular Value Decomposition m x n m x m othogonal m x n diag. n x n orthogonal s 1 …s r are called the ‘singular values’ of matrix A; s i ~ 0 corresponds to a singularity of A Here’s the SVD trick: define the inverse A + = VS + U T with S + = with 1/s i = 0 if s i ~ 0.1/s 1. 1/s /s r Then if Ax = b (for vectors x,b) The solution x 0 = A + b is such that:| Ax 0 – b | has minimum length That is, the SVD technique gives the closest ‘least squares’ solution for an over-constrained (and possibly singular) system

11 CCD shapes from optical survey Fitted 14-parameter Chebychev polynomial shape, as well as CCD position, used as rigid body starting point for internal alignment A large number of track residual distributions showed signs of the CCD shapes deviating from the optical survey data. The biggest effects could be described my a 4 th order polynomial as a function of the z axis

12 An arbitrary surface shape can be introduced by setting: δr → δr + f (z) For convenience the base of the CCDs (each 8cm in length) was taken as: z B = (r tanλ)/8

13 With shape parameters included the same residual distributions were fitted to extended higher order functional forms: The required new fit coefficients roughly doubling the total number to 4,160

14 Six examples of the 28 Pair δ rz residual fits (would take quadratic form without shape corrections) Pairs, using Z 0 → μ + μ - Z 0 → e + e - events, were the most limited in statistics. Important to correctly take into account correlations in each fit. tan λ

15 Internal Alignment Matrix Equation II Extra constraints such as δq i = 0.0 ± 5.0 μm used to ensure stable solution. Each of 700 residual fit error matrices used to determine linearly independent basis in each case. The SVD technique is improved from a ‘least squares’ to an optimal χ 2 fit. 866 (9 x ) alignment corrections to be determined

16 ‘Before’ and ‘After’ Triplet Residuals Using optical survey geometry After track-based alignment Post-alignment single hit resolution ~ 3.6 μm Tracks with P > 5 GeV

17 Triplet residual mean as function of φ-dependent index Before Alignment After Alignment Systematic effects < 1μm level ~

18 Pair Residuals rms at Interaction Point (divided by √2 to give single track contribution) Impact Parameter resolution (for full track fit): …design performance achieved

19 Comments for SiD tracker I Singular Value Decomposition – this alignment technique allowed a robust unbiased solution for SLD; but the method is somewhat secondary in that any technique will have similar statistical dependence on the data and geometry. Symmetry of the detector – greatly assists book-keeping and allows comparison of different parts of the detector. Overlap regions – allows devices to be stitched together with favourable lever arm (data α area of overlap). Large devices – obviously better to have a single element than two with an overlap. Alignment is aided by:

20 Comments for SiD tracker II Stability - the geometry (devices and support structure) should be stable with respect to time. Changes due to temperature fluctuations, cycling of magnetic field, ageing under gravity/elastic forces, should be ‘small’; at least over a period of time long enough to collect sufficient track data for alignment. Shape - within reason the shape of the device is irrelevant; only the uncertainty in the shape is important and the ability to describe the shape correction with as few parameters as possible. Making the devices ‘flat’ is somewhat arbitrary; introducing a deliberate bow of around 1% could greatly increase mechanical stability and decrease shape uncertainty without effecting tracking performance. VXD3 alignment: D.J.Jackson, D.Su, F.J.Wickens; NIM A510, 233 (2003)

21 Vertices in VXD3 data overlay of four rφ quadrants IP cm

22

23 Alignment Shape Corrections SOUTHNORTH μmμm LAYER 3 LAYER 2 LAYER 1

24 Single hit resolution δrzδrφδrφ DOUBLETS SHINGLES TRIPLETS PAIRS hit resolution consistently ~ 3.8 μm