Aug 2003 Craig Ogilvie 1 Landscape/Goals for R&D  Goal: Barrel+structure ready Summer/Fall 06 (run07)  Goal: Endcaps ready Summer/Fall 07 (run08)  RIKEN.

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Presentation transcript:

Aug 2003 Craig Ogilvie 1 Landscape/Goals for R&D  Goal: Barrel+structure ready Summer/Fall 06 (run07)  Goal: Endcaps ready Summer/Fall 07 (run08)  RIKEN funds available 03, 04, 05  DOE construction funds –goal is FY05

Aug 2003 Craig Ogilvie 2 R&D Much ongoing effort, supported by  RIKEN, LANL LDRD, ISU university funds, SUNY-SB funds R&D Priorities (FY03/FY04)  pixel pilot and signal bus  generic Si FEM (pixel, strip, endcap)  strip/SVX4 readout  ministrip PHX Later FY04 (when device better specified)  mechanical support/cooling

Aug 2003 Craig Ogilvie 3 Si Strip Electronics  (PHX + ministrip), –DOE funds FY03+FY04 –1 st round design finished by April-Jul ’04 –tested by Dec ’04  (SVX4 + strip) system test, starts Sep ’03 –two options for 1 st round of readout card »RIKEN funds+DOE R&D funds early FY04 u keeps on schedule »or wait till we decide between SVX4 and PHX  Propose to group –make decision on which strip technology April ’04 –limited knowledge of PHX by then, so if PHX is the decision »fall-back is SVX4

Aug 2003 Craig Ogilvie 4 R&D Funds: Proposal ItemJY03JY04FY03 BNL FY03 DOE FY04 DOE FY05 DOE Pixel Pilot Pixel Bus50 Pixel FEM/DCM Strip sensors60 Strip ROC+FEM * mini-strip ROC mini-strip sensors15 mini-strip pilot/assembly100 mechanical/cooling overhead4? Total *Strip ROC, contingent on decision, total is $300K less than needed

Aug 2003 Craig Ogilvie 5 Backup

Aug 2003 Craig Ogilvie 6 PHX Schedule  Design specifications completed 10/03  Start design 12/03  Submit prototype 7/04  Prototype testing completed 12/04  Redesign completed for engineering run 1/05  Engineering run back 3/05 Ray Yarema, FNAL, June 9th

Aug 2003 Craig Ogilvie 7 PHX Cost  Chip design/testing – 2 man-years - $275K (includes all overhead costs)  Prototype chip fabrication- $40K (small chip)  Test board $5K  Engineering run (10-12 wafers) $200K  9 Extra wafers using same masks - $45K  Production wafer level testing –engineering, tech time, circuit board, probe card - $60K  Contingency tbd Ray Yarema, FNAL, June 9th 20 wafers total FY03-FY04 = 182K, FY04 =

Aug 2003 Craig Ogilvie 8 Physics of Strip Decision  Occupancy –BNL strips 2 nd layer ~ 10%, mini-strips much less –“10%” needs to be checked (volunteer?) –ramifications »with projective geometry, 3-D hit is ambiguous u stand-alone tracking difficult, but not the main plan »projections from outer detectors (e.g. dch) u more than one hit may associate with same track u DCA ambiguous u envelope calculation ? or requires tracking team ?  3-D position information better with mini-strips –high-pt track rejection? –use with endcap?  Heat-load different => thickness? (volunteer?)

Aug 2003 Craig Ogilvie 9 Other issues  ambiguity may be a concern for proposals/reviewers –unlikely to affect CD0? –need to work on costs, WBS –need mini-strip sensor expert (volunteer?)