1 JRA2-SITRA status report Z. Doležal, A. Savoy-Navarro for JRA2-SITRA partners (LPNHE Paris, Ch.U. Prague, Helsinki, Santander) and associates (CNM Barcelona, HEPHY Vienna, IFIC Valencia, Obninsk):,

2 Milestones and Deliverables (Past) Milestone Deliverable DeadlineStatus Convection cooling system prototype 22Ready Motorised 3D table 24Ready Central tracker prototype 24Ready FE chip version 1 24Ready

3 Convection Cooling System Prototype (LPNHE +OSU+Torino U.) Actual FEE results: ~ 0.6mWatt/ch No Power cycling included yet  Main problem: power dissipation from neighbours Eudet-Memo

4 Motorised 3D Table (Torino)  suitable for testing Silicon sensors, pixel and microstrips in a beam test,  DUT can be moved and rotated with respect the beam line.  built in a modular way, so that it can arrange different types of DUT, with alignment telescopes or without.  5 motors are controlled remotely via RS232, to set positions and angles, via LabVieW application  Eudet-Memo

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7 Central tracker prototype  Several detecting module prototypes have been assembled with sensors and electronics  Tested at Lab test bench  Beam test at DESY and CERN

8 Module prototype 2 HPK 6’ sensorsFE chip 130 um

9 Module prototype

10 FE Chip version 1 (LPNHE+Barcelona U.)  After first prototype in 180 nm technology, 4- channel SITR-130_4 chip was designed in 130 nm and produced  The chip was fully tested both standalone and with a strip sensor attached  Based on the test results version 2 has been designed and submitted  Version 1 documented in EUDET-Memo

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14 Milestones and Deliverables (Future) Milestone Deliverable DeadlineStatus Conduction cooling system prototype 36In a good shape Silicon tracking infrastructure 36Move to 42? Forward tracker prototype 36Move to 42? FE chip version 2 36In a good shape

15 Conduction Cooling System Prototype  Designed by LPNHE and OSU  Description, calculations and test results in Eudet- Memo  Conventional material prototype ready for October 2008 CERN beam test  EUDET prototype will be built afterwards from composite carbon fibre structures

16 Conduction Cooling System Prototype: Principle

17 Conduction Cooling System Prototype: Module box

18 Composite materials Honeycomb Low material budget

19 FE Chip version 2 (LPNHE+U. Barcelona)  After successful tests of FE version 1 chip (SITR-130_4) 88-channel version was designed in 130 nm and submitted  Expected delivery from the foundry is September  After thorough testing chip will be assembled into detecting modules

20 General view of the circuit Strip Storage & Input/Output interface Waveforms Counter Wilkinson ADC ‘trigger’ Ch # Digital Control Bias, threshold, calibration, pipeline control... Analog samplers, slow  i V i > th Sparsifier Channel n+1 Channel n-1 Time tag Preamp + Shapers reset 8x8 analog pipeline Bias & Threshold Generator, Calibration

21 Main features of new circuit 88 channels (1 test channel)‏: Preamplier, shaper, sparsifier, analog pipeline (8x8 celles), 12 bits ADC 2D memory structure: 8x8/channels Fully digital control: - Bias voltage(10 bits) and current (8 bits)‏ - Power cycling (in optional)‏ - Shaping time programable - Sampling frequency programable - Internal calibration - Sparsifier's threshold programable per channel - Event tag and time tag generation Trigger modes: Internal (Sparsification intergrated)‏ External (LVTTL) for beam test

22 LAYOUT VIEW Submitted June 24 th ‘08 Size: 5mmx10mm 88 channels (105um pitch)‏ 105umx3.5mm/channel Analog: 9.5mmx3.5mm Digital : 9.5mmx700um

23 New readout circuit in 0.13 m BONDING DIAGRAM FOR CQFP208 PACKAGE Package 208 pins - 50 analog input - 21 analog test out - 33 digital pin (22 test pins)‏ supply pins

24 Forward tracker prototype  Detector modules equipped with special alignment sensors  IR Laser alignment will be performed  These modules will be tested at October CERN beam test  this deliverable would benefit from postponing the deadline from M36 to M42

24 th Sept-8 th October test beam will study performance of new HPK alignment sensors These are “standard” sensors with an Al-free window in the backside (ohmic contact)‏ IR beam pseudotrack can be used to traverse several sensors Ohmic side: Alignment passage Particle beam IR beam Alignment-friendly sensors Standard sensor Alignment prototype on beam

1) Show that the performance of the alignment friendly sensors is the same as the standard ones 2) Compare track reconstructed geometry to IR beam reconstructed geometry 3) Shift only central alignment sensor and compare reconstructed displacement with particle beam and with IR beam Particle beam IR beam Alignment-friendly sensors IR bandpass filter The same setup employed in the test beam can be used as well as an alignment monitor. We just need an IR transparent window in the front side of the cage (it can be a small bandpass filter). Alignment prototype on beam

27 Silicon tracking infrastructure  Various facilities needed for successful detector testing Cooling Alignment 3D motion Tracking  Integration of the other deliverables  Could be together by M36, but would be of better quality if postponed to M48

LP-TPC: Silicon Envelope (HEPHY, IEKP Karlsruhe) TPCMagnet Beam Rails Module  four silicon modules will be installed: - two in front and two behind the TPC, with respect to the e - -beam  two independent support structures are needed - on each side:  one horizontal module consisting of two daisy- chained sensors  and one vertical module consisting of one sensor  movable support system is needed because it must be possible to scan the TPC - the TPC and the magnet will move relative to the beam - the sensors have to stay inside the beam line

29 Memos+Reports YearMemosReports ~ 6~1

30 Other SITRA/SiLC activities (not included in EUDET but necessary for successful EUDET accomplishment)  Si sensor development, production and testing  Module construction (engineering, tooling)  DAQ (FPGA, off-detector, TLU/EUDET integration)  Lab and beam tests  Simulations

31 Si-sensors  Dedicated SiLC strip sensors designed by HEPHY and manufactured by HPK  Test structures already tested in the beam test (June 2008, CERN)  Full-sized sensors with alignment treatment will be tested at CERN in October  VTT 3D structures

32 HPK strip sensors IV curves Depletion voltage

DUT with HPK test structures at CERN beam test

34 Spatial resolution vs. strip geometry 0 intermediate strip 1 intermediate strip 2 intermediate strips  50 m r/o pitch  0,1 or 2 intermediate strips)

35 Beam tests  2008 (CERN): June: Hamamatsu test structures Sep-Oct: Hamamatsu alignment sensors  2009 March: DESY, FE chip+HPK sensors Later: CERN (HE beam) Later: FNAL (combined)

36 Conclusions  Past deliverables: all completed  4 M36 deliverables: 2 almost complete Other 2: SITRA working with full speed towards completion, but postponing the deadline to M42 or M48 would allow higher quality results