RD50 funding request Fabrication and testing of new AC coupled 3D stripixel detectors G. Pellegrini - CNM Barcelona Z. Li – BNL C. Garcia – IFIC R. Bates.

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RD50 funding request Fabrication and testing of new AC coupled 3D stripixel detectors G. Pellegrini - CNM Barcelona Z. Li – BNL C. Garcia – IFIC R. Bates - Glasgow University

Layout Planar + 3d (we call it P+3d) processing technology 1-column etching and doping possible True single sided processing Pixel, strip, and 2d stripixel configurations possible depending on electrode connections No column filling No support wafer Advantages: Edgeless technology Radiation hardness 2D read out from the same side

Workplan 4rt quarter2008 – Simulation and optimization of termination structures (BNL) 1st quarter2009 Mask structure design and fabrication (BNL, CNM, Glasgow) 2nd quarter 2009 – Device fabrication, etching and polysilicon filling ( CNM) 3rd quarter 2009 – device fabrication at (BNL/CNM) 4rt quarter 2009 – first tests of simple devices (Glasgow and Valencia) 1st quarter 2010 – irradiation of devices (Glasgow/Valencia) 2nd Summer2010 –Test of simple devices after irradiation 3rd quarter full strip detector tests with Alibava system (Glasgow,) Valencia 2 years project

Cost of the project The total project costs are 32000CHF as detailed: Wafers : 2000 CHF 20 wafers at a unit price of 100 CHF Mask Production : 10000CHF Fabrication of 10 p-type wafers: 10000CHF Fabrication of 10 n-type wafers: 10000CHF Request to RD50:20000CHF Total project cost:32000CHF

Mask layers 1.P-Diff: p+ stops 2.N-Diff :used to cut oxide for n+ implant 3.Holes-p: used to cut oxide for n+ hole etching 4.Poly : to define the poly layer 5.Window: cut vias for Al contacts 6.Metal: 1st Al layer for contacts 7.Via: polyimide layer for insulation between 1st and 2nd Al 8.Metal2: 2nd Al layer for interconnects

First fabrication run

(Backside floating with SiO2 coverage) Preliminary test data on test Structures Fully depleted at about volts However: early breakdown may be due to p-stop no optimized, simulation needed

Charge collection measurements  Biasing all Y p + strips negative  The signal corresponds to the X n + holes Laser properties:  =1060 nm (Near Infrared)  Laser energy of photons=1.170 eV