HP BladeSystem c7000 Enclosure Evolution October 2014 Speaker name / Title

c7000 Enclosure Evolution Overview5 Standard Features: 16 HH/8 FH blade bays 6 Hot-plug power supply bays (N+1, N+N) 8 I/O interconnect bays (4 redundant fabrics) 10 Hot-plug fan bays with redundancy All c-Class G1 through Gen9 ProLiant and Integrity server blades3,4 All power input modules and power supplies3 Redundant OA option c7000 Enclosure Evolution Overview5 Initial Offering 4XXXXX-B21 Initial Update 4XXXXX-B22, -B23 RoHS Enclosure 5XXXXX-B21, 68661X-B21 Platinum Enclosure 6XXXXX-B211, 7XXXXX-B21 3Q-2006 3Q-2007 2Q- 2009 1Q-2013 2018 4Tb/s Midplane 10GbE 4Gb/8Gb FC 4xDDR IB 3Gb SAS 2250W AC, 2250W 48VDC power2,3 1Phase/3Phase 200-240AC, 48VDC input modules2,3 100Mb/s OA connectivity 3” display (from 2”) 2400W Gold power supply (4Q08)2,3 RoHS compliance 5Tb/s Midplane (25% increase), improved signal integrity; adds: 20GbE 4xQDR IB, 4xFDR IB (1 port/server) 6Gb SAS 2400W Platinum power supply (2Q10)2,3 1Gb/s OA connectivity Limited distribution with Platinum enclosure midplane (SKUs 68661X-B21) 7Tb/s Midplane (40% increase), improved signal integrity; adds: 16Gb FC 4xFDR IB (>1 port/server) 1Phase intelligent input module Location Discovery Services 2650W Platinum power supply (2Q13)2,3 High voltage power solution (3Q14)2,3 Except 68661X-B21. Although introduced with this enclosure, this item is supported on all enclosures. See back-up slides for more information. The enclosure OA firmware must be at a level to support all components within the enclosure. Server generation mixing within an enclosure is allowed subject to the support requirements of the Onboard Administrator. See back-up slides for more information. All information applies to the commercial-grade/non-NEBs c7000 enclosures. Key points: All information applies to the commercial-grade/non-NEBs c7000 enclosures. For carrier-grade/NEBs c7000 enclosure option compatibility, please contact the HP Telco group. All c7000 enclosures support all c-Class G1 to Gen9 ProLiant and Integrity server blades. Server generation mixing within an enclosure is allowed subject to the support requirements of the Onboard Administrator. See the back-up slides for OA and VC firmware support information by server blade and server generation mixing support. New power supplies with increased efficiency and capacity have been steadily introduced. All power supplies and power input modules are supported on all c7000 enclosures (see backup slides for additional details). All power supplies must be identical; a mix of different power supplies is not supported except during hot swap upgrades to different level and/or efficiency power supplies. Midplane bandwidth (with improved signal integrity) has increased significantly allowing for higher speed I/O fabrics (see next slide). The Platinum enclosure provides the greatest leap in midplane bandwidth, support I/O fabrics, and additional features (more details are listed in a following slide). The OA firmware must be a version that supports all the components in the enclosure. HP BladeSystem c-Class life cycle has been extended to at least 2018 (see a following slide for more details).

c7000 Enclosure Midplane Enhancements Platinum Enclosure 7Tb/s 5Tb/s 4Tb/s 40% Adds: 16Gb FC 4xFDR IB (56Gb), >1 port RoHS Enclosure Bandwidth 25% Initial Offering Initial Update Adds: 20GbE 4xQDR IB (40Gb) 4xFDR IB (56Gb), 1 port 6Gb SAS 10GbE 8Gb FC 4xDDR IB (20Gb) 3Gb SAS No midplane change Key Points: The midplane bandwidth has increased twice starting with 4Tb/s to 5Tb/s (25% increase) and then the current shipping Platinum enclosure at 7Tb/s (40% increase) with an overall change of 75% (4Tb/s to 7Tb/s). Allowing for faster I/O fabric speeds, both the RoHS and Platinum enclosures have updated midplanes that have improvements in both lane speed and signal integrity. The signal integrity improvements are just as important as the lane speed improvements to provide support for the faster I/O fabrics. Signal integrity improvements include items such as better PCB material, blade connector reduction in crosstalk, and enhanced mezzanine connectors. The I/O fabrics and their speeds listed for each enclosure (for example 10GbE, 4Gb/8Gb FC, etc for the initial offering) are the fabrics and speeds supported across the midplane. This is the interconnect downlink speed (blade bay to interconnect bay speed). It is not the interconnect uplink speed which is the speed of the interconnect’s external uplink ports (a speed that can be higher than the downlinks). For example, a 10/20Gb Ethernet interconnect switch module may have 10GbE downlinks to the server, but faster 20GbE uplink ports for connection to the customer’s network Midplane bandwidth provided for each enclosure (for example 4Tb/s for the initial offering) is calculated using the blade bay to interconnect bay signal paths. It does not include additional traffic capacity between interconnect modules (interconnect crosslinks) and blade bay to blade bay crosslinks. For the initial offering and the update to the initial offering, the 4Tb/s is calculated as follows: 8Gb/s per blade bay to interconnect bay lane x 16 lanes per blade bay x 16 blade bays per enclosure x 2 directions for duplex = 8 x 16 x 16 x 2 = 4,096Gb/s = 4Tb/s. For the RoHS enclosure, the 5Tb/s is calculated as follows: 10Gb/s per blade bay to interconnect bay lane x 16 lanes per blade bay x 16 blade bays per enclosure x 2 directions for duplex = 10 x 16 x 16 x 2 = 5,120Gb/s = 5Tb/s. For the Platinum enclosure, the 7Tb/s is calculated as follows: 14Gb/s per blade bay to interconnect bay lane x 16 lanes per blade bay x 16 blade bays per enclosure x 2 directions for duplex = 14 x 16 x 16 x 2 = 7,168Gb/s = 7Tb/s. The additional traffic not included in the above numbers is: Interconnect crosslinks (communication paths between interconnect modules): 10Gb per interconnect bay to interconnect bay lane x 4 lanes between each pair of interconnect bays x 4 interconnect bay pairs x 2 for duplex = 10Gb x 4 x 4 x 2 = 320Gb. Blade bay crosslinks (communication paths between blades): 4Gb (4x PCIe Gen2) per blade bay to blade bay lane x 4 lanes between each pair of blade bays x 8 blade bay pairs x 2 for duplex = 4Gb x 4 x 8 x 2 = 256Gb. 3Q06 3Q07 2Q09 1Q13

HP BladeSystem c7000 Platinum Enclosure Improvements over previous RoHS enclosure Enhanced fabric capabilities 40% increase in midplane bandwidth Enhanced midplane signal integrity 2x storage bandwidth with 16Gb Fibre Channel Multi-lane 56Gb 4xFDR InfiniBand Intelligent infrastructure 2650W Platinum Hot Plug Power Supply (80Plus Platinum certified) Single Phase - Intelligent Power Module Location Discovery Services The NonStop signal midplane in the Platinum enclosure supports signal rates of up to 14 gigabits per second (Gb/s) per lane (each lane consists of four SerDes transmit/receive traces). Each half-height device bay (i.e. server bay) has 16 lanes delivering the total bandwidth of 224 Gb/s per device per direction or 7Tb/s (16 x 224Gb/s) for all 16 server bays. Note: In a blade enclosure, the aggregate bandwidth is calculated using the bandwidth between device bays and interconnect bays. It does not include additional traffic capacity between interconnect modules (interconnect crosslinks), device bay to device bay crosslinks, and management signals. The additional bandwidth plus improved signal integrity allows for 16Gb Fibre Channel and multi-lane 4xFDR (56Gb) InfiniBand. Along with the NonStop midplane improvements, the Platinum enclosure introduced an Intelligent Infrastructure with (see following slide): The 80Plus certified 2650W Platinum power supply option. The intelligent power input module option providing Power Discovery Services. Location Discovery Services built-in the Platinum enclosure chassis.

Innovations in Intelligent Infrastructure Platinum Power Supplies 94% efficient 80Plus certified1 Power Discovery Services Eliminate power configuration errors and precisely track power usage2 Location Discovery Services Optimize workload placement with servers that self-identify and inventory Improved efficiency reducing cost per enclosure Minutes vs. hours to deploy power Eliminate manual error prone inventory tracking See www.80plus/org Supported with the single phase intelligent power input module

HP 2650W Hot Plug Power Supply Designed for enhanced configurations 10% increase in total enclosure wattage (versus 2400W) Enables higher performance server configurations with N+N power redundancy Available options 733459-B21: HP 2650W Platinum Hot Plug Power Supply 733460-B21: HP 6X 2650W Platinum Hot Plug Power Supply Requirements Onboard Administrator firmware v3.73 or higher Compatible with all enclosures www.80plus.org

c7000 Power Supply Comparison HP 2650W Hot Plug Platinum Power Supply HP 2400W Hot Plug Platinum Power Supply Maximum Output 2650W 2450W Total Enclosure Wattage 15,900W 14,700W Power Efficiency 94% 80 PLUS Platinum Certified Yes  Yes   Input Voltage Range (Vrms) 200-240V AC Frequency Range (Nominal) (Hz) 50/60 Enclosure Support All Ordering 733459-B21 (single) 733460-B21 (6-pack) 588603-B21 (single) 517521-B22 (6-pack)

HP BladeSystem c-Class Longevity On Jan 6, 2014 HP announced: There’s no end-of-life date for HP BladeSystem c-Class set at this time HP remains committed to the c-Class architecture and plans to offer it through at least 2018 HP plans to support the c-Class portfolio with spares for at least 5 years after any EOL date A pdf of the public media statement is embedded (place the slides in Notes Page view to see the pdf link).

c7000 Enclosure Summary Ongoing enhancements Investment protection Higher performance I/O fabrics Intelligent infrastructure Increased power Investment protection ProLiant and Integrity server blade support across all enclosures Power supply and power input module support across all enclosures Onboard Administrator firmware support across all enclosures c-Class availability to at least 2018 These are the key take-aways.

Thank you

Interconnect Downlink Speeds * The enclosure SKU can be found in the OA Rack Overview screen. For more information, see the Rack View section in the OA user guide. Note: The SKU is listed as a “part number”. Enclosure Evolution Enclosure SKUs* Intro Date Disc Date Interconnect Downlink Speeds Updates from Previous Enclosure Initial Enclosure Offering 4XXXXX-B21 Aug06 Oct07 10GbE 4Gb FC 8Gb FC 4xDDR IB 3Gb SAS Original c7000 c-Class offering. Original midplane: Supports 10GbE, 4Gb and 8Gb FC, 20Gb 4xDDR IB (via full-width switch), and 3Gb SAS. 4Tb/s Bandwidth: 8Gb/s per lane x 16 lanes per device bay x 16 device bays x 2 directions for duplex = 8 x 16 x 16 x 2 = 4,096Gb/s = 4Tb/s. Initial Offering Update 4XXXXX-B22, 4XXXXX-B23 Aug07 Sep09 Insight Display LCD from 2” to 3”. 2400W Gold 92% efficient power supply (Nov08). Midplane same as above. RoHS Enclosure 5XXXXX-B21, 68661X-B21 May09 Oct13 Above plus: 20GbE 4xQDR IB 4xFDR IB (1 port/server) 6Gb SAS RoHS compliance. Midplane bandwidth increased by 25% and improved signal integrity, adds: 20GbE, 40Gb 4xQDR IB (via full-width switch), 56Gb 4xFDR IB (single port per server via full-width switch), and 6Gb SAS support. 5Tb/s Bandwidth: 10Gb/s per lane x 16 lanes per device bay x 16 device bays x 2 directions for duplex = 10 x 16 x 16 x 2 = 5.120Gb/s = 5Tb/s. 2400W Platinum 94% efficient power supply (Jun10). OA connectivity from 10/100 to 1Gb. Updated Onboard Administrator (DDR2 memory and PowerPC processor). Platinum Enclosure 6XXXXX-B21 (except 68661X-B21), 7XXXXX-B21 Feb13 ~2018 16Gb FC 4xFDR IB (>1 port/srvr) Midplane bandwidth increased by 40% and improved signal integrity, adds: 16Gb FC and 56Gb 4xFDR IB (via full-width switch) support. 7Tb/s Bandwidth: 14Gb/s per lane x 16 lanes per device bay x 16 device bays x 2 directions for duplex = 14 x 16 x 16 x 2 = 7,168Gb/s = 7Tb/s. Enclosure Location Discovery Services. Single phase intelligent power module. 2650W Platinum 94% efficient power supply (Jun13). High voltage power solution (3Q14).

Supported Power Supply Kits1,2 Supported c7000 Enclosures3 c7000 Power Module- Power Supply Interoperability (For commercial grade/non-NEBS systems) Power Input Module Supported Power Supply Kits1,2 Supported c7000 Enclosures3 Single Phase AC Intelligent (677595-B21) Platinum 2650W: 733460-B21(6-pack), 733459-B21 (single) Platinum 2400W: 517521-B22 (6-pack), 588603-B21 (single) Gold 2400W: 517521-B21 (6-pack), 499243-B21 (single) 2250W: 412138-B21 (single)4 4XXXXX-B21 4XXXXX-B22 4XXXXX-B23 5XXXXX-B21 6XXXXX-B21 7XXXXX-B21 Single Phase AC (413379-B21) Three Phase AC NA/JPN (413380-B21) Three Phase AC International (413381-B21) -48V DC (AH331A) 2250W -48VDC (AH332A) High Voltage (753623-B21) Universal 2650W: 753619-B21 (6-pack), 753618-B21 (single) Each enclosure must include only one type of power supply. Mixing is not supported, except during hot swaps to different level or higher efficient power supplies. The Onboard Administrator will exhibit a mismatch error due to mixed power supplies until all are matched. The three phase power input modules (413380-B21 and 413381-B21) require a minimum of 3 power supplies. The Onboard Administrator firmware must be at least the minimum version that supports all components installed within the enclosure. No longer shipping.

c7000 Power Supply Comparison (For commercial grade/non-NEBS systems) Power Supply Kit1 SKU Rated Input Voltage Maximum output Efficiency2 Hot-plug HP Location Discovery Services Supported Power Input Modules3 Supported c7000 Enclosures4 2650W Platinum AC 733460-B21(6-pack) 733459-B21 (single) 200-240 VAC 2650W 94% Yes Supported6 Single Phase AC Intelligent (677595-B21) Single Phase AC (413379-B21) Three Phase AC NA/JPN (413380-B21)3 Three Phase AC International (413381-B21)3 4XXXXX-B21 4XXXXX-B22 4XXXXX-B23 5XXXXX-B21 6XXXXX-B21 7XXXXX-B21 2400W Platinum AC 517521-B22 (6-pack) 588603-B21 (single) 2450W 2400W Gold AC 517521-B21 (6-pack) 499243-B21 (single) 92% Not supported 2250W AC5 412138-B21 (single) 2250W 89% 2250W -48VDC AH332A 40-60 VDC 90% -48V DC (AH331A) 2650W Universal 753619-B21 (6-pack) 753618-B21 (single) 277 VAC 380 VDC High Voltage (753623-B21) Each enclosure must include only one type of power supply. Mixing is not supported, except during hot swaps to different level or higher efficient power supplies. The Onboard Administrator will exhibit a mismatch error due to mixed power supplies until all are matched. At 50% of rated load. Platinum and Gold power supplies are 80Plus certified, see www.80plus.org. Power supplies with DC capability are not eligible for 80Plus certification, efficiency is per HP internal testing. Three phase power input modules require a minimum of 3 power supplies. The Onboard Administrator firmware must be at least the minimum version that supports all components installed within the enclosure. No longer shipping. HP Power Discovery Services are enabled when used with an Intelligent Power Distribution Unit (iPDU), iPDU cables, and the single-phase intelligent power input module 677595-B21. This slide is similar to the previous slide, but with a power supply focus rather than a power input module focus.

Onboard Administrator/Virtual Connect Firmware Firmware Compatibility Matrix1,2,3 HP ProLiant Server Blade: Onboard Administrator Firmware4 Virtual Connect Firmware5 HP ProLiant Server Blade Mixing Support Minimum Maximum BL460c (G1) 1.00 4.22 1.10 4.20 All G1 BL465c (G1) BL480c (G1) BL685c (G1) BL260c G5 2.20 1.31 All G1, BL260c G5 BL460c G5 2.31 2.02 All G1 to all G5 BL465c G5 BL495c G5 1.32 BL680c G5 1.20 BL685c G5 BL280c G6 2.41 4.30 2.10 All G1 to all G5, All G6 except the BL2x220c G6 and WS460c G6 BL460c G6 BL465c G6 2.30 BL490c G6 BL495c G6 BL685c G6 BL2x220c G6 2.60 All G1 to all G6 WS460c G6 BL2x220c G7 3.11 3.10 All to all G6, All G7 except BL620c G7 and BL680c G7 BL460c G7 BL465c G7 3.01 BL490c G7 BL685c G7 BL620c G7 3.20 3.15 All G1 to all G7 BL680c G7 BL420c Gen8 3.50 3.60 All G1 to all G7, BL420c Gen8, BL460c Gen8, BL465c Gen8 BL460c Gen8 3.51 BL660c Gen8 3.70 All G1 to all Gen8 WS460c Gen8 BL460c Gen9 4.116 All G6 to Gen9 Notes: Please review the HP Service Pack for ProLiant (SPP), Onboard Administrator, and Virtual Connect firmware advisories and release notes on www.hp.com/support for important information when determining the most appropriate firmware versions. HP recommends the current firmware whenever possible for maximum compatibility and stability. HP Service Pack for ProLiant (SPP) releases and important information can be found at www.hp.com/go/spp. HP Onboard Administrator firmware and important information can be found at www.hp.com/support/OA. HP Virtual Connect firmware and important information can be found at www.hp.com/support/VC. For additional information, please see the Customer Notice ”ProLiant Gen9 Servers - Onboard Administrator Firmware Version 4.11 (or Later) Support for Gen9 Server Blades and Possible Issues That May Arise”.