1H’09 Public Roadmap 111 Intel ® Public Roadmap 1H’ 2009

1H’09 Public Roadmap 222 Public Roadmap Desktop Platform 1H’ 2009

Intel Confidential—NDA Platform Roadmap 1H’09 Public Roadmap Extreme Best Better Intel ® Core™ i7 Processor Extreme Edition Codename: Tylersburg DT platform Intel ® X58 Express Chipset - 2x16 or 4x8 graphics Intel ® G45 & P45 Express Chipsets Intel ® Core™2 Duo Processor E8xxx & E7xxx series Codename: Boulder Creek platform Intel ® G45, G43, & P43 Express Chipsets Intel® G31/P31 Express Chipsets Intel ® Core™2 Quad Proc. Q9xxx &Q8xxx series Codename: Boulder Creek platform Intel ® Pentium ® & Celeron ® Proc. Intel ® G41 Express Chipset Q1’09 Q2’09 Desktop Processor: Roadmap Intel ® Core™ i7 Processor Codename: Tylersburg DT platform Intel ® X58 Express Chipset - 2x16 or 4x8 graphics Consumer Platforms 1H’09 Good

Intel Confidential—NDA Platform Roadmap 1H’09 Public Roadmap44 Best Intel ® Core ™ 2 Quad & Duo proc. Q9000,E8000 series 2 Intel ® Q45 Express Chipset w/ICH10DO, Intel® TPM Business Security: Microsoft NAP, Access Monitor Proactive IT Care: Intel ® Standard Manageability plus: Fast Call for Help, Remote Schedule Maintenance, Remote Alerts, DASH Intel ® vPro Tech. for 2009 Q1’09 Q2’09 Better Good Intel ® G31 Express Chipset Intel ® G41 Express Chipset Intel ® Pentium ® processor 1 *Qualification window begins at platform launch and continues for 3 months. **Deployment begins at the end of the Qualification window and continues for 12 months. 1Intel ® Pentium® dual-core proc not SIPP eligible. 2.Check the feature set reference table for vPro and SIPP CPU details. 3.Intel Std. Manageability and Intel AMT support WS-MAN and DASH Intel ® SIPP Deploy 2008/2009 Platform** Intel ® Core™2 Duo Proc. E8000 series Intel ® Q43 Express Chipset w/ICH10D, Intel ® TPM Intel ® Standard Manageability Intel ® SIPP - Manageability Upgrade Available Upgradeable Intel ® B43 Express Chipset w/ICH10D Desktop Platform: Roadmap Business Platforms 1H’09

555 Public Roadmap Intel ® Mobile Platform 1H’08-1H’09

666 Consumer Mobile Platforms: Roadmap 1H’08-1H’09 Extreme Performance Entry Intel ® Core™2 Extreme X9000 Intel ® Centrino ® processor technology Featuring Intel ® Core™2 Duo T9500, T9300, T8300, T8100 Intel ® Celeron ® processors 570, 560, 550, 540, 530 Mobile Intel ® GM965, GL960 Express chipsets with ICH8M Mobile Intel ® GM965, PM965 Express chipsets with ICH8M or ICH8M-Enhanced Intel ® Wireless WiFi Link 4965AGN or AG, or 3945ABG Intel ® Core™2 Extreme QX9300, X9100 Intel ® Centrino ® 2 processor technology Featuring Intel ® Core™2 Quad Q9100, Q9000 Featuring Intel ® Core™2 Duo T9800, T9600, T9550, T9400, P9600, P9500, P8700, P8600, P8400 Intel ® Core™2 Duo processors: Low-Voltage and Ultra Low-Voltage L7700, L7500 U7700, U7600 ‘Santa Rosa Refresh’ ‘Montevina’ 1H’08 2H’08-1H’09 Intel ® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low- Voltage SP9400, SP9300 SL9400, SL9300 SU9400, SU9300, SU3300* ‘Santa Rosa/ Santa Rosa Refresh’ ‘Montevina’ Mobile Intel ® GM45, PM45 Express chipsets with ICH9M or ICH9M-Enhanced Intel ® Wireless WiFi Link 5000 Series Intel ® Celeron ® processors T1700, T1600, 585, 575, 723 Mobile Intel ® GM45, GL40 Express chipsets with ICH9M ‘Santa Rosa’ ‘Montevina’ *Intel ® Core TM 2 Solo processors are eligible for Centrino ® branding only

777 Best Better ‘Santa Rosa Refresh’ ‘Montevina’ Mobile Intel ® GM965, PM965 Express Chipsets with ICH8M or ICH8M-Enhanced Intel ® Wireless WiFi Link 4965AGN or AG, or 3945ABG Extreme Business Mobile Platforms: Roadmap 1H’08-1H’09 Q2’08 2H’08-1H’09 Mobile Intel ® GM965 & PM965 Express Chipsets with ICH8M– Enhanced Intel ® Wireless WiFi Link 4965AGN or AG Intel ® 82566MM Gigabit Network Connection Intel-optimized adv. management & security solutions with Intel ® AMT v2.5 & VT 1H’08 Intel ® Core™2 Extreme X9000 Intel ® Centrino ® with vPro TM technology Featuring Intel ® Core™2 Duo T9500, T9300, T8300, T8100 Intel ® Centrino ® 2 with vPro TM technology Featuring Intel ® Core™2 Duo T9800, T9600, T9550, T9400, P9600, P9500, P8700, P8600, P8400 Intel ® Core™2 Duo processors: Low- Voltage and Ultra Low-Voltage L7700, L7500 U7700, U7600 Intel ® SIPP Intel ® Centrino ® processor technology Featuring Intel ® Core™2 Duo processors Intel ® Centrino ® 2 processor technology Featuring Intel ® Core™2 Duo processors Deploy 2007 Platforms Deploy 2008 platforms Intel ® Core™2 Extreme QX9300, X9100 Intel ® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low-Voltage SP9400, SP9300 SL9400, SL9300 SU9400, SU9300 Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M Enhanced Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced Intel® 82567LM Gigabit Network Connection Intel® Wireless WiFi Link 5000 Series Intel® AMT 4.0, Intel® Anti-Theft Technology, Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology Mobile Intel ® GM45, PM45 Express Chipsets with ICH9M or ICH9M-Enhanced Intel® Wireless WiFi Link 5000 series

888 Public Roadmap Intel ® Server Platform Group (SPG) 2009

99 * Other names and brands may be claimed as the property of others. Copyright © 2008, Intel Corporation. Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. ALL PRODUCTS, COMPUTER SYSTEMS, DATES, AND FIGURES SPECIFIED ARE PRELIMINARY BASED ON CURRENT EXPECTATIONS, AND ARE SUBJECT TO CHANGE WITHOUT NOTICE. THIS INFORMATION IS PROVIDED “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. THE HARDWARE VENDOR REMAINS SOLELY RESPONSIBLE FOR THE DESIGN, SALE AND FUNCTIONALITY OF IT’S PRODUCT, INCLUDING ANY LIABILITY ARISING FROM PRODUCT INFRINGEMENT OR PRODUCT WARRANTY. INTEL, INTEL XEON, INTEL CORE 2 DUO, INTEL CORE 2 QUAD, INTEL CORE 2 EXTREME, THE INTEL LOGO, INTEL CORE MICROARCHITECTURE ARE TRADEMARKS OR REGISTERED TRADEMARKS OF INTEL CORPORATION OR ITS SUBSIDIARIES IN THE UNITED STATES AND OTHER COUNTRIES. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See for details. Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications enabled for virtualization technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and software configurations. Virtualization technology-enabled BIOS and VMM applications are currently in development. “Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel® Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here here Lead-free: 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU RoHS exemptions for lead may apply to other components used in the product package. Halogen-free: Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine. This slide MUST be used with any slides removed from this presentation

Risk Factors 10 Intel’s Roadmap Update presentations may contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our recent Earnings Release and Form 10-Q for more information on the risk factors that could cause actual results to differ.

2 Intel ® Itanium ® PlatformBoxboro-MC Platform (Mid ‘09) Server Platform Roadmap Mission Critical (MC) Platform 2009 Mission Critical Intel ® Itanium ® processor 9100 series Intel ® E8870 chipset — 400FSB, Intel ® 82801DB (ICH4), 82546GB Technologies FSB 667, DDR2-667, Dual-Core, Hyper- Threading Technology, Intel ® Virtualization Technology, Intel ® Cache Safe Technology. IA-64, Demand Based switching, Core Level Lockstep Tukwila-MC processor Boxboro-MC Chipset Technologies Quad-Core, Intel ® QuickPath Interconnect, Dual Integrated Memory Controllers All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Q1 ’09Q2 ’09 Q3 ’09Q4 ’09 Q2 ’09 Q1 ’09 Q3 ’09 Q4 ’09

12 Tylersburg-EP Platform Server Platform Roadmap Efficient Performance(EP) Platform 2009 Efficient Performance Two Socket All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. 1.Lead and Halogen free kit includes Intel ® Xeon ® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, Some E.U. RoHS exemptions may apply to other components used in the product package. Nehalem-EP Processor Tylersburg -36D, -24D Chipset Technologies Quad-Core / Dual Core DDR3 1333/1066/800 memory Intel ® Turbo Boost Technology, Intel ® VT Intel ® QuickPath Interconnect (QPI) Intel ® Hyper-Threading Technology Lead and halogen free platform kit 1 Q1 ’09Q3 ’09Q4 ’09Q2 ’09

13 Caneland Platform Server Platform Roadmap Expandable Platform (EX) 2009 Expandable All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Q1 ’09Q3 ’09Q4 ’09 * Q2 ’09 Intel ® Xeon ® processor 7400 series 45 nm 6-core (Dunnington) (shipping) Intel ® Xeon ® processor 7300 series Intel ® Xeon ® processor 7200 series Intel ® 7300 Chipset Enabled chipsets -4P/8P+ platforms Technologies Quad-Core, Dual-Core, Intel ® Core™ MicroArchitecture, FBD Memory, Intel ® VT, Next Generation Intel ® I/O AT, Snoop Filter * Nehalem-EX processor on Boxboro-EX platform targeted for production in Q4 ‘09

14 Tylersburg-EN Platform Server Platform Roadmap Entry Platform (EN) 2009 Entry Two Socket * Lynnfield processor based platform production targeted for 2H ’09 1 Halogen free kit includes Intel ® Xeon ® family CPU, Intel® Chipsets, and Intel® LAN components. Lead free kit includes Intel ® Xeon ® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, Some E.U. RoHS exemptions may apply to other components used in the product package. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel ® Xeon ® processor 5400 series Intel ® Xeon ® processor 5200 series Intel ® 5000V Chipset (Blackford) Nehalem-EN Processor Tylersburg -24D Chipset Technologies Quad-Core / Dual Core, DDR3 memory, Turbo Mode, Intel ® VT, Intel ® QuickPath interconnect, Intel ® Hyper- Threading Technology (SMT), Lead and halogen free platform kit 1 Entry One Socket Garlow Platform Cranberry Lake Platform Bensley-VS Platform Intel ® Xeon ® processor 5400 series Intel ® Xeon ® processor 5200 series Intel ® 5100 Chipset (San Clemente); Intel ® Xeon ® processor 3300 series Intel ® Xeon ® processor 3100 series Intel ® Xeon ® processor 3200 series Intel ® Xeon ® processor 3000 series Intel ® 3210/3200 Chipset Technologies Dual-Core/Quad-Core Intel ® Core™ Microarchitecture, Lead and halogen free processors starting in 2H’08 (3300/3100 series) Lynnfield Processor Ibex Peak Chipset 2009 Platform * 1H ‘092H ‘09

15 Tylersburg-WS Platform Server Platform Roadmap Workstation Platforms (WS) 2009 Workstation Two Socket 1.Lead and Halogen free kit includes Intel ® Xeon ® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, Some E.U. RoHS exemptions may apply to other components used in the product package. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Nehalem-EP Processor Tylersburg -36D Chipset Technologies Quad-Core / Dual Core, DDR3 1333/1066/800 memory, Intel ® Turbo Boost Technology, Intel ® VT, Intel ® QuickPath interconnect, Intel ® Hyper-Threading Technology, Lead and halogen free platform kit 1 Workstation One Socket Nehalem –EP Processor Tylersburg -36S Chipset Technologies Intel ® QuickPath interconnect Lead and halogen free platform kit 1 Intel ® Core™2 Extreme QX9650 Intel ® Core™2 Quad Q9000 Intel ® Core™2 Duo E8400 Intel ® X38 Chipset Technologies Quad-Core, Dual-Core, 1333 FSB Intel ® Core™ Microarchitecture; Q2 ’09Q1 ’09Q3 ’09Q4 ’09 Garlow-WS Platform