Northwest Nazarene University Chad Larson, Ben Gordon, Seth Leija, David Vinson, Drew Johnson, Zach Thomas June 1 st, 2012

 Study the effects of a rocket launch on superhydrophobic material developed at Oakridge National Laboratory  Study radiation hardened chips in partnership with American Semiconductor Inc.

RequirementPayloadStatus Mass Allotment:6.5 with ballasts, ballasts need to be added to structure Volume Allotment:4.75” high Center of GravityIn the allotted 1x1x1inch center of canister. Will be retested once the ballasts have been added. Activation1.SYS.2. G-switch Structure MountsNo mounts to side of can. SharingMore contact with Harding will be necessary this next week.

 Our electrical system is essentially fully integrated except for one chip.  Between the two experiments, they will both fit on the one polycarbonate plate and there are no foreseeable problems.  We have not yet written out a integration procedure. We will be contacting Harding a lot this week, preparing for a smooth and hassle free integration.

 Our electrical system has been fully integrated into the RockOn board and is activated through the g-switch.  Our payload will fulfill our mission requirements testing both superhydrophobic materials as well as radiation hardened chips.

 The electrical system has been fully integrated with the RockOn board and is only missing one chip until it is fully ready for flight.  The FleX chip was placed in a socket at BSU and is expected to arrive today after which it will be integrated into the system.  The code for the FleX chip has to be finished, but should be done as soon as the chip arrives.

 The manufacture of the superhydrophobic experiment boxes will be completed this following week. One box has been manufactured and the other one is being made and should be completed today.  After today, only the interior boxes will need to be put together using the superhydrophobic plates.

 We are in the process of being ready for the launch. We are extremely close to being fully prepared and should be completely ready to go by next week. We have several team members who will work all next week and the week before we leave to ensure a completed payload.  The polycarbonate plate has been ordered and will be made next week, after which we will attach the boxes and electrical system and fully assemble the entire payload and prepare for integration.

 Complete Outer boxes: June 1 th  Complete Inner boxes: June 4 th  Attach final chip/code/sim: June 6 th  Complete polycarbonate plate: June 8 th  Fully attach payload to plate: June 9 th

 Our hotel has been booked and flights have been purchased.  One professor wanted to come later in the week of the launch and has filled out registration. We will talk to Wallops when we arrive to see if it is worth it for him to fly down.

 Almost the entire team was out of the U.S. the last three weeks, but arrived back today. Our sole focus the next 12 days will be our RockSat experiment and are confident that everything will be completed and ready to go by next week.