Fermi Linux Server Vendor Qualification--Closeout Report 1 Fermi Linux Server Vendor Qualification Project Closeout Report April 30, 2003.

Slides:



Advertisements
Similar presentations
Calera High School Dawn Bone
Advertisements

Computer Room Requirements for High Density Rack Mounted Servers Rhys Newman Oxford University.
RFP vs. IFB A BASIC APPROACH TO THE BID PROCESS – WHEN RFPs or IFBs ARE USED 2010 AASBO Spring Pre-Conference Workshop Rosa Saenz, PGPC, Inc. Bill Munch,
Using Copper Water Loop Heat Pipes to Efficiently Cool CPUs and GPUs Stephen Fried President Passive Thermal Technology, Inc.
MULTICORE PROCESSOR TECHNOLOGY.  Introduction  history  Why multi-core ?  What do you mean by multicore?  Multi core architecture  Comparison of.
The First Microprocessor By: Mark Tocchet and João Tupinambá.
Terms 4 Definitions and Questions. Motherboard The main board of a computer, usually containing the circuitry for the central processing unit, keyboard,
Click Here to Begin. Objectives Purchasing a PC can be a difficult process full of complex questions. This Computer Based Training Module will walk you.
Parts & Functions of a Computer. 2 Functions of a Computer.
7/24/031 Ben Blazey Industrial Vision Systems for the extruder.
MICE Spectrometer Solenoid Update Michael S. Zisman Center for Beam Physics Accelerator & Fusion Research Division Lawrence Berkeley National Laboratory.
21 May 2003 Fermi Linux Server Vendor Qualification--Steven Timm 1 Fermi Linux Server Vendor Qualification HEPiX May 21, 2003 Steven C. Timm.
HS06 on the last generation of CPU for HEP server farm Michele Michelotto 1.
CoolAir Temperature- and Variation-Aware Management for Free-Cooled Datacenters Íñigo Goiri, Thu D. Nguyen, and Ricardo Bianchini 1.
HEPIX - Spring 2015 Tony Wong (BNL).  Yearly purchase cycle of hardware for RACF timed with U.S. gov’t fiscal year (October to September)  Aim for delivery.
How a Computer Processes Data Hardware. Major Components Involved: Central Processing Unit Types of Memory Motherboards Auxiliary Storage Devices.
State of Oklahoma Information Services Division Contracts and Purchasing Unit 1.
Processing Devices.
Bob Thome, Senior Director of Product Management, Oracle SIMPLIFYING YOUR HIGH AVAILABILITY DATABASE.
Practical PC, 7th Edition Chapter 17: Looking Under the Hood
25 Oct HEPiX1 Measurements of Hardware Reliability in the Fermilab Farms HEPix/HEPNT, Oct 25, 2002 S. Timm Fermilab Computing Division.
ROAD ACCIDENT FUND VENDOR BRIEFING SESSION RFP: RAF/ 2012 /00034 Date: 14 January 2013 Time: 11h00.
ROAD ACCIDENT FUND COMPULSORY BRIEFING SESSION RAF/2014/00008 Date: 24 March 2014 Time: 11:00.
Planning the LCG Fabric at CERN openlab TCO Workshop November 11 th 2003 CERN.ch.
30-Jun-04UCL HEP Computing Status June UCL HEP Computing Status April DESKTOPS LAPTOPS BATCH PROCESSING DEDICATED SYSTEMS GRID MAIL WEB WTS.
AUTHORS: STIJN POLFLIET ET. AL. BY: ALI NIKRAVESH Studying Hardware and Software Trade-Offs for a Real-Life Web 2.0 Workload.
Company LOGO High Performance Processors Miguel J. González Blanco Miguel A. Padilla Puig Felix Rivera Rivas.
CD FY09 Tactical Plan Status FY09 Tactical Plan Status Report for Site Networking Anna Jordan April 28, 2009.
Copyright © 2007 Heathkit Company, Inc. All Rights Reserved PC Fundamentals Presentation 27 – A Brief History of the Microprocessor.
Computing and IT Update Jefferson Lab User Group Roy Whitney, CIO & CTO 10 June 2009.
High Performance Computing Processors Felix Noble Mirayma V. Rodriguez Agnes Velez Electric and Computer Engineer Department August 25, 2004.
CADCAM HARDWARE.  The computing system in operation can be compared to a human being in terms of its operating characteristics.
6/26/01High Throughput Linux Clustering at Fermilab--S. Timm 1 High Throughput Linux Clustering at Fermilab Steven C. Timm--Fermilab.
A water-cooling solution for PC-racks of the LHC experiments  The cooling concept  Rack Model  Cooling Test  Rack Performance  Failure Tests  Future.
JLAB Computing Facilities Development Ian Bird Jefferson Lab 2 November 2001.
Infrastructure Improvements 2010 – November 4 th – Hepix – Ithaca (NY)
Electronics Enclosures
Hyper Threading Technology. Introduction Hyper-threading is a technology developed by Intel Corporation for it’s Xeon processors with a 533 MHz system.
Commodity Node Procurement Process Task Force: Status Stephen Wolbers Run 2 Computing Review September 13, 2005.
Chapter 17 Looking “Under the Hood”. 2Practical PC 5 th Edition Chapter 17 Getting Started In this Chapter, you will learn: − How does a computer work.
Phase II Purchasing LCG PEB January 6 th 2004 CERN.ch.
11 January 2005 High Performance Computing at NCAR Tom Bettge Deputy Director Scientific Computing Division National Center for Atmospheric Research Boulder,
IDC HPC User Forum April 14 th, 2008 A P P R O I N T E R N A T I O N A L I N C Steve Lyness Vice President, HPC Solutions Engineering
MULTICORE PROCESSOR TECHNOLOGY.  Introduction  history  Why multi-core ?  What do you mean by multicore?  Multi core architecture  Comparison of.
Goddard Space Flight Center Cryogenics and Fluids Branch Status of the AMS-02 Cryocooler January 2007 TIM.
November 1, 2000HEPiX/HEPNT FERMI SITE REPORT Lisa Giacchetti.
A Silvio Pardi on behalf of the SuperB Collaboration a INFN-Napoli -Campus di M.S.Angelo Via Cinthia– 80126, Napoli, Italy CHEP12 – New York – USA – May.
ClinicalSoftwareSolutions Patient focused.Business minded. Slide 1 Opus Server Architecture Fritz Feltner Sept 7, 2007 Director, IT and Systems Integration.
The System Unit What is the system unit? p Fig. 4-1 Next  Case that contains electronic components of the computer used to process data  Sometimes.
Activity 1 Review the work from last lesson so that you can explain the following: -What is the purpose of a CPU. -What steps does the CPU take to process.
1 Farm Issues L1&HLT Implementation Review Niko Neufeld, CERN-EP Tuesday, April 29 th.
ATCA COOLING PROJECT INTERSHIP FINAL PRESENTATION Piotr Koziol.
Central Processing Unit (CPU) The Computer’s Brain.
10/18/01Linux Reconstruction Farms at Fermilab 1 Steven C. Timm--Fermilab.
Clockless Chips Under the esteemed guidance of Romy Sinha Lecturer, REC Bhalki Presented by: Lokesh S. Woldoddy 3RB05CS122 Date:11 April 2009.
Rackable Systems Company Update SWsoft Conference Jeff Stilwell – Sr. Director of Systems Engineering.
© 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice ProLiant G5 to G6 Processor Positioning.
Hardware Architecture
CERN Disk Storage Technology Choices LCG-France Meeting April 8 th 2005 CERN.ch.
FY2006 Acquisition at Fermilab Don Holmgren LQCD Project Progress Review May 25-26, 2006 Fermilab.
Chapter 17 Looking “Under the Hood”
CPU Central Processing Unit
E-Bid Book Seminar II JCIHK Award Program th August 2014
Super Computing By RIsaj t r S3 ece, roll 50.
Hardware September 19, 2017.
ROAD ACCIDENT FUND COMPULSORY BRIEFING SESSION RAF/2014/00008
Week 3 The Components of the System Unit
Effect of Using 2 TE units on Same Heat Sink
Arto Kokkinen ESTAT, unit C.2
Chapter 17 Looking “Under the Hood”
Presentation transcript:

Fermi Linux Server Vendor Qualification--Closeout Report 1 Fermi Linux Server Vendor Qualification Project Closeout Report April 30, 2003

Fermi Linux Server Vendor Qualification--Closeout Report 2 Executive Summary Technical evaluation of 1U dual Xeon units is complete 18 vendors identified as technically qualified Next step is price/performance bid. Requisition for 48 nodes in division approval now. Will weed down vendors to five.

Fermi Linux Server Vendor Qualification--Closeout Report 3 Chronology We made contact with 45 vendors in all. 29 vendors attended Jan 28. info meeting 24 vendors submitted acceptable configuration on Feb vendors submitted acceptable benchmarks and were cleared to ship unit on Mar. 4—all got it here by Mar vendors identified as technically qualified

Fermi Linux Server Vendor Qualification--Closeout Report 4 Procedure Software check – Most points evaluated from benchmark results vendors submitted by before units arrived. Hardware check: – All units opened, checked for quality construction and correct configuration. Pictures taken of all – Electrical and thermal measurements – One vendor disqualified for shoddy construction and bad service explanation of why it was that way.

Fermi Linux Server Vendor Qualification--Closeout Report 5 Electrical Electric current measured with ammeter at startup, idle, and full CPU load. Current draw ranges: 2.4GHz, A, 2.8 GHz, A, 3.06GHz, A Likely that with purchase of 2.8 or 3.06GHz machines we can only have seven machines per circuit, not eight as in the past. Those with higher current draw also tend to have more fans and be better internally cooled. Bright side—This current similar to 750MHz machines bought 3 years ago, 2.5x the performance for the same current. Table in the final report.

Fermi Linux Server Vendor Qualification--Closeout Report 6 Thermal Measured  T from front to back of unit for all. Used internal temperature probes on each unique type of case. All units in evaluation much cooler than the 1U units bought in FY2002. Due to better thermal characteristics of Intel chip and many more added internal fans and blowers. Still analyzing the data we took but confident that all units are acceptable.

Fermi Linux Server Vendor Qualification--Closeout Report 7 Performance 3 CPU speeds measured, 2.4, 2.8, 3.06 GHZ, 1000 FermiCycles=PIII 1 GHz. Approximate performance, 1779,2041,2223 Fermi Cycles respectively. 400MHZ vs 533 MHz front side bus is 2.5% effect for farms software, much bigger for QCD. AMD MP Fermi Cycles Performance is projected to faster clock speeds in anticipation that some vendors will bid faster chips.

Fermi Linux Server Vendor Qualification--Closeout Report 8 Service All had at least one hardware call and one software call. One vendor disqualified because primary service provider listed wouldn’t show up One vendor disqualified due to excessive downtime of machine.

Fermi Linux Server Vendor Qualification--Closeout Report 9 Rack mount proposal Rackmount proposals evaluated for all Most still using conventional front-to-back cooling, standard rack. Several feature tool-free rails

Fermi Linux Server Vendor Qualification--Closeout Report 10 Conclusions 18 technically qualified vendors—in alphabetical order Ace, Angstrom, APPRO, ASA, Aspen, Atipa, Concentric, Dell, HP, IBM, Koi, Penguin, Promicro, PSSC, Rackable, Racksaver, Richardson, Western Scientific Price/performance bid will weed them down to five. All technically qualified vendors will be remembered if some of the top five fail to perform, or if special capabilities, such as AMD, desktops, or blades, are needed. Requisition for 48 nodes is at division (32 farms, 16 FNALU). 21 vendors is too many to bring in, will be more discriminating next time.

Fermi Linux Server Vendor Qualification--Closeout Report 11 Future plans Next evaluation is an evaluation for blade servers, will start in late summer.

Fermi Linux Server Vendor Qualification--Closeout Report 12 Thanks to: Taskforce members: Steven Timm, Margaret Greaney, Stan Naymola, Troy Dawson, Bruce Karrels, Lance Weems, Hans Wenzel, Bob Forster, Phil Lutz, Gerry Bellendir, Adam Walters, Mark Kaletka Other CD support staff (PREP, DCI) who helped get units in and out