Prox-0.3 Georgia Institute of Technology Kiichiro DeLuca Richard Zappulla Matt Uhlman Ian Chen 1

Mission Overview: System Level Integration of Critical Subsystems Opportunity to integrate subsystems that are critical to satellite survival: Command and Data Handling, Electrical Power, and Thermal Control. Flight Testing of Critical Subsystem Components Power Management and Distribution Board Power MOSFETs and Thermistors Image Acquisition/Storage and On-board Processing Visible image acquisition through web camera Visible image storage on flash storage OpenCV library for on-board image processing 2

SHOT II / UN-7 Connection: 3 Prox-0.3 is a scaled down version of the survival critical subsystems on Prox-1 Prox-0.3 contains many of the same hardware to be used on Prox-1 BeagleBoard and Arduino Power Management & Distribution Patch Heaters, MOSFETs, and Thermistors

SHOT II Design – BalloonSat System: 4

SHOT II Design – Command & Data Handling: Primary Objectives: 1.Demonstrate overall C&DH architecture functionality and viability 2.Demonstrate reliable communication between FCE and SMC 3.Demonstrate basic data-logging functionality 4.Demonstrate basic flight software functionality and reliability at the hardware/software interface 5.Demonstrate basic image acquisition Secondary Objectives: 1.Demonstrate on-board IPA on pre-loaded images 5

SHOT II Design – Command & Data Handling: 6 Logic Level Shifter / SMC Level-Shifter Schematic FCE / Visual Camera

SHOT II Design – Electrical Power: 7 Battery Specifications: 9V Cells 18V Bus voltage 4480 mAh capacity Design: 4 sets of 2 cells in series connected in parallel Ground terminals connect to ground plane Power terminals are spliced together to send to switch

SHOT II Design – Thermal Control: 8 Foam insulation board provides passive thermal protection against the thermal environment at high altitude. Heaters provide active means to providing heat to specific components. Varying current through the thermistor provides microcontroller the temperature at the thermistor location. At the specified “on” temperature (currently set to 15°C), microcontroller sends current to the LED and to the MOSFET, in turn signaling the heater to turn on. Current will stop flowing to the MOSFET and the LED when temperature reaches the specified “off” value (20°C). MOSFET Foam Insulation Board used for Box Structure Heater Circuit Diagram

Expected Results: Verification of nominal subsystem-subsystem interaction through log of command out and telemetry in to the Flight Compute Element Thermistor Temperature Heater ON/OFF PMAD Board Voltage Image acquisition at altitude Verification of camera link to Flight Compute Element PR Value! Verification of on-board image processing routine on Flight Compute Element 9

Demonstration: 10 Power on the Power Management & Distribution circuit Telemetry readout and heater switching on the Thermal Control subsystem