13 Nov. 20131Dimitris LOUKAS Name of the Institution : NCSR Demokritos Contact person: Dimitris LOUKAS

Slides:

Advertisements

Similar presentations

MICROELECTROMECHANICAL SYSTEMS ( MEMS )

Advertisements

1 Laboratoire d'Analyse et d'Architecture des Systèmes du CNRS Welcome.

ROLUL CERCETARII FUNDAMENTALE IN CREAREA BAZEI DE CUNOSTINTE PENTRU CERCETARE APLICATIVA DIN DOMENIUL NOILOR MATERIALE SI TEHNOLOGII.

Eija Tuominen Siena TEST BEAM RESULTS OF A LARGE AREA STRIP DETECTOR MADE ON HIGH RESISTIVITY CZOCHRALSKI SILICON Helsinki Institute of Physics,

Eija Tuominen DEVELOPMENT OF RADIATION HARD DETECTORS Helsinki Institute of Physics (HIP) In close cooperation with: Microelectronics Centre,

Silicon Preshower for the CMS: BARC Participation

Center for High Resolution Electron Microscopy CENTER FOR SOLID STATE SCIENCES, ARIZONA STATE UNIVERSITY OFFICE OF NAVAL RESEARCH Two-dimensional electrical.

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #6.

Institute of Microelectronics Dr Androula Nassiopoulou

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #5.

Thin Film Deposition Prof. Dr. Ir. Djoko Hartanto MSc

NIST Nanofabrication Facility. CNST Nanofab A state-of-the-art shared-use facility for the fabrication and measurement of nanostructures –19,000 sq ft.

MEMs Fabrication Alek Mintz 22 April 2015 Abstract

Carol A. Wood Contract Specialist July 8,  Laboratory equipment, including new, refurbished, upgrades  Services related to laboratory equipment.

We connect chips and systems

The BTeV Tracking Systems David Christian Fermilab f January 11, 2001.

P3MD Labs Introduction to the facilities of the Purdue Experimental Particle Physics research groups.

Fabrication of Active Matrix (STEM) Detectors

Thin Film Deposition Quality – composition, defect density, mechanical and electrical properties Uniformity – affect performance (mechanical , electrical)

반도체 제작 공정 재료공정실험실 동아대학교 신소재공학과 손 광 석 隨處作主立處開眞

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #2. Chip Fabrication  Silicon Ingots  Wafers  Chip Fabrication Steps (FEOL, BEOL)  Processing Categories 

Presentation by Maria Rangoussi, Dean, Faculty of Engineering ( ( ) “SENS-ERA” Project Kick-off Meeting Georgian Technical.

Institute of Solid State Physics of the Bulgarian Academy of Sciences 1784 Sofia, 72, Tzarigradsko Chausse Fax: ;

MPI Halbleiterlabor  Otto-Hahn-Ring 6  München  The Halbleiterlabor is in the unique position to have a highly flexible production.

Basic Nanotechnology EHS Awareness Basics of Chemical and Material Properties—Role of Scale Basics of Chemical and Material Properties—Role of Scale Chemical.

Integrated Circuit Devices Professor Ali Javey Summer 2009 Fabrication Technology.

SEMINAR ON IC FABRICATION MD.ASLAM ADM NO:05-125,ETC/2008.

ILC Vertex Tracker Ladder Studies At LBNL M Battaglia, D Contarato, L Greiner, D Shuman LBNL, Berkeley.

Chapter Extra-2 Micro-fabrication process

1 Tehniline ülevaade uusimast füüsikast CERN’is Endel Lippmaa 20. Detsember 2006, TTÜ.

Prospect for Si sensors in Korea Y. Kwon (Yonsei Univ.)

N2L Summer School in NCSR Demokritos June 26-July 7, 2006 “Methods in micro – nano technology and nanobiotechnology” Target Modern Research takes advantage.

IC Fabrication Overview Procedure of Silicon Wafer Production

Micro and Nano Characterization Facility Girish Kunte July 1 st 2014.

1 3 MEMS FABRICATION Ken Gilleo PhD ET-Trends LLC 24%

11/8/ Microplasma Optical Emission Spectrometer (MOES) on a chip SFR Workshop November 8, 2000 Michiel Krüger, David Hsu, Scott Eitapence, K. Poolla,

Introduction EE1411 Manufacturing Process. EE1412 What is a Semiconductor? Low resistivity => “conductor” High resistivity => “insulator” Intermediate.

ITC-irst Researchers 217 Post docs 13 PhD students MM area FCS – Physics & Chemistry of Surfaces and Interfaces MIS – Microsystems IT area SRA –

Machine Tools And Devices For Special Technologies Ion beam machining Slovak University of Technology Faculty of Material Science and Technology in Trnava.

NEWATLASPIX: Development of new pixel detectors for the ATLAS experiment upgrade Giulio Pellegrini.

ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING

Passivation of HPGe Detectors at LNL-INFN Speaker: Gianluigi Maggioni Materials & Detectors Laboratory (LNL-INFN) Scientific Manager: Prof. Gianantonio.

MPRI Centralised Laboratories Gerrard Peters School of Physics 1.

JRA2-brainstorming 4/1/2006, Lucie Linssen, slide 1 introduction to CERN in EUDET The CERN PH (physics) department participates in EUDET PH department:

ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING

August DESY-HH VFCAL Report W. Lohmann, DESY Infrastructure for sensor diagnostics FE Electronics Development Sensor test facilities Laser Alignment.

Summer School in NCSR Demokritos Summer 2005 Methods in micro – nano technology and nanobiotechnology Organizer: National Center for Scientific Research.

Thin Film Deposition. Types of Thin Films Used in Semiconductor Processing Thermal Oxides Dielectric Layers Epitaxial Layers Polycrystalline Silicon Metal.

The coating thermal noise R&D for the 3rd generation: a multitechnique investigation E. Cesarini 1,2), M.Prato 3), M. Lorenzini 2) 1)Università di Urbino.

Eija Tuominen, coordinatorHIP/UH Detector Laboratory, October 2010 DETECTOR DEVELOPMENT at HELSINKI DETECTOR LABORATORY Detector Laboratory is a joint.

ICT 1 Pixel 2008 International Workshop, FNAL September 23-26, 2008 T. E. Hansen a, A. Kok a, C. Da’Via b, T. A. Hansen a, J. Hasi b, C. Kenney d, N. Lietaer.

1 Device Fabrication And Diffusion Overview 5 and 8 February 2016 Silicon Wafer Production-Refer to Chapter “0” Prologue Raw material ― Polysilicon nuggets.

Preshower PRR July NCSR DEMOKRITOS Production Center : Institute of Microelectronics (IMEL) Regional Center : Institute of Nuclear Physics (INP)

0 Ion Beam Facilities at KOMAC Chan Young Lee on behalf of KOMAC Chan Young Lee on behalf of KOMAC ICABU2014, November 12~14,

Giulio Pellegrini 12th RD50 - Workshop on Radiation hard semiconductor devices for very high luminosity colliders, Ljubljana, Slovenia, 2-4 June 2008 Report.

Process integration 2: double sided processing, design rules, measurements

Preliminary results from 3D CMS Pixel Detectors

Etching Processes for Microsystems Fabrication

Morris A. Washington Professor of Practice, Dept. of Physics, Applied Physics & Astronomy Director, Micro and Nano Fabrication Clean Room Associate Director,

Modern Semiconductor Devices for Integrated Circuits (C. Hu) Slide 3-1 Chapter 3 Device Fabrication Technology About transistors (or 10 billion for.

Materials and Devices for Neural Systems and Interfaces

Report from CNM activities

Sidet Facilities A snap shot of space and equipment at Sidet and their current use Projected future uses and upgrades Hogan Nguyen, Fermilab May 22nd 2007.

ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING

Device Fabrication And Diffusion Overview

BONDING The construction of any complicated mechanical device requires not only the machining of individual components but also the assembly of components.

IC Fabrication Overview Procedure of Silicon Wafer Production

Molecular Beam Epitaxy

Device Fabrication And Diffusion Overview

Power Electronics: cooking up group IV semiconductor materials.

Presentation transcript:

13 Nov Dimitris LOUKAS Name of the Institution : NCSR Demokritos Contact person: Dimitris LOUKAS NameTime (in FTE) Dimitris LoukasPhysicist0.3 Aris KyriakisPhysicist0.3 Giannis KazasElectronics Engineer0.5 Panos RoussosElectronics Engineer0.5 Panagiotis DimitrakisSi Processingto be defined Pascal NormandNanotechnology, Micromachining to be defined Names of group members and fraction of time to RD50 (indicative) Demokritos National Center for Scientific Research-Greece RD50 Questionnaire

13 Nov Dimitris LOUKAS Demokritos National Center for Scientific Research-Greece RD50 Questionnaire ECAL: The CMS Preshower detector design and construction 15 years of development and construction Silicon Detectors design & fabrication (Joint activity with the Microelectronics Institute) 600 micromodules (among 4800) assembled in Demokritos Work consisting of 1)ASIC readout chip design (preliminary CMOS version), 2)2) Si Det. design & fabrication 4) Micromodule assembly 4) Reliability tests, 5) Test beams 6) Integration Various VLSI chips for X-ray detection

13 Nov Dimitris LOUKAS Demokritos National Center for Scientific Research-Greece RD50 Questionnaire FP7: The COCAE Project

13 Nov Dimitris LOUKAS Demokritos National Center for Scientific Research-Greece RD50 Questionnaire Simulation, design and fabrication of prototypes, characterization Irradiation facility (TANDEM) for radiation hardness studies

13 Nov Dimitris LOUKAS Demokritos National Center for Scientific Research-Greece RD50 Questionnaire Existing Resources in our Lab: Semiautomatic wire bonding machine: Delvotec 5430, Automatic probe station: Carl Suss P150 SMD work and rework station: (Fritsh HS 905 &VS925), Design tools (Cadence, Sentaurus, OrCaD) Electrical Characterisation equipment: (HP 4192A, KEITHLEI 6517A), Desiccator-Nitrogen-purged low- humidity storage system (TERRA UNIVERSAL), Climatic Chamber (to be ordered) Resources at the Microelectronics department: The department of Microelectronics at NCSR DEMOKRITOS constitutes the major micro and nano electronics facility at national level. Processing equipment of the department includes: 4 laminar hot-wall furnace tubes, 7 horizontal hot-wall furnace tubes, 2 horizontal LPCVD tubes for nitride, oxide (TEOS) polysilicon, 1 horizontal LPCVD tube for LTO, Ion implanter (EATON medium current, 200 keV), Optical lithography system (resolution down to 0.6 μm), Reactive Ion Etcher (ALCATEL), Metallization equipment, High Density Plasma Etcher, Different thin film deposition systems (Sputtering, MOCVD). In addition, equipment for electrical and optical characterization of devices is available.

13 Nov Dimitris LOUKAS Demokritos National Center for Scientific Research-Greece RD50 Questionnaire Resources at the Department of Materials Science (IMS) : - Ultra high vacuum system from AJA International (ATC-2200-V) accepting substrates up to 4 inches (uniformity ±2%, heating uniformity ±2% up to C). - Deposition system (Cooke 404) updated with three new 2-inch sputter guns from AJA Inc and a turbo- molecular pump that creates 5E-9 Torr high vacuum -SEM, TEM microscopy Access to Deep Level Transient Spectroscopy (DLTS) equipment (University of Athens) TANDEM: X-rays: X-ray tubes for irradiation and high rate tests