National Nanofabrication Centre Centre for Nano Science and Engineering IISc, Bangalore, India Cleanroom Admin Committee Meeting Prabhakara Rao September 29, 2015

 August month charges o 113 Users - Total charges at a high of L o 87 MITO084 users - Total charges of L o 26 NON-MITO users - Total charges of 3.54 L o 61 users from CeNSE - Total charges of L CeNSE users charged % of total value Reports

DataApril-15May-15June-15July-15Aug-15 Total Users MITO084 users Non-MITO Users Total users from CeNSE Total charges for MITO L15.5 L22.25 L22.47 L22.18 L Total charges for Paid users 2.3 L1.86 L2.5 L2.95 L3.54 L

Sl.noProfessorProject CodeAmount 1. Prof. S. RaghavanCDAC0018/ Consumables21,63, Prof. S. RaghavanMITO-0985,70, Prof.Rudra PratapNPMA-0349,00, Prof.Rudra PratapNPMA-03484, Prof.Navakanta BhatBIARC1,50, Prof.Navakanta BhatNPMA-0356,12, Prof.Navakanta BhatNPMA-03551, Internal Users Total Amount – 45,31,422

BMS P RESENT STATUS (DO)(AO)(DI)(AI) M & E SYSTEM EQUIPMENT Quantity Remote Start/Stop Command Humidifier Heater 2 way on/off valve Motorised Damper Control Valve By-Pass Valve Control VFD On/Off Status Trip Alarm Motorised Valve Open/Close Fault Alarm Hi-Lo Level Filter Dirty Alarm Motorised Damper Supply Air Temperature Water Supply Temperature Water Return Temperature Room Temperature Room Humidity Air Flow Differential Pressure Voltage Ampere PH Reading Pressure Reading Flow Resistivity PPM Fluoride HF&Acid Alkaline level S/NSystem DDC CONTROL PANEL CH1 to CH CHWP1 to CHWP CHW Header (By-Pass) DCP1&DCP PCW1&PCW MAU1 to MAU CDA House Vacuum P1&P Absorbtion Dryer Ultra Pure Water Process Vacuum P1&P Raw Power Diesel Generator UPS WWT-Fluoride HF Sump Pump Alkaline Sump Pump Sub Total : I/O Used: Total Spare: DDC CONTROL PANEL Dry Coil Units Gas System Fire System General Exhaust Wet Scrubber Dry Scrubber Sub Total : I/O Used: Total Spare: TOTAL I/O POINTS COUNT: TOTAL SPARE POINTS: Note working fine Made it working by us Parts needs to be changed not connected

I SSUES CLEARED (N OT WORKING ) Not working EquipmentAction pointD/APOATarget dateRemarks Gas System Fault Alarm DIMake a physical connection if required & configure the software.4-Sep-15 Done, Critical & warning are connected BMS & GMS configured, Fire System Fault Alarm DIMake a physical connection if required & configure the software.4-Sep-15 Cable layed, FPS connected GMS, New BMS window created General Exhaust 1 VFD AOCheck the cabling status, laying if required, connect & confirure4-Sep-15done General Exhaust 1 On/Off Status DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Wet Scrubber 1 VFD AOCheck the cabling status, laying if required, connect & confirure4-Sep-15Done Wet Scrubber 1 On/Off Status DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Wet Scrubber 1 Trip Alarm DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Dry Scrubber 1 VFD AOCheck the cabling status, laying if required, connect & confirure4-Sep-15Done Dry Scrubber 1 On/Off Status DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Dry Scrubber Trip Alarm DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Gas System critical Alarm DIMake a physical connection if required & configure the software.4-Sep-15 Done, Critical & warning are connected BMS & GMS configured, Wet Scrubber 2 Trip Alarm DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done General Exhaust 2 VFD AOCheck the cabling status, laying if required, connect & confirure4-Sep-15Done General Exhaust 2 On/Off Status DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Wet Scrubber 2 VFD AOCheck the cabling status, laying if required, connect & confirure4-Sep-15Done Wet Scrubber 2 On/Off Status DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done Dry Scrubber 2 VFD AOCheck the cabling status, laying if required, connect & confirure4-Sep-15Done Dry Scrubber 2 On/Off Status DICheck the cabling status, laying if required, connect & confirure4-Sep-15Done

I SSUES CLEARED (C ALIBRATION ) Need to calibrate EquipmentAction pointD/APOATarget date CHW Header (By- Pass) Water Supply TemperatureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done CHW Header (By- Pass) Water Return TemperatureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done CHW Header (By- Pass) Differential PressureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done DCP1&DCP2 Water Supply TemperatureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done PCW1&PCW2 Water Supply TemperatureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done PCW1&PCW2 Differential PressureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done MAU1 to MAU3 Filter Dirty AlarmDIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15 Components needs to be replaced MAU1 to MAU3 Supply Air TemperatureAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done MAU1 to MAU3 Air flowAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15 Components needs to be replaced General Exhaust Air flowAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done Wet Scrubber Air flowAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done Dry Scrubber Air flowAIIn house team will try to calibrate, if not possible vendor involvement required.18-Sep-15Done Motarised Valve actuaors AO Components needs to be replaced

Staff Concerns Wage Revision Medical Insurance

L ITHOGRAPHY B AY 29 TH S EP, 2015 Equipments: Laser writer, MicroTech Laser writer, Heidelberg EVG Mask aligner MJB4 mask aligner EVG Bonder E‐Line system Pioneer E‐beam system Gopal

L ITHO E QUIPMENTS U TILIZATION C HART – S EPT.2015, E- BEAM SYSTEMS

Litho Equipments Utilization Chart September

Maintenance Issues  All Litho tools are up, no down time during Sept.

Furnaces and wet benches Savitha P

Equipment Utilization Chart(September)

Dry Etch and Thin films & Process Integration Sep 29 th,2015 Sunanda Babu

Equipment Utilization DRIE:SMC chiller was down  small crack in tube  refrigerant gas leak  slow cooling of chuck. Vendor and FT resolved issue

Equipment Utilization

INUP External Project Status(Sep’15) ProjectPI OwnerStart Date ECD Mask Layers Status MSRIT RF MEMS switch( (Laxmi) Owner: Siva Bkup:Sabiha Oct’14May’154Closed MTRDC TWT SWS(Anurag)Owner: Siva Bkup:Sabiha Jun’15May’162PR spin coating trials for eChannel realization, aligned to wave structure. RCI Accelerometer(Mandal)Owner: Siva Bkup:Sabiha Jun ’12Mar’127mask writing ongoing, 7um trench filling with PECVD SiO2 trials ongoing. Nanosniff Sensor (Sachin)Owner: Sabiha Bkup:Siva Aug’12continuous56 th visit, gold peeling issue, suspect target quality, etch rate drift, litho process robustness, optimization experiments ongoing. IITGB Micro Needles (Bhushan)Owner: Sabiha Bkup:Siva Jul’14continuous2Awaiting 4” DSP wafers NAL Insulator Deposition and Etching (Prasanta Choudhury) Owner: Sabiha Bkup:Siva Aug’12continuousNA2 2” wfrs processed ( Oxide/Nitride deposition, RIE pad etch, PR strip and Pad resistance measurement),Pad resistance meets customer requirements, awaiting remaining 2 samples from NAL. BMSIT Gold electrodes( Sreedevi )Owner: Sabiha Bkup:Siva Sep’151Feasible, Process estimate provided IIT Madras Thermal Interface resistance measurement of thin films, like Graphene on substrates( Arvind) Owner: Sabiha Bkup:Siva Sep’15Feasibility /customer requirements discussion ongoing SNS college of Engineering Piezeoelectric cantilever for energy harvesting( Sreeja) Owner: Sabiha Bkup:Siva Sep’15Feasibility/customer requirements discussion ongoing Asarva chips/BNMIT Blood pressure sensor (Veena) Owner: Siva Bkup:Sabiha Sep’15Feasible, Process estimate provided NIT Trichy Pressure Sensor(Sujan)Owner: Siva Bkup:Sabiha Sep’15Feasible, Process estimate provided Delhi University DRIE processing( back side Si etch) Owner: Lava Bkup: Aditi Sep’15Oct’15Process estimate to be provided.

Carrier wafer breakage in Dry etch bay for the RIE tools.  Causes  Improper handling of carrier wafer, while cleaning or removing cool grease  Cross slot placement of wafer inside cassette.  Penalty  Replace carrier wafer at own cost or bring own carrier wafer.  No access to dry etch until procedures completed in FOM.  Improvement actions  Carrier wafer handling SOP, to be displayed (Best Know practices) near hot plate in Dry Etch bay.  Camera re-positioning to monitor the actions of users. D ISCIPLINARY I SSUE

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