AIDA is co-funded by the European Commission within the Framework Programme 7 Capacities Specific Programme, Grant Agreement 262025 WP4: Relation with.

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Presentation transcript:

AIDA is co-funded by the European Commission within the Framework Programme 7 Capacities Specific Programme, Grant Agreement WP4: Relation with industry Report Second AIDA annual meeting LNF, April 2013 Advanced European Infrastructures for Detectors at Accelerators 1

AIDA is co-funded by the European Commission within the Framework Programme 7 Capacities Specific Programme, Grant Agreement Past events Academia-industry matching event SiPM PSSSD MPGDs 3D-IC Advanced European Infrastructures for Detectors at Accelerators 2

Events characteristics SiPM –Very technology-specific  Photosensor –High Technology Readiness Level (TRL) PSSSD –Wider focus  Medipix, Pilatus, Bumpbonding, etc. –High TRL MPGDs –HEP technology –Low TRL  not manufactured by Industry 3D Interconnections –Very technology-specific TSV SLID Interposers –Low TRL 3 Second AIDA annual meeting of April 10 th -12 th

SiPM Participation 101 attendees from 40 institutions Austrian Acad Sci CERN CIEMAT CNRS-IN2P3 CPAN CSIC DESY EPFL ETHZ FBK FNAL Forschungszentrum Julich GmbH GSI IFAE INAF INFN Kernfys Versneller Inst MPI PSI Rhein Westfal TH Aachen UERJ Univ AGH Sci & Technol Univ Bari Univ Gent Univ Glasgow Univ Heidelberg Univ Insubria Univ Leicester Univ Louvain KU Univ Michigan Univ Napoli Federico 2 Univ Oxford Univ Pisa Univ Politecn Bari Univ Roma 1 Univ Siena Univ Surrey Univ Tech Delft NTUA Univ Udine 29 attendees from 23 companies AdvanSiD Atostek_Ltd AXINT Bruker_AXS CAEN_SpA CPTA_Moscow CSEM djh consult e2v_technol Excelitas_Tech_Inc Gamma_Medica_Ideas_Inc Hamamatsu_Photonics ID_Quantique_SA INOV_INESC_Inovacao KETEK_GmbH kromek? Philips_Corp Photek_Ltd Pulsar_Enterprise Raytest SensL STMicroelectronics Zecotek_Photonics_Inc Second AIDA annual meeting of April 10 th -12 th participants

Positioning the event (SiPM)

PSSSD Participation 68 attendees from 25 institutions Academy of Sciences of the Czech Republic Bulgarian Academy of Sciences Catholic University of Louvain CEA/Irfu Saclay CERN CNM-Barcelona CNRS - IN2P3 – LAL CPAN DESY IFCA (CSIC) INFN Institute of High Energy Physics, Wien Institute of Nuclear Physics of Poland KIT - Karlsruhe Institute of Technology Max-Planck-Institut fur Physik Munich MRC Laboratory of Molecular Biology United Kingdom NIKHEF Oxford University Tomsk Polytechnic University University of Barcelona University of Bonn University of Cantabria University of Hamburg University of Otago VTT 18 attendees from 15 companies ALIBAVA Systems Amsterdam Scientific Instruments BV Baltic Scientific Instruments CAEN SpA Canberra Dectris Ltd. Infineon Technologies iseg Spezialelektronik GmbH KETEK GmbH Kromek Ltd Philips Digital Photon Counting Photek LTD SEMIKON Detector GmbH Struck Innovative Systeme GmbH Technology Transfer Agency Techtra Sp. z o.o. Second AIDA annual meeting of April 10 th -12 th 6 86 participants

Positioning the event (PSSSD)

MPGD Participation 57 attendees from 19 institutions ANR BNL CEA CERN CNM-CSIC CNRS-IN2P3 GSI ILL INFN NTUA PSI TERA foundation Univ Antonio Narino Univ Bonn Univ Tokyo Univ Virginia Univ Napoli Univ Mascara Univ Savoie 13 attendees from 9 companies Blue Now Bodycote Techmeta CAEN DJH Consulting ELTOS Spa ELVIA CIREA EOS Imaging ITEST Physical Instrument Second AIDA annual meeting of April 10 th -12 th 8 70 participants

3D Participation 77 attendees from 28 institutions Academy of Sciences Czech Republic Austrian Acad Sci CEA CERN CMP CNRS/IN2P3 DESY FNAL Fraunhofer IZM GSI HEPTech IFJ PAN CSIC INFN Institute of Physics, Prague IMEC KTH Royal Institute of Technology MPI NTUA STFC Universite de Geneve Universite de Paris-Sud 11 - LAL University of Bergen University of Heidelberg University of Liverpool University of Manchester Universität Bonn 14 attendees from 13 companies Advacam Belletech Dectris EMFT IBM IPDiA KETEK GmbH micron semicond Philips Corp Printech Circuit Laboratories Ltd Tezzaron Semiconductor Tohoku-MicroTec Co., Ltd TTA Techtra Second AIDA annual meeting of April 10 th -12 th 9 91 participants

Invitation strategy for the AIME (3D) Search for industrial (290) and academic (181) organisations active in –TSV –SLID –Interposers Contacted all key-players worldwide –(IBM, Tezzaron, Intel, EMC-members, TI, etc.) Invited all European companies (46) and institutions (65) Second AIDA annual meeting of April 10 th -12 th

Positioning the event (3D) (Contacted all european companies)

2014 Event Topic Criteria –Community requirements to Industry Example: SiPM –Deployment of technology Example: PSSSD  Medipix, Pilatus –Pressing industrial needs from WP Production (example: SiPM, MPGD) Joint R&D (example: MPGD) –Community is strongly depending on Industrial availability of the technology Example: 3D-IC 12