Shear test with irradiated samples NA62 - DIPTEM Genova – UCL 5-09-2012.

Slides:



Advertisements
Similar presentations
Shear Tests - DIPTEM Genova Adhesive tape NITTO DENKO 30 µm thick Adhesive tape NITTO DENKO 30 µm thick Adhesive tape 3M 9461P – 30 µm thick Adhesive tape.
Advertisements

Testing Test Setup TapLok Insert Shear Key Copper Threads Friction Tests Collar Shear Tests NSTX TF FLAG JOINT REVIEW 8/7/03 Michael Kalish.
Gluing Tests - DIPTEM Genova - Adhesives Shear tests with four different adhesive types: Adhesive tape NITTO DENKO 30 µm thick Adhesive tape NITTO DENKO.
THERMO-MECHANICAL TESTS ON TRACKER LADDERS (Low temperature problem on plane 1) Status Report: D.Rapin Sept 26,2012 (help from Giovanni, Franck, Mingming,...)
WA105 General Meeting at CERN 21 & 22-January-2014 Enrique Calvo Alamillo.
Component Testing Test Setup TapLok Insert Shear Key Copper Threads
22/01/2014I° microEO meeting1 MICRO-COOLING CONNECTORS.
GTK Cooling Summary of frame and cooling plate Shear tests Alessandro Mapelli Michel Morel Jerome Noel Georg Nüßle Paolo Petagna Giulia Romagnoli GigaTracKer.
© Learning and Teaching Scotland 2006 Soldering Soldering makes a permanent joint between two pieces of metal. It can be used on most metals but not aluminium.
Gluing and Clamping. Gluing There are many different types of adhesives for many different types of jobs. Glues can be used to bond wood to wood, wood.
GTK WG Meeting April 5 th 2011 Update on Microchannel Cooling - Paolo Petagna 1/15 PH-DT Update on Microchannel Cooling J. Daguin (CERN PH/DT) A. Mapelli.
Connectors 13/03/2013Collaboration meeting CERN - CSEM1.
LHQ Coil Fabrication Experience and Plan Miao Yu 04/08/2013.
Before we use plastics we need to think about the following processes:
Polyvinyl Acetate Adhesives Forestry 485 Lecture 3-4.
M. Gilchriese Glued Fittings October 26, M. Gilchriese 2 Samples and Prep Three samples using Hysol 9396 Seven samples using Hysol 9394 Surface.
Carbon-Epoxy Composite Base Plates for the PHOBOS Spectrometer Arms J.Michalowski, M.Stodulski The H.Niewodniczanski Institute of Nuclear Physics, Krakow.
Pressure Tests Results 13/03/2013Collaboration meeting CERN - CSEM1.
Plasma Arc Lamp Operation
Plain & Reinforced Concrete-1 CE-313
Mickael Frotin– 15/01/2010 ECAL MACHANICAL R&D ECAL meeting - PARIS 1.
NSQP MEETING Valery AKHNAZAROV January 20th 2011 ISP PP0 Board Bonding Procedure Type 1 Type 3 Type 4peek Type 4 Assembly Name: ISP ASM Parts.
Co-Cure Stave Construction 11/10/2010. Co-Cure cables should have flashbreaker tape still covering the surface for this process. SO - don’t remove the.
MERLIN BEAMLINE RIXS refocusing mirror system D. Yegian
T.Schneider/LHCb Muon EDR
G.Sirri – INFN Bologna Videoconf Gluing machine New solution under test: rigid plastic frame instead of lateral tapes and.
Emulsion Gluing Bologna Group Outline: - Adhesive tape - PVC frames - Vacuum supports for emulsion - 2 nd gluing machine.
EST-DEM R. De Oliveira 20 Dec., ‘04 Production of Gaseous Detector Elements  History of Gas Detectors in Workshop  Fabrication of GEM Detectors  Fabrication.
Production of Forward RPC Gaps CMS Forward RPC EDR (10/10/2002 – 11/10/2002) Seong Jong Hong KODEL, Korea University.
MWPC sandwich panels C.Forti INFN-LNF / LHCb-MUON EDR CERN 16 th April sandwich panels typologies of cathodes the mould the production procedure.
BTeV Pixel Substrate C. M. Lei November Design Spec. Exposed to >10 Mrad Radiation Exposed to Operational Temp about –15C Under Ultra-high Vacuum,
PS Module Gluing Tests USCMS Outer Tracker Workshop Ulrich Heintz, Meenakshi Narain, Bill Patterson, Sinan Sagir, Adam Lanman, Eric Spencer, Juan Trenado,
MFT WG5: ladder disk and global assembly Stéphane BOUVIER & Sébastian HERLANT MFT WG7: Mechanics and Thermal studies Jean-Michel BUHOUR & Emili SCHIBLER.
1 Results of Destructive Testing Bacon Industries: LCA-4LV 3M-9882 Adhesive Tape D. Hicks
Metal Soldering Connectors Kovar connectors 6mm diameter with a small pin to enter in the hole Developed for NA62 project 3µm.
Possible types of module Si/W CALORIMETER CONCEPT Si/W CALORIMETER CONCEPT G.Bashindzhagyan Moscow State University June 2002 Internal structure (not in.
ANODIC BONDING – WAYS OF SURFACE CLEANING
Specification section 3.4
Update on Micro Channel Cooling Collaboration Meeting , G. Nüßle.
Vacuum Studies of LHCb Vertex Locator Sensors Gwenaëlle Lefeuvre, Ray Mountain, Marina Artuso Department of Physics, Syracuse University Abstract : The.
Microchannel cooling Alessandro Mapelli CERN PH-DT EPFL-LMIS4 Reporting on behalf of D. Bouit, J. Daguin, L. Kottelat, J. Noel, P. Petagna – CERN PH-DT.
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group1 Half-stave assembly Gluing procedure & glue characteristics Status of dummy components.
ATHENA - Module Construction P. Riedler, J. Rochet.
A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN1 Micro-module assembly -  -module elements - alignment of the silicon sensors to the.
11/02/2005M. Alfonsi - LNF1 DETECTOR CONSTRUCTION M. Alfonsi - LNF.
1 2S Module meeting, 24 September 2012 S tudies on module support inserts Refers to work by Riikka Häsä, Helsinki Institute of Physics, summer student.
Conductive glue tests. J.Wickens 12/7/04 Used small pieces of HV kapton cut from redundant (old) stock, glued to silicon test structures from Karlsruhe.
NSQP MEETING Valery AKHNAZAROV January 20th 2011 Corrugated Panel Bonding Procedure Assembly Name: ISP Corrugated Panel ASM Parts.
Adhesives Michael Butala Thomas Montgomery Ryan Reinhardt.
Department of Bioengineering Structural Properties of Glued-Wood Surrogates 102B_4 Yang Zhang – Background & Hypothesis Kevin Clark – Methods & Protocol.
Origami and Cooling 24th September 2012 C. Irmler (HEPHY Vienna) Joint PXD and SVD Meeting Göttingen.
Advantages of Plastic Light weight Resistant to corrosion Low thermal conductivity Can be translucent, transparent and opaque Electrically resistant Easily.
RaDIATe/BLIP Status of irradiation campaign of Ir, TZM, Si and Graphite-SiC coated samples Claudio Torregrosa, Elvis Fornasiere, David Horvath, Antonio.
Gluing procedure for BGO, fast and slow scintillator Mózsi Bank Kiss & Tomi Ylinen Nov. 23, 2005.
Single Anodic bonding process Temperature: 350 °C Na + O-O- O-O- O-O- O-O- O-O- Silicon Pyrex Voltage: 1000 V - ions start to move to the opposite pole.
GRPC development in Lyon
Global Exotics Board Replacement
Ladder Assembly All tools and jigs produced Glue dispensing works
PECVD SiRN as a protection layer for TimePix chip
Shear test with irradiated samples
New field cage LP2 Ole Bach, Bernd Beyer, Volker Prahl
Pierre-Alexandre Thonet
Mechanical Concept MOLDFLOW KOREA
Bonding of Epoxy and Methacrylate Adhesives on Common Composites Substrates SAMPE Brazil São José dos Campos, São Paulo, Brazil October, 2017.
Gluing machine A semi automatic machine to glue emulsion plate on adhesive tape (as done by Japanese colleagues) was realized and delivered to Bologna.
Enrico Scarlini INFN and University of Florence CERN 25-Oct-2005
Possible types of Si-sensor: SILICON CALORIMETRY FOR A LINEAR COLLIDER G.Bashindzhagyan, Il Park August Silicon sensor.
Props Materials Section 4.
Presentation transcript:

Shear test with irradiated samples NA62 - DIPTEM Genova – UCL

Shear tests with four different adhesive types: Adhesive tape NITTO DENKO 30 µm thick Adhesive tape NITTO DENKO 30 µm thick Adhesive tape 3M 9461P – 30 µm thick Adhesive tape 3M 9461P – 30 µm thick Liquid glue Araldite 2020 Liquid glue Araldite 2020 Adhesive film FastelFilm 30 µm thick Adhesive film FastelFilm 30 µm thick Polyester film double coated by acrylic adhesive Polyester = W/m K Acrilyc = 0.2 W/m K 3M Adhesive 100 (Acrylic adhesive) 3M Adhesive 100 = W/m K Two components epoxy liquid glue Epoxy = W/m K EVA (Ethylene - vinyl Acetate) adhesive film EVA = 0.34 W/m K ⁻Surface cleaning with acetone ⁻1 Kg for 65 hours -Surface cleaning with acetone -1 Kg for 3 minutes -80 °C in the oven (weight and plate already hot) ⁻Surface cleaning with acetone ⁻Vacuum outgassing after mixing the component ⁻Dispensing with a slice ⁻Surface cleaning with acetone ⁻1 Kg for 65 hours Silicon samples Silicon samples 10 x 10 mm with wafers 525 µm thick Silicon glue Silicon

Araldite: 25 samples FastelFilm: 25 samples NittoDenko: 25 samples 3M: 25 samples Irradiation Irradiation levels: -No irradiation -3 x x  nominal -1 x NITTO3MFASTEL FILMARALDITE No irradiation N001 N002 N003 N004 N005 M001 M002 M003 M004 M005 F001 F002 F003 F004 F005 A001 A002 A003 A004 A005 3 x N131 N132 N133 N134 N135 M131 M132 M133 M134 M135 F131 F132 F133 F134 F135 A131 A132 A133 A134 A135 1 x  nominal N141 N142 N143 N144 N145 M141 M142 M143 M144 M145 F141 F142 F143 F144 F145 A141 A142 A143 A144 A145 1 x N151 N152 N153 N154 N155 M151 M152 M153 M154 M155 F151 F152 F153 F154 F155 A151 A152 A153 A154 A155 SpareNS6 NS7 NS8 NS9 NS0 MS6 MS7 MS8 MS9 MS0 FS6 FS7 FS8 FS9 FS0 AS6 AS7 AS8 AS9 AS0 Green = glued in Genova the Red = glued at CERN the

Machine Top clamp Bottom clamp INSTRON 8802 – Floor Model Fatigue Testing Systems up to 500 kN

Test procedure Working set up Stainless steel tool to performe the shear force on the samples The tool has been inserted between the two plates of the machine

NITTO3MFASTEL FILMARALDITE No irradiationN001 N002 N003 N004 N005 M001 M002 M003 M004 M005 (Si broken) F001 F002 (open) F003 F004 F005 A001 (Si broken) A002 (Si broken) A003 (Si broken) A004 (Si broken) A005 (Si broken) 3 x N131 N132 N133 N134 N135 M131 M132 M133 M134 (Si broken) M135 F131 F132 (open) F133 F134 F135 A131 (Si broken) A132 (Si broken) A133 (Si broken) A134 (Si broken) A135 (Si broken) 1 x  nominal N141 N142 N143 N144 (Si broken) N145 M141 M142 M143 M144 M145 F141 F142 (open) F143 (Si broken) F144 (open) F145 A141 (Si broken) A142 (Si broken) A143 (Si broken) A144 (Si broken) A145 (Si broken) 1 x N151 N152 N153 N154 N155 (open) M151 M152 M153 M154 M155 F151 (displaced) F152 (displaced) F153 (displaced) F154 (displaced) F155 (displaced) A151 (Si broken) A152 (Si broken) A153 (Si broken) A154 (Si broken) A155 (Si broken) SpareNS6 NS7 NS8 NS9 NS0 MS6 MS7 MS8 MS9 MS0 FS6 FS7 FS8 (open) FS9 FS0 (open) AS6 (Si broken) AS7 (Si broken) AS8 (Si broken) AS9 (Si broken) AS0 (Si broken) Results – general outlook

NittoDenko – No irradiation F force (N)= σ * 100 D displacement (mm)= ε * 10 -First test (N001) ? Set up problems  negletted -Spare and no irradiation should have the same behavior!!

NittoDenko F force (N)= σ * 100 D displacement (mm)= ε * 10 For the first two radiations the adhesive becomes more rigid and stiff! In last case the adhesive is dead!

NittoDenko – Comparison -Spare and no irradiation should have the same behavior!! -The spread of the results is very small Max value = 4.1 Mpa

3M – No irradiation F force (N)= σ * 100 D displacement (mm)= ε * 10 More or less same behavior!!

3M F force (N)= σ * 100 D displacement (mm)= ε * 10 For the first radiation the adhesive becomes more rigid and stiff! Then it starts to become softer  in the last case the adhesive behaves like the non-irradiated one!

3M – Comparison Max value = 4.5 Mpa -First two equals! -Last case the adhesive is like the non-irradiated one!

Fastelfilm – No irradiation F force (N)= σ * 100 D displacement (mm)= ε * 10 -Non repeatable! -Different behavior in this two cases (????)

FastelFilm F force (N)= σ * 100 D displacement (mm)= ε * 10 First case is more rigid then it starts to melt under higher radiation!!!

FastelFilm – F force (N)= σ * 100 D displacement (mm)= ε * 10 Tool broken: piece of silicon got stuck inside!  re-machined the groove

FastelFilm – Comparison Max value = 3.6 Mpa The adhesive is thermoplastic, at high radiation it melts! (what’s the temperature inside the vessel during the irradiation???)

Araldite – No irradiation F force (N)= σ * 100 D displacement (mm)= ε * 10 New scale for the graphs! Values higher than for the other adhesives!!! Always tested the silicon!!!!

Araldite F force (N)= σ * 100 D displacement (mm)= ε * 10 The glue seems burned!!

Araldite – Comparison Max value = 26 Mpa The values are higher than before! We cannot say anything about the glue! (it is more resistant than silicon!!!!)

Single Anodic bonding – Shear Test – Wafer CMI TEST Temperature: 350 °C Voltage: 1000 V Silicon Pyrex Na 2 O Si XX X Cleaning only with Plasma O 2

Single Anodic bonding – Shear Test – Wafer CMI TEST 20483