1 Thermal tests planning for mock-up TM0 Thermal tests planning for CLIC prototype module type 0 May 30th, 2012 F. Rossi

2 Thermal tests planning for mock-up TM0 Experimental program for thermal tests G. Riddone, A. Samoshkin, CLIC Test Module meeting

3 Thermal tests planning for mock-up TM0 INTRODUCTION Topics and updates concerning the status of: 1.CLIC prototype module type 0 2.Laboratory environment (air conditioning, ventilation, etc. ) 3.Heating system (heaters, temperature sensors, etc.) 4.Cooling system (water supply, inlet/outlet cooling circuits, control valves, etc.) 5.Numerical simulations 6.Measurements (alignment, strain gauges, etc.)

4 Thermal tests planning for mock-up TM0 1. CLIC PROTOTYPE MODULE TYPE 0 Brazing of 1st stack Fiducialisation EBW of 2 stacks Brazing of 2nd stack Fiducialisation TIG welding of vacuum flanges W26 W27 W28 W29 Installation on girders W30 EBW tooling manufactured by COMEB W22 Planning according to Bodycote

5 Thermal tests planning for mock-up TM0 2. LABORATORY ENVIRONMENT Lab dimensions (169-S-039): 17 x 6 x 3 m Current annual temperature excursion: °C Environmental temperature for Lab: adjustable range °C Max temperature inside module: o MB: 43 °C o DB: 34 °C Meeting with Martel on Temperature field inside module

6 Thermal tests planning for mock-up TM0 2. LABORATORY ENVIRONMENT VENTILATION FAN Preliminary meeting to define basic operating conditions: o Adjustable temperature range: 20 – 40 °C (by steps of 5 °C) o Humidity: “the relative humidity will not be regulated”, CLIC CDR Chapter 6, Civil engineering and technical services o Low air flow on wires for alignment (solution under study) o Delivery: end of September o Responsible: S. Lebet, F. Rossi, C. Martel °C T ± 0.5 °C T ± 1 °C

7 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: heaters Experimental conditions to be reproduced: G. Riddone, A. Samoshkin, CLIC Test Module meeting All heaters are currently stored in the lab

8 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: temperature sensors solid state relay temperature sensors heaters NI safety system for max. temperature max. temp. limit: 50 °C All temperature sensors are currently stored in the lab

9 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: rack and panel connectors Rack for connectors and NI modules (temperature sensors, heaters, control valves, etc.) Procurement of panel connectors RACK FOR CONNECTORS AND NI MODULES

10 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: planning Temperature sensorsHeaters SSR (control system for heaters) Safety system for max. temperature Panel connectors (procurement, assembly, etc. ) Rack (assembly of panel connectors, etc. ) Preliminary tests for heaters M. Sosin I. Kossyvakis, F. Rossi Requested by M. Sosin: electric engineer for electric plans (to be defined) electrician for electric crates (FSU) I. Kossyvakis, F. Rossi, M. Sosin Mid of July I. Kossyvakis, F. Rossi

11 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM Demineralized water Nominal volumetric flow rate: 0.36 m 3 /h Water inlet temperature: 25 °C Water outlet temperature: ~45 °C Max. pressure allowed: 5 bar Inlet/outlet interface Water supply

12 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: inlet/outlet interface Mechanical design Selection of standard parts (pipes, safety valves, pressure regulating valve, etc.) Procurement F. Bashir Meeting with C. Parente for safety requirements F. Rossi, F. Bashir W22 F. Bashir Delivery and assembly W30

13 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: water supply Water pump Heat exchanger Temperature regulator Inlet/outlet port Water tank Water supply delivered to Lab and tested -> OK Responsible: S. Lebet, F. Rossi

14 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: control valves 1.Delivered to Lab 2.Procurement of panel connectors 3.Preparation of cables

15 Thermal tests planning for mock-up TM0 5. NUMERICAL SIMULATIONS Deformed shape of prototype module type 0 due to applied thermal RF loads (values in µm) Displacements [  m] (location and load type) Prototype type 0 MB (RF load)183 DB (RF load)47 MB (vacuum load)30 DB (vacuum load)131 MB (gravity load)27 DB (gravity load)40 Resulting displacements on the DB and MB lines due to thermal, vacuum and gravity loads Temperature [°C]Prototype type 0 Max temp. of module43 Water output temp. MB35 Water output temp. DB30 Resulting temperatures inside the modules R. Raatikainen

16 Thermal tests planning for mock-up TM0 6. MEASUREMENTS Strain gauges are still an open issue

17 Thermal tests planning for mock-up TM0 CONCLUSIONS # JUNEJULYAUGUSTSEPTEMBER W23W24W25W26W27W28W29W30W31W32W33W34W35W36W37W38W39 1Installation of 1st TM0 2Air conditioning & ventilation 3 Heating system Heaters, temperature sensors 4 Cooling system Inlet/outlet interface Water supply Control valves