Overview of MCP requirements: resistive layer and SEE A. S. Tremsin, O. H. W. Siegmund Space Sciences Laboratory University of California at Berkeley Berkeley,

Slides:



Advertisements
Similar presentations
General Characteristics of Gas Detectors
Advertisements

LECTURE- 5 CONTENTS  PHOTOCONDUCTING MATERIALS  CONSTRUCTION OF PHOTOCONDUCTING MATERIALS  APPLICATIONS OF PHOTOCONDUCTING MATERIALS.
Geiger-Muller detector and Ionization chamber
INSTITUT MAX VON LAUE - PAUL LANGEVIN Fast Real-time SANS Detectors Charge Division in Individual, 1-D Position- sensitive Gas Detectors Patrick Van Esch.
Joe Vinen Workshop on New Experimental Techniques for the Study of Quantum Turbulence, ICTP, Trieste, June 2005 Metastable He molecules and laser-induced.
Speed-I View from Material Side Qing Peng, Anil U. Mane, Jeffrey W. Elam Energy Systems Division Argonne National Laboratory Limitations on Fast Timing.
Atsuhiko Ochi Kobe University 4/10/ th RD51 collaboration meeting.
Photomultipliers. Measuring Light Radiant Measurement Flux (W) Energy (J) Irradiance (W/m 2 ) Emittance (W/m 2 ) Intensity (W/sr) Radiance (W/sr m 2 )
The Factors that Limit Time Resolution in Photodetectors, Workshop, University of Chicago, April 2011 What is known experimentally about timing determinants.
O. Siegmund 11/15/11 20 cm and 33mm MCP Test Progress Lifetest with #164/163 continues – now close to 2 C cm -2 New batch of 33mm test MCPs arrived Chem-3.
Optical image tube with Medipix readout
Detection Methods Coherent ↔ Incoherent Photon Detection ↔ Bolometric Photon Counting ↔ Integrating.
SPIE Instr. for Astronomy, Marseille, John Vallerga, Optically sensitive MCP image tube with a Medipix2 ASIC readout John Vallerga,
SPIE IR and Photoelect. Imagers and Detector Devices J. McPhate Jason McPhate, John Vallerga, Anton Tremsin and Oswald Siegmund Space Sciences.
Photon Counting Sensors for Future Missions
9th IWoRiD: Erlangen,July 2007, John Vallerga High resolution UV, Alpha and Neutron Imaging with the Timepix CMOS readout J. Vallerga, J. McPhate, A. Tremsin.
Space Astronomy: The UV window to the Universe, El Escorial, May 2007, John Vallerga The current and future capabilities of MCP based UV detectors J. Vallerga,
Medipix2 meeting Dec Medipix Activity at Berkeley John Vallerga, Jason McPhate, Anton Tremsin and Bettina Mikulec.
SPIE Instrumentation for Astronomy AO - June22, 2004 John Vallerga, Jason McPhate, Anton Tremsin and Oswald Siegmund Space Sciences Laboratory, University.
2nd Zwicky Informal Workshop - Berkeley 2005 May 26, 2005John Vallerga John Vallerga, Barry Welsh, Anton Tremsin, Jason McPhate and Oswald Siegmund Experimental.
Fiber Optic Receiver A fiber optic receiver is an electro-optic device that accepts optical signals from an optical fiber and converts them into electrical.
Lecture 11  Production of Positron Emitters, Continued  The Positron Tomograph.
Ion Collectors and Detectors
Overview of Scientific Imaging using CCD Arrays Jaal Ghandhi Mechanical Engineering Univ. of Wisconsin-Madison.
10 Picosecond Timing Workshop 28 April PLANACON MCP-PMT for use in Ultra-High Speed Applications.
ALD 20µm Microchannel Plates
Introduction on SiPM devices
Photon detection Visible or near-visible wavelengths
Measurement and modeling of hydrogenic retention in molybdenum with the DIONISOS experiment G.M. Wright University of Wisconsin-Madison, FOM – Institute.
Fast Detectors for Medical and Particle Physics Applications Wilfried Vogel Hamamatsu Photonics France March 8, 2007.
Measurement Results Detector concept works! Flood fields show MCP fixed pattern noise that divides out Spatial resolution consistent with theory (Nyqvist.
MPPC Radiation Hardness (gamma-ray & neutron) Satoru Uozumi, Kobe University for Toshinori Ikuno, Hideki Yamazaki, and all the ScECAL group Knowing radiation.
1 Components of Optical Instruments Lecture Silicon Diode Transducers A semiconductor material like silicon can be doped by an element of group.
Yiting Zhangb, Mark Denninga, Randall S. Urdahla and Mark J. Kushnerb
Photodetection EDIT EDIT 2011 N. Dinu, T. Gys, C. Joram, S. Korpar, Y. Musienko, V. Puill, D. Renker 1 Micro Channel plate PMT (MCP-PMT) Similar to ordinary.
WSO/UV-LSS Detector with large dimension MCP Baosheng Zhao* National Astronomical Observatories of CAS *
High-Temp Life Test #1 Update Jason McPhate LAPP Tuesday Telecon 17 May 2011.
Microchannel plates have been a workhorse detector for NASA (+ESA) space-based UV missions Continue to be proposed for future Explorer and sounding rocket.
10/26/20151 Observational Astrophysics I Astronomical detectors Kitchin pp
GEM: A new concept for electron amplification in gas detectors Contents 1.Introduction 2.Two-step amplification: MWPC combined with GEM 3.Measurement of.
Design and fabrication of electrical measurement system for microchannel plates (LAPD weekly group meeting) Feb Anil Mane, Qing Peng, Jeffrey Elam.
Observational Astrophysics I
Improvement of Infrared Lights Sensitivity on PZT EMITER Daisuke Takamuro, Hidekuni Takao, Kazuaki Sawada and Makoto Ishida.
MCP MicroPitting and Performance Issues Latest 40µm pore 8” MCPs had some patchy discoloration Cleaning using standard techniques at SSL made no difference.
Xiaozhong Zhang, Xinyu Tan, Lihua Wu, Xin Zhang, Xili Gao, Caihua Wan National Center for Electron Microscopy (Beijing) Laboratory of Advanced Materials.
Space Sciences Laboratory, University of California, Berkeley Arradiance ALD/Incom MCP Scrub and Life Test Incom substrate 40µm pores, 8 deg bias, 40:1.
March 28-April, Particle Acceleratior Conference - New York, U.S.A. Comparison of back-scattering properties of electron emission materials Abstract.
Techniques for Nuclear and Particle Physics Experiments By W.R. Leo Chapter Eight:
Space Sciences Laboratory, University of California, Berkeley SSL-UCB, ALD MCP Test Progress ML201-B-2 12nm ALD After cleaning ML201-B-1 6nm ALD.
Atomic Layer Deposition for Microchannel Plates Jeffrey Elam Argonne National Laboratory September 24, 2009.
33mm MCP Testing at UC Berkeley
Lecture 3-Building a Detector (cont’d) George K. Parks Space Sciences Laboratory UC Berkeley, Berkeley, CA.
Atomic Layer Deposition for Microchannel Plate Fabrication at Argonne
Fluoroscopy. Real-time imaging Most general-purpose fluoroscopy systems use TV technology, operating at 30 frames/sec May be recorded (barium swallow.
Chem. 133 – 2/11 Lecture. Announcements Lab today –Will cover 4 (of 8) set 2 labs (remainder covered on Tuesday) –Period 1 will extend one day Website/Homework.
MCP Testing Using Square Conductive Pads as Readout Anode Sagar Setru 1/19/2014.
Fluroscopy and II’s. Fluroscopy Taking real time x-ray images Requires very sensitive detector to limit the radiation needed Image Intensifier (II) is.
Gain and Time Resolution Simulations in Saturated MCP Pores Valentin Ivanov, Zeke Insepov, Sergey Antipov 1 First Author Institution, 2 Second Author Institution,
O. Siegmund, UCB, SSL 1 Incom substrates, 33mm diameter, no notches 20µm pores, 8 deg bias, 60:1 L/D, 65% OAR ANL processed for resistive and emissive.
Study of the cryogenic THGEM-GPM for the readout of scintillation light from liquid argon Xie Wenqing( 谢文庆 ), Fu Yidong( 付逸冬 ), Li Yulan( 李玉兰 ) Department.
Electric Pressure Transducer
Chem. 133 – 2/14 Lecture.
Digital Light Sources First introduced in 2001.
Resident Physics Lectures
ADvanced MOnolithic Sensors for
THGEM: Introduction to discussion on UV-detector parameters for RICH
SSL-UCB, ALD/Incom MCP Test
Arradiance ALD/Incom MCP Test
Computed Tomography (C.T)
The MPPC Study for the GLD Calorimeter Readout
Presentation transcript:

Overview of MCP requirements: resistive layer and SEE A. S. Tremsin, O. H. W. Siegmund Space Sciences Laboratory University of California at Berkeley Berkeley, CA LAPD collaboration meeting, October 15-16, 2009, Argonne National Laboratory

Fixed MCP properties MCP manufacturing –Specified geometry is selected –Certain MCP resistance is targeted –Good SEE emission layer –Metallization –Preliminary (simple) testing –Storage/transportation

Resistive and emission layers: preconditioning MCP manufactured and shipped First inspection and operation Gain, uniformity, hotspots Conformality to each other Preconditioning: scrubbing Real use

Resistive and emission layers: preconditioning Would be nice to have MCPs being ready for use as shipped

MCP preconditioning As manufactured MCPs require substantial preconditioning –Geometrical and resistive conformality (MCP stacks) –Outgasing (sealed tubes) –Gain stabilization (high counting rate applications) –Hot spots (can be reduced by self-scrubbing) Most of these are defined by the resistive and emissive layer properties Present technology: MCP substrate defines both geometry and functional properties (through resistive/emissive layers)

Novel MCP technology Separate substrates characteristics from the MCP operational properties –Nano-engineered films Synkera with AAO Arradiance with glass and plastic substrates LAPD collaboration Tune resistive/thermal/outgasing/lifetime properties separately Large selection of materials

Two distinct modes of MCP operation Current amplification (e.g. image intensifiers) –Low gain (<10 4 ) –Moderately to high input fluxes –Usually frame-based readouts (CCD, CMOS) –Limited dynamic range –Timing resolution is limited to readout frame rate Event counting –Moderately to high gain for single particle detection ( ) –Low input fluxes –Typical count rates 0.1 – 10 6 cps (can be as high as 10 8 with low noise readouts, e.g. Medipix) –Both spatial and temporal information on each detected event –More sensitive to gain reduction from ageing, ion feedback

Ideal electron amplifier (MCP) Substrate –No geometrical distortions –Mechanically robust in large formats –Compatible with large processing temperatures –Low outgasing/contaminating films deposited above –Small pores (ultimate limit of spatial resolution) –Cheap –Easy to manufacture Conductive film –Accurately controlled resistance in a wide range (small format MCP/ large format / large/small pores) –Thermal coefficient of resistance is positive (self regulating/avoiding thermal runaway) –Does not require high deposition temperatures –Vacuum compatible –Can be baked without changing its properties (required for tube production) –Repeatable Emissive film –High secondary electron emission coefficient (high gain, low operational voltage, smaller L/D/ number of plates –Stable under electron bombardment –Can be baked without changing its properties (required for tube production) –Low outgasing –Efficient charge replenishment –Good photoelectron sensitivity (no need for a separate photocathode) V1V1 V2V2 I strip

Ideal electron amplifier (MCP) Substrate –No geometrical distortions –Mechanically robust in large formats –Compatible with large processing temperatures –Low outgasing/contaminating films deposited above –Small pores (ultimate limit of spatial resolution) –Cheap –Easy to manufacture V1V1 V2V2 I strip

Ideal electron amplifier (MCP) Conductive film –Accurately controlled resistance in a wide range (small format MCP/ large format / large/small pores) –Thermal coefficient of resistance is positive (self regulating/avoiding thermal runaway) –Does not require high deposition temperatures –Vacuum compatible –Can be baked without changing its properties (required for tube production) –Repeatable V1V1 V2V2 I strip

Ideal electron amplifier (MCP) Emissive film –High secondary electron emission coefficient (high gain, low operational voltage, smaller L/D/ number of plates –Stable under electron bombardment –Can be baked without changing its properties (required for tube production) –Low outgasing –Efficient charge replenishment –Good photoelectron sensitivity (no need for a separate photocathode) V1V1 V2V2 I strip

Existing technology Substrate –No geometrical distortions –Small pores (ultimate limit of spatial resolution) –Mechanically robust in large formats –Compatible with high processing temperatures –Low outgassing, not contaminating films deposited above –Cheap –Easy to manufacture Conductive film –Accurately controlled resistance in a wide range (small format MCP/ large format / large/small pores) –Thermal coefficient of resistance is positive (self regulating/avoiding thermal runaway) –Does not require high deposition temperatures –Vacuum compatible –Can be baked without changing its properties (required for tube production)? –Repeatable Emissive film –High secondary electron emission coefficient (high gain, low operational voltage, smaller L/D/ number of plates) –Stable under electron bombardment –Can be baked without changing its properties (required for tube production)? –Low outgassing –Efficient charge replenishment –Good photoelectron sensitivity (no need for a separate photocathode) Definitely needs improvement Relatively good

Existing technology Substrate –No geometrical distortions –Small pores (ultimate limit of spatial resolution) –Mechanically robust in large formats –Compatible with high processing temperatures –Low outgassing, not contaminating films deposited above –Cheap –Easy to manufacture Definitely needs improvement Relatively good

Existing technology Conductive film –Accurately controlled resistance in a wide range (small format MCP/ large format / large/small pores) –Thermal coefficient of resistance is positive (self regulating/avoiding thermal runaway) –Does not require high deposition temperatures –Vacuum compatible –Can be baked without changing its properties (required for tube production)? –Repeatable Definitely needs improvement Relatively good

Existing technology Emissive film –High secondary electron emission coefficient (high gain, low operational voltage, smaller L/D/ number of plates) –Stable under electron bombardment –Can be baked without changing its properties (required for tube production)? –Low outgassing –Efficient charge replenishment –Good photoelectron sensitivity (no need for a separate photocathode) Definitely needs improvement Relatively good

–Resistance of the pore Limited number of counts per pore per second next event with the same gain can only occur after the wall charge is replenished Typical event transit time ~100 ps Typical pore resistance ~10 15  Pore current I strip ~1pA Positive wall charge builds up on the pore walls, mostly at the bottom where the amplification is the highest. Typical pore capacitance F Recharge time ~ RC = 1 ms Only portion of that charge replenishes the wall positive charge through tunneling V1V1 V2V2 I strip Pulsed operation: event counting

–Assuming 8” MCP can sustain 60 o C operation –Q Rad ~ 3.5 Watt for 20 cm MCP –V MCP ~1 kV => I Strip ~ 3.5 mA => R MCP ~286 M  (radiative heat dissipation only) –Assume we can sustain 10x lower resistance through heat conduction on the spacers - R MCP ~30 M  –20 cm diameter MCP, with 20  m pores on 24  m centers has ~63E6 pores –R Pore ~ 1.9E15 , I Pore ~ 0.5 pA –10% of strip current can be extracted as charge => I out ~ 0.05 pA/pore –Assume output charge value of 10 6 e/pulse, 10 pores involved in each pulse => 33 events/pore/s With these assumptions: typical local count rate will be limited to ~100 events/pore/s However, we observed 10x better performance locally: charge is shared by the neighboring pores (?) V1V1 V2V2 I strip Rough estimate of MCP stable resistance and local count rate

A.S. Tremsin et al., Proc. SPIE 2808 (1996) pp The ageing effect is not localized to only illuminated area

Ageing of microchannel plates Gain reduction is due to changes in the conduction/emission films and/or their interfaces

MCP gain reduction effect: ageing under irradiation Flat field image Long integration image Gain~10 5 Rate >10 MHz/cm 2 Accumulated dose ~0.01 C/cm 2 Uniform flat field illumination Normalized by initial flat field No preconditioning of the detector was performed

MCP gain reduction effect: ageing under irradiation 14 mm Uniform flat field image (neutrons) Resolution mask image Gain~10 5 Rate ~ 3 MHz/cm 2 Accumulated dose ~0.001 C/cm 2 Almost uniform flat field illuminaiton UV photons No preconditioning of the detector was performed Preconditioning is required for stable gain operation! It is always done during standard tube manufacturing process.

MCP gain reduction effect: ageing under irradiation 14 mm Uniform flat field image (neutrons) Resolution mask image Gain~10 5 Rate ~ 3 MHz/cm 2 Accumulated dose ~0.001 C/cm 2 Almost uniform flat field illuminaiton UV photons No preconditioning of the detector was performed Different applications may require completely different preconditioning procedure: Rate of scrubbing Input current Gain/voltage at the scrubbing High gain detectors are usually scrubbed at low gain to allow more uniform scrub along the pore

What has changed in conduction/emission layers? Lower gain - SEE is reduced –Is it due to change in the bulk properties of the emission layer (impurities/electron traps migration or redistribution)? –Is it surface contamination? scrubbing at different pressures should lead to different ageing curves –Changes in the interface with the conduction layer?

SEE surface of lead-glass MCPs A.M.Then, C.G. Pantano, J. Non-crystalline Solids 120(1990) 178

SEE surface of lead-glass MCPs: ageing B. Pracek, M. Kern, Appl. Surf. Sci. 70/71 (1993) 169 Concentration of K atoms (likely due to ion diffusion process) is greatly increased on the surface after ageing. Also small increase of carbon contamination was observed.

SEE surface of lead-glass MCPs: ageing A.M.Then, C.G. Pantano, J. Non-crystalline Solids 120(1990) 178

SEE surface of lead-glass MCPs: ageing A.M.Then, C.G. Pantano, J. Non-crystalline Solids 120(1990) 178

Resistance coefficient of MCP: thermal runaway –negative coefficient of resistance –poor heat dissipation in MCP detectors –certain gain required to detect individual events Limited local count rate: fixed amount of charge extracted from local area Tradeoff between gain (resolution) and local count rate V1V1 V2V2 I strip R. Colyer et al., Proc. SPIE (2009)

MCP thermal runaway A.S. Tremsin et al., Proc. SPIE 2808 (1996) pp A.S. Tremsin et al., Nucl. Instr.Meth. 379 (1996) pp

Conduction layer and thermal stability of MCPs A.S. Tremsin et al., Rev. Sci. Instr. 75 (2004) pp Need very good control of the resistance value of the conduction layer. Not only as manufactured but also through the entire tube production process.

Si MCP thermal coefficient Different manufacturing process, no lead glass, alkali metal doping; still similar value of TCR A.S. Tremsin et al., Rev. Sci. Instr. 75 (2004) pp

Thermally stable MCPs Conduction film with positive thermal coefficient: MCP self regulation increased local count rate saturation increased strip current increase Joule heat temperature increases resistance increases locally reduced heat generation MCP substrate with excellent thermal conduction and spacers will help to improve heat dissipation

Can bulk conductive substrate be an alternative to conduction layer? V1V1 V2V2 I strip V1V1 V2V2 Reduced ion feedback E ions T. W. Sinor et al., Proc. SPIE 4128 (2000) 5. Making bulk-conductive glass microchannel plates Jay J.L. Yi, Lihong Niu, Proc. SPIE 68900E-1 (2008) Much more heat will be generated as very small fraction of strip current will be used for charge replenishment

Stable conduction and emission films Both thermal coefficient  T and voltage-dependent coefficient  V of the conduction film should be very small Do not change properties under electron bombardment A stable SEE layer with low emission is better than high SEE film which changes as device operates Both increase of gain and gain reduction are equally bad. The low/high gain can be compensated by accelerating voltage

Improved interface between conduction and emission films Currently only ~10% of strip current can be extracted as output current, the rest of it is only generating extra heat Will be very good if that fraction of useful current can be increased. Pore saturation mechanism is very important.

Conduction and emission film requirements Conduction film –Accurately controlled resistance in a wide range (small format MCP/ large format / large/small pores) –Thermal coefficient of resistance is positive (self regulating/avoiding thermal runaway) or close to zero –Does not require high deposition temperatures –Vacuum compatible –Can be baked without changing its properties (required for tube production)? –Repeatable Emissive layer –High secondary electron emission coefficient (high gain, low operational voltage, smaller L/D/ number of plates) –Stable under electron bombardment –Can be baked without changing its properties (required for tube production) –Low outgassing –Efficient charge replenishment Compatible with large format MCP plates visible photocathodes tube sealing Stable Cheap Repeatable