UCSC August 12, 2008 U.S. Upgrade R&D Meeting: Strip Detector  Seiden

UCSC August 12, 2008 Goals for Meeting  Evaluate and discuss progress on all aspects of the strip upgrade project.  Make sure that we are properly focused on the work that is required. In particular need to make significant progress prior to meeting in Nikhef first week in November. Are all key areas covered?  Begin discussion on how we will actually do a construction project and its schedule.

UCSC August 12, 2008 Projected U.S. Activities on New Inner Detector Pixels  Lead role in the design of the front-end integrated circuit, contribution to the fabrication costs and production testing. The U.S. is currently leading the R&D effort in this area.  Common design of powering and data transmission with the silicon strip detector, fabrication and test of unique elements of these systems for pixels, and integration of these elements in sub-assemblies in the U.S. The U.S. had the co-lead role for optical readout for the current pixel detector and has, in addition, substantial experience in this general area, for both new powering schemes and data transmission.  Development of 3D and planar silicon sensors, contribution to the fabrication costs and production testing. The concept for 3D sensors originated in the U.S. The U.S. has a strong role in the development of planar sensors (for the outer pixel layers) and there is substantial commonality with similar activities for silicon strip detectors.  Module design, fabrication and testing. The U.S. currently co-leads the R&D effort in this area, has a very strong track record and this is an area in which many U.S. university and laboratory groups have expertise.  Design and fabrication of local mechanical/cooling structures and overall support structures. The U.S. had the lead role in this for the current detector and co-leads the current R&D in this area. We anticipate greater contributions from non – U.S. groups in this area for the SLHC, particularly assuming the lead role for services and related supports that were done solely in the U.S. for the present detector.  Mounting and testing modules on local supports and fabrication and test of sub-assemblies e.g. barrels and/or disks. Fabrication and test of significant sub-assemblies outside CERN is essential to meet schedule and practical requirements.  Contributions to integration and installation at CERN.

UCSC August 12, 2008 Projected U.S. Activities on New Inner Detector Silicon Strips  Leading role in the definition and implementation of the overall electronics architecture, including design contributions to specific elements. The definition of the overall SLHC electronics architecture (for strips and pixels) is currently being co-led by the U.S.  Contribution to the procurement of front-end integrated circuits and local control integrated circuits. Testing of integrated circuits. This follows naturally from the role in defining the overall electronics architecture.  Common design of powering and data transmission with the pixel detector, fabrication and test of unique elements of these systems.  Development of planar sensors (in common in part with pixels), contribution to procurement costs and testing as part of a module assembly program in the U.S.  Assembly and test of silicon strip modules. This would occur in a well coordinated manner at multiple U.S. institutions.  Fabrication of local supports for silicon strip modules. The U.S. is currently leading the conceptual design of the preferred technique for holding, locating and cooling strip modules and fabrication of a fraction of these local supports in the U.S. would naturally follow.  Design and contribution to the global support structures, primarily in the barrel region. Again the U.S. is currently leading this effort and it is also closely tied to the design of the local supports.  Mounting and testing modules on local supports. It is essential that integrated structures be assembled world-wide and shipped to a central point (likely CERN) for final rapid integration into support structures to meet the SLHC schedule constraints.  Contributions to integration and installation at CERN.

UCSC August 12, 2008 Possible Schedule: Construction Project CD0 Review Scheduled for September 11 in Washington. Present following schedule. Activity Start Date End Date Engineering 6/1/10 5/31/11 Pre-production 6/1/11 5/30/12 Parts Production 5/2/12 9/30/14 Build-up Modules 10/1/13 9/30/15 Assemble/Test Structures 10/1/15 9/30/16 Installation 10/3/16 3/30/18