Pads Assembly- Zamiatin Si Detector – ELMA/Dubna/MSU Interface Board – dubna/baskagiv Carrier Board -dubna/baskagiv Pre-Amp –sleniov(analog) Basilev-dubna.

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Presentation transcript:

Pads Assembly- Zamiatin Si Detector – ELMA/Dubna/MSU Interface Board – dubna/baskagiv Carrier Board -dubna/baskagiv Pre-Amp –sleniov(analog) Basilev-dubna FEM – Basilev –-dubna –Analog(Slepniov) –Digital Basilev –Layout – Baskagiv

Pad assembly Assemble –Detector+interface+ceramics (dubna) To bnl –Glue carrier+W (SUNY?) Attach detector assembly via connectors To bnl –Use connector to put together 2 sections! (at BNL)

strips Detectors – Elma/Korea SRC (stripixel readout card) – BNL/CA Bonding svx+pitch adapter –Helsinki Assembly - Helsinki Then to BNL

Mechanical parts Dubna – Litvinenko –Copper boxes etc

Brick Assembly Receive –Pad assembly –Strip assembly –Copper boxes

groups MSU-Merkin 'Nikolai Zamiatin‘ 'Basilev, Sergey‘ Analoy Litvinenko Andrey Sukhanov

Pad detector Connector Carrier board (Dubna-layout Baksagiv) traces out to end carrying analog signal to pre amp Tungsten (USA) brick size Pre-amp board - Hybrid pre-amp Slepniov Layout- Boskakov Assebled-Dubna Cable Polyamide Boskakov FEM board 14 bit ADC Design- Basilev Layout- Boskakov Assembled-Dubna Or Chi HBD board Assembled at Dubna Zamiatin Double unit Assembled at SUNY? Brick size To DCM Ceramics (USA) no electronics, with holes for soldering etc Pad detector (ELMA/ON/SENS) Interface board (Dubna-layout-Boskakov ) double unit Connector “Hbd” cable decouplingcapacitor

Absorber (W) Sensors carrier board Layout: BNL/MSU Implementation: BNL/Komposit (Ekaterinbourg, Russia)

Pad ReadOut Unit

Pad Detector Interface board Ceramic

Pad detector unit (close up of connections) Connector Carrier Tungsten Interface board Connector Ceramic Pad detector Bonding pad Analog Signals To Pre-amp Grounding foil

Stripixel unit Cable Daisy chain Off the Shelf polyamide SVX4 Readout and Control (FPGA) Design- Sukhanov’s (1 per brick) Assembled USA Crate controller – linux to SVX4 Ceramic High Voltage+alignment (Dubna) brick size Assembled and bonded at helsinki To DCM Stripixel detector (ELMA/SENS) SRC (stripixel readout card) (USA) double sensor unit Ceramic (USA) Pitch adapter SVX4

Brick Tungsten (USA) brick size Pad unit Carrier To preamp Tungsten (USA) brick size Pad unit Carrier To preamp Tungsten (USA) brick size Pad unit Carrier To preamp Stripixel unit High Voltage ceramic+alignment brick size To FEM Cable Daisy chain Off the Shelf polyamide Copper “box”

overview

Pad sensor sub-assembly actually done in double units Dubna

Pad sensor sub-assembly Dubna

Pad sensor sub-assembly attach to carrier board and W