Transistor Counts 1,000,000 100,000 10,000 1,000 10 100 1 19751980198519901995200020052010 8086 80286 i386 i486 Pentium ® Pentium ® Pro K 1 Billion Transistors.

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Presentation transcript:

Transistor Counts 1,000, ,000 10,000 1, i386 i486 Pentium ® Pentium ® Pro K 1 Billion Transistors Source: Intel Projected Pentium ® II Pentium ® III Courtesy, Intel

Design Abstraction Levels n+ S G D + DEVICE CIRCUIT GATE MODULE SYSTEM

Not Only Microprocessors Digital Cellular Market (Phones Shipped) Units 48M 86M 162M 260M 435M Analog Baseband Digital Baseband (DSP + MCU ) Power Management Small Signal RF Power RF (data from Texas Instruments) Cell Phone

Frequency P6 Pentium ® proc Year Frequency (Mhz) Lead Microprocessors frequency doubles every 2 years Doubles every 2 years Courtesy, Intel

Die Size Growth Pentium ® proc P Year Die size (mm) ~7% growth per year ~2X growth in 10 years Die size grows by 14% to satisfy Moore’s Law Courtesy, Intel

Power Dissipation P6 Pentium ® proc Year Power (Watts) Lead Microprocessors power continues to increase Courtesy, Intel

Power will be a major problem 5KW 18KW 1.5KW 500W Pentium® proc Year Power (Watts) Power delivery and dissipation will be prohibitive Courtesy, Intel

Power density Pentium® proc P Year Power Density (W/cm2) Hot Plate Nuclear Reactor Rocket Nozzle Power density too high to keep junctions at low temp Courtesy, Intel

9 Challenges in Digital Design “Microscopic Problems” Ultra-high speed design Interconnect Noise, Crosstalk Reliability, Manufacturability Power Dissipation Clock distribution. Everything Looks a Little Different “Macroscopic Issues” Time-to-Market Millions of Gates High-Level Abstractions Reuse & IP: Portability Predictability etc. …and There’s a Lot of Them!  DSM  1/DSM ?

Productivity Trends ,000 10, ,000 1,000,000 10,000, ,000 10, ,000 1,000,000 10,000, ,000,000 Logic Tr./Chip Tr./Staff Month. x x x x x x x 21%/Yr. compound Productivity growth rate x 58%/Yr. compounded Complexity growth rate 10,000 1, Logic Transistor per Chip (M) ,000 10, ,000 Productivity (K) Trans./Staff - Mo. Source: Sematech Complexity outpaces design productivity Complexity Courtesy, ITRS Roadmap

Advanced Metallization

Die Cost Single die Wafer From Going up to 12” (30cm)

Yield

Defects  is approximately 3

Summary Digital integrated circuits have come a long way and still have quite some potential left for the coming decades Some interesting challenges ahead –Getting a clear perspective on the challenges and potential solutions is the purpose of this book Understanding the design metrics that govern digital design is crucial –Cost, reliability, speed, power and energy dissipation