MiniDAQ workshopOctober 29 – 30, 2002M. Hazumi Vertex Detector Overview and DSSD readout/trigger M. Hazumi (KEK) Overall Design Consideration Silicon Strip.

Slides:



Advertisements
Similar presentations
The Belle Silicon Vertex Detector T. Tsuboyama (KEK) 6 Dec Workshop New Hadrons with Various Flavors 6-7 Dec Nagoya Univ.
Advertisements

Belle SVD status & upgrade plans O. Tajima (KEK) Belle SVD group.
Simulation Studies of a (DEPFET) Vertex Detector for SuperBelle Ariane Frey, Max-Planck-Institut für Physik München Contents: Software framework Simulation.
Summary of the SVD session 19 March 2009 T. Tsuboyama (KEK)
The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors M.Friedl, C.Irmler, M.Pernicka HEPHY Vienna.
Victoria04 R. Frey1 Silicon/Tungsten ECal Status and Progress Ray Frey University of Oregon Victoria ALCPG Workshop July 29, 2004 Overview Current R&D.
PHENIX Vertex Tracker Atsushi Taketani for PHENIX collaboration RIKEN Nishina Center RIKEN Brookhaven Research Center 1.Over view of Vertex detector 2.Physics.
Striplet option of Super Belle Silicon Vertex Detector Talk at Joint Super B factory workshop, Honolulu 20 April 2005 T.Tsuboyama.
The Belle SVD Trigger  Tom Ziegler  Vertex 2002  Kailua-Kona, Hawaii, 4-8 th nov The Belle SVD Trigger Tom Ziegler on behalf of the Belle SVD.
The LHCb Inner Tracker LHCb: is a single-arm forward spectrometer dedicated to B-physics acceptance: (250)mrad: The Outer Tracker: covers the large.
1 The LHCb Vertex detector 15/9/2003 Physics –Goals –Properties and consequences LHCb –Overview of the detector Vertex –Specifications –Silicon stations.
David L. Winter for the PHENIX Collaboration PHENIX Silicon Detector Upgrades RHIC & AGS Annual Users' Meeting Workshop 3 RHIC Future: New Physics Through.
Fine Pixel CCD Option for the ILC Vertex Detector
APV25 for SuperBelle SVD M.Friedl HEPHY Vienna. 2Markus Friedl (HEPHY Vienna)11 Dec 2008 APV25 Developed for CMS by IC London and RAL (70k chips installed)
Electronics/DAQ for SVD2+SVD3 KEK, 17 Nov 2004 Manfred Pernicka, HEPHY Vienna We want to investigate penguins!
High-resolution, fast and radiation-hard silicon tracking station CBM collaboration meeting March 2005 STS working group.
Pixel hybrid status & issues Outline Pixel hybrid overview ALICE1 readout chip Readout options at PHENIX Other issues Plans and activities K. Tanida (RIKEN)
DAQ Scheme and Beam Test Results H. Asano, M. Friedl, H. Hyun, T. Higuchi, C. Irmler, Z. Natkaniec, W. Ostrowicz, M. Pernicka, T. Tsubuyama.
Progress in the Development of a B-Factory Monolithic Active Pixel Detector Samo Stanič for the Belle Pixel Group M. Barbero 1, A. Bozek 4, T. Browder.
1 An introduction to radiation hard Monolithic Active Pixel Sensors Or: A tool to measure Secondary Vertices Dennis Doering*, Goethe University Frankfurt.
University of Nova GoricaBelle Collaboration S. Stanič, STD6, Sep , 2006 Status of the Belle Silicon Vertex Detector and its Development for Operation.
Vertex Detector for GLD 3 Mar Y. Sugimoto KEK.
Super-Belle Vertexing Talk at Super B Factory Workshop Jan T. Tsuboyama (KEK) Super B factory Vertex group Please visit
ASIC R&D at Fermilab R. Yarema October 30, Long Range Planning Committee2 ASICs are Critical to Most Detector Systems SVX4 – CDF & DO VLPC readout.
DAQ for 4-th DC S.Popescu. Introduction We have to define DAQ chapter of the DOD for the following detectors –Vertex detector –TPC –Calorimeter –Muon.
Vertex detector for the KEK B factory upgrade Toru Tsuboyama (KEK) 1 March 2008 Instr08 Novosibirsk.
FPCCD VTX Overview Yasuhiro Sugimoto KEK Tokubetsu-Suisin annual meeting 11.
Thin Silicon R&D for LC applications D. Bortoletto Purdue University Status report Hybrid Pixel Detectors for LC.
NUMI Off Axis NUMI Off Axis Workshop Workshop Argonne Meeting Electronics for RPCs Gary Drake, Charlie Nelson Apr. 25, 2003 p. 1.
Vertex 2005, Nikko Manfred Pernicka, HEPHY Vienna 1.
PHASE-1B ACTIVITIES L. Demaria – INFN Torino. Introduction  The inner layer of the Phase 1 Pixel detector is exposed to very high level of irradiation.
AMS HVCMOS status Raimon Casanova Mohr 14/05/2015.
FPCCD Vertex detector 22 Dec Y. Sugimoto KEK.
Technology Overview or Challenges of Future High Energy Particle Detection Tomasz Hemperek
LCWS08, Chicago, November 2008 Ladislav Andricek, MPI fuer Physik, HLL 1 DEPFET Active Pixel Sensors - Status and Plans - Ladislav Andricek for the DEPFET.
UK Activities on pixels. Adrian Bevan 1, Jamie Crooks 2, Andrew Lintern 2, Andy Nichols 2, Marcel Stanitzki 2, Renato Turchetta 2, Fergus Wilson 2. 1 Queen.
FPCCD VTX Overview Yasuhiro Sugimoto KEK Tokubetsu-Suisin annual meeting 11.
C. Kiesling, 1st Open Meeting of the SuperKEKB Collaboration, KEK, Dec , The DEPFET-Project: European Collaboration for a Pixel SuperBelle.
Jan24-26, 2008BNM2008 Atami, Japan1 Belle upgrade: Tracking and Vertexing T.Kawasaki(Niigata-U)
LHCb Vertex Detector and Beetle Chip
TC Straw man for ATLAS ID for SLHC This layout is a result of the discussions in the GENOA ID upgrade workshop. Aim is to evolve this to include list of.
1 CDC Readout - upgrade for Higher Luminosity - Y.Sakai (KEK) 29-Oct-2002 TRG/DAQ Review of Status/Plan (based on materials from S.Uno/M.Tanaka)
Pixel Atsushi Taketani RIKEN RIKEN Brookhaven Research Center 1.Overview of Pixel subsystem 2.Test beam 3.Each Components 4.Schedule 5.Summary.
Vertex detector R&D Work Plan in /3/11 Y. Sugimoto for KEK-Tohoku-TohokuGakuin-Niigata- ToyamaCMT Collaboration.
Rene BellwiedSTAR Tracking Upgrade Meeting, Boston, 07/10/06 1 ALICE Silicon Pixel Detector (SPD) Rene Bellwied, Wayne State University Layout, Mechanics.
RD program on hybrids & Interconnects Background & motivation At sLHC the luminosity will increase by a factor 10 The physics requirement on the tracker.
Jan. 25, 2011 Status of the Aerogel RICH Readout Trig/DAQ Meeting in Beijing 1 S. Nishida (KEK) S. Nishida Status of the Aerogel RICH Readout Belle II.
Pixel detector/Readout for SuperB T.Kawasaki Niigata-U.
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I Pavia, Italy.
Update on & SVT readout chip requirements
Si Sensors for Additional Tracker
SVT – SuperB Workshop – Annecy March 2010
Valerio Re Università di Bergamo and INFN, Pavia, Italy
 Silicon Vertex Detector Upgrade for the Belle II Experiment
BaBar Silicon Tracker Perspective
IOP HEPP Conference Upgrading the CMS Tracker for SLHC Mark Pesaresi Imperial College, London.
SVT – SuperB Workshop – SLAC 6-9 Oct 2009
INFN Pavia and University of Bergamo
Hybrid Pixel R&D and Interconnect Technologies
Silicon Pixel Detector for the PHENIX experiment at the BNL RHIC
SVT Issues for the TDR What decisions must be taken before the TDR can be written? What is the mechanism for reaching those decisions How can missing information.
SVT detector electronics
Francesco Forti SuperB Workshop LNF, March, 2006
Yasuhiro Sugimoto KEK 17 R&D status of FPCCD VTX Yasuhiro Sugimoto KEK 17
Trigger session report
FPCCD Vertex Detector for ILC
A new family of pixel detectors for high frame rate X-ray applications Roberto Dinapoli†, Anna Bergamaschi, Beat Henrich, Roland Horisberger, Ian Johnson,
Status of CCD Vertex Detector R&D for GLC
SVT detector electronics
Perugia SuperB Workshop June 16-19, 2009
Presentation transcript:

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Vertex Detector Overview and DSSD readout/trigger M. Hazumi (KEK) Overall Design Consideration Silicon Strip Readout Scheme Fast Trigger Plan Outline

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Overall Design Consideration Time-dependent CP Violation –In physics beyond the SM (e.g. B0   ’Ks,  Ks) –Time-dependent analyses for  1,  2 Time dependence in rare decays Special time-dependence [e.g. sin(2  1+  3)] Present resolution is adequate for signal events. However, Better resolution is required to separate signal from continuum Physics Requirements Better resolution is required for signal events.

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi  z resolution function Resolution is improved by narrower main Gaussian smaller 2 nd Gaussian component (e.g. tail) smaller beampipe radius less material robustness against fake hits small background occupancy more layers

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Z rr Impact parameter resolution (SVD1.4) Sufficient to measure sin2phi1, but not for rare decays

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi SVD1.4 5-layer SVD (a la Inner Tracker taskforce) Resolution with Rbp=1cm and Strip pitch = 50um Meet the Super KEKB requirement Further improvement possible by reducing material (expecially beampipe and the innermost pixel, as well as having a larger lever arm

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Better Impact Parameter Resolution Smaller-radius beampipe  Rbp = 1cm Good intrinsic resolution  50um or less Smaller amount of material  need studies ½ of present resolution seems feasible. 1/3 of present should be tried !

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Occupancy guesstimation vs. R (= DSSD radius) Trigger simulation study desirable Pixel for R < 3cm Pipeline for R < 10cm Large ambiguity even with dedicated simulation. Need to take the safe side.

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Rbp = 1cm 2-layer Pixel 3 or more DSSDs Rcdc > 15cm Configuration of SuperB VXD 15cm Extrapolating present hit rate and requiring the hit rate being less than the present, Rcdc > 12cm is “probably no problem”. DSSD w/ Pipeline readout CDC Additional DSSD layers

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Requirements on Silicon Strip Readout Good S/N (> 20) Small Occupancy (< 5%) Small Deadtime ( < 10usec/event ) Radiation Hardness (up to 40Mrad) Fast Trigger Capability External Noise Immunity (tolerance for CMN ~1000e-) Readiness in 2006 (“Evolution” rather than “Revolution”) Choice of readout chip is essential.

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Readout chips for DSSDs Exp chip process pipeline fasttrig principle Belle VATA AMS 0.8umxo cnt. Shaping. Analogue BaBar AtoM Honeywellox Time-over-Threshold CLEO FE/BE Honeywellxx on-hybrid ADC, Digital ZEUS Helix AMS 128cellsx Analogue (non-radhard) CDF II SVX4 IBM ? um 47cellsx FE/BE architecture double-corr. Sampling periodic reset, Digital CMS APV25 IBM 0.25um 192cells x Analogue ATLAS ABCD? 132cellsx Binary LHCb SICA-VELO DMILL BEETLE 0.25um 160cells? Analogue (BelleFELIX(+TA) AMS0.35um O(100)o Analogue)

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi APV25 for CMS Silicon Tracker Tp = 50nsec, 40MHz sampling Pipeline depth = 192cells  4.8usec 128ch/chip  readout latency well below 10usec Reasonable S/N –246e- + 36e-/pF ( + deconvolution effect) Usage for “DC beam” (B factory)  S/N degradation by ~12%

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Deadtime-less pipeline Readout time = 1/20MHz x 128ch = 6.4us No deadtime during readout (unless the address FIFO is full). Also periodic reset is not necessary (continuous shaping). 192-cell ring buffer (4.8us) address stored in 32-depth FIFO is skipped. write pointer read pointer Trigger 32-depth FIFO (to store cell address) (3 consecutive cells / event)

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi APV25 test setup in Vienna APV Hybrid and APV Hybrid+silicon detector Repeater APV sequencer VME-I 2 C VME-ADC VME PC control software clock/trig/reset/power Clock Analog Data I2CI2C Contract-related issues should be solved to use APV25 at Super KEKB.

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi K. Uchida

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi L1.5-like L1 with APV25 SVD2 adopts L1.5 trigger used as “abort” for other CDC/ACC/TOF/ECL/KLM … work as “L1” for SVD L1.5-like L1 for all detector components as SuperB A plausible solution CDC trigger used as “L0” for SVD (latency should be less than 4us) Cost ? Proposal by Manfred Pernicka (Vienna) APV25 ADC 20MHz (or 40MHz) 128ch 6.4us (= T 0 ) L1.5-like L1 trigger FPGA CDC trigger L1 ~2T 0 2T 0 +  Total latency depends on the choice of the chip can be shorter

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Real L1 trigger from VXD No “readily available” solution Chip modifications ? –APV25 with fast trigger –Felix + TA (“all IDEAS” solution) Pipelined VATA in other words Dedicated detector ? –Straw tube (high resistivity) for z information ? Large amount of R&D may be required. Need to know if L1 from VXD is really needed (e.g. simulation studies).

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Three issues Short bunch-crossing period at KEKB (2ns) –Essentially DC beam (collisions happen anytime) –40MHz pipeline can be off-timing by 12.5ns; ¼ of the peaking time (Tp = 50ns)  S/N degradation probably tolerable Requirement for fast SVD trigger (L1) –L1 group thinks it essential to have the fast SVD trg. –No available readout chip that has both pipeline readout and fast triggering capability. –L1.5-like L1 seems the plausible solution (other detector components need sufficient buffer length) Contract –It may not be so easy to use existing chips Development of our own pipeline chips ?

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Possible scenario for VTX readout Default option –hybrid pixel detector for the innermost layer (or two) –DSSD with pipeline readout for other layers –L1.5-like L1 trigger Backup for pixel –mini-strip DSSD with pipeline readout on Day 1 –real pixel detector for upgrade Option –TA-like fast trigger (need a pipelined VATA)

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Schedule Oct. 26, 021 st SuperB VTX meeting late Nov.022 nd SuperB VTX meeting late Dec.02 or Jan.033 rd SuperB VTX meeting Feb.03LCPAC report …. monthly meetings for progress reports …. Aug.03 or Sep.03HL04 workshop  LoI Feb (?) 04Official proposal to LCPAC

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi R&D items for Pixel: initial assignments Sim. study for Pixel requirements Background study and IR design(Yamamoto) TRACKERR study on thickness and pixel size (Trabelsi) GEANT preparation (if necessary)(Hara) Hybrid pixel detector development joint effort with HPK (e.g. floating pixel)(Hazumi) Bump bonding (with HPK or else) Thinning Monolithic pixel detector development (Palka) Pixel readout chip selection gaining experience with ALICE pixel(Kawasaki, Tanaka) Hawaii R&D  beamtest ?(Varner) Cooling, mechanical structure (Rosen) Monitoring (Tsuboyama)

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi R&D items for DSSD: initial assignments pipeline readout chip gaining experience with APV25(Kawasaki) Discussion with IDEAS(Hazumi) Backend electronics Trigger L1.5-like L1(Pernicka**) Detector configuration Large-area detector floating strip design(Tsuboyama, Hazumi) Cooling, mechanical structure (Rosen) Monitoring (Tsuboyama) ** To be confirmed

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Backup Slides

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Hit rate (occupancy) guesstimation SVD occupancy (now) = 3~5% (innermost) Assume occupancy  annual dose –Annual dose estimated to be 7.3MRad at super KEKB (r=1cm beampipe, see EoI for detail) Assume DSSD with the same pitch but with the length scaled to be half For r=1cm beampipe, DSSD occupancy ~ 274% for an area of 50um x 2.7cm and Tp = 1usec (time window for noise ~ 3usec.) –Need pixel detectors To achieve 1% occupancy, pixel size of 50um x 100um is required. –Requirement relaxed for faster time window.

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Inner Tracker Task Force (2000) Rbp = 1cm 5layer DSSDs VATA1 readout Fast trigger

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Material Budget LC VTX  more ambitious design. Cf. NIM A473 (2001) 86 Thin CCD (0.12% X0) Beryllium substrate (0.09% X0)  Goal : 4  4/(psin3/2theta) (um) ! SVD % (X0) 5layer3.37% (X0)

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Requirement on readout latency Trigger Rate for 10^35cm^-2s^-1 expect. design Background2kHz 5kHz Physics1kHz 1kHz Datasize100kB 100kB L1 Data flow300MB/s 600MB/s At storage150MB/s 225MB/s ~10usec/event for 5% 5kHz trigger rate Rather difficult with present scheme Pipeline scheme is better.

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Fast readout Column-parallel CCDs –Incread readout speed by two orders of magnitude Provide each column with its own output port Clocking the imaging region at 50MHz –~65Gpixels/s  readout time of ~50us –Beampipe radius = 10mm

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Requirements on pixel Size ~ 50um x 100um for occupancy ~1% Thickness < 300um to minimize Coulomb scattering Rad hard up to 30MRad (for 4years operation) S/N >= 20 CMN < 500e- Fast readout

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi R&D on a fast CCD vertex detector (A. R. Gillman NIM A473 (2001) 86) Demand for LC Present best = SLD VXD3 –Res.(rphi) = /(p x sin3/2theta) [um] –Res.(rz) = 17+33/(p x sin3/2theta) [um] –Material : 0.4% X0/layer) –Beampipe radius = 24mm

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Requirements for LC VXD SLD VXD3  LC VXD –Res.(rphi) = 4 + 4/(p x sin3/2theta) [um] –Res.(rz) = 4 + 4/(p x sin3/2theta) [um] –Material : 0.06% X0/layer) –Beampipe radius = 10mm

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi CLEO III FE/BE FE (front-end chip) –Preamp+shaper+gainstage –CR-RC shaper –Shaping time 0.7 ~ 3.0us –Baseline subtraction circuit –Similar to VA BE (back-end chip) –Based on SVX-2b back-end – bit Wilkinson ADCs, comparators and FIFO buffers

miniDAQ workshopOctober 29 – 30, 2002M. Hazumi Better impact parameter resolution –Smaller-radius beampipe  Rbp = 1cm –Good intrinsic resolution  50um good enough –Optimized material budget  Yamada-san will think about it. Reasonable hit rate (occupancy) –IR and mask design  Simulation done with Rbp = 1cm –Higher CDC hit rate  DSSD up to R = 15cm (2PXD + 4~5DSSD) Readout electronics  ~ 10us/event for 5% deadtime at 5kHz –Fast readout for pixel  Talk by Andrzej Bozek –Pipeline readout for strip  APV25 etc. : optimization for DC beam ? Trigger capability –Fast (level 1) trigger ?  ? : APV25 with fast trig, Felix+TA –Level 2 trigger  Feasible (difficulty depends on required latency) Radiation hardness –Deep-submicron technology  0.25um OK up to 30Mrad Choice of sensors –Pixel (MAPS, hybrid, CCD)  Talk by Andrzej Bozek –Large area DSSDs  Technology already available Installation in 2006  Established technologies as much as possible Overall Design Consideration (Summary)