Alpine pixel layout Integration progress Teddy Todorov For the ATLAS-LAPP group AUW Integration meeting 20/11/2012.

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Presentation transcript:

Alpine pixel layout Integration progress Teddy Todorov For the ATLAS-LAPP group AUW Integration meeting 20/11/2012

CAD model

¼ view (half in Z and half in phi)

All services out of tracking acceptance! (lines correspond to eta=2.5 from z=-15cm) Fast connectivity of the Pixel package Concentration of services Small number of robust connectors

Installation & maintenance challenge Installation in highly radioactive environment Human interventions limited to hours Pixel detector design must allow for fast insertion and removal Without removal of beam pipe Clamp shells design Compatible with a small opening of ATLAS Split at Z=0 Fast services connection/disconnection Cooling manifolds and patch panels part of pixel package Small number of external connectors

Split at Z=0 with overlap 1 mm clearance around module 1.5 mm overlap 1 mm clearance around module 1.5 mm overlap

Pixel package interconnection board Services routing, data concentration, conversion to optical External Electrical connectors

Layers 2 and 3 connects from outside, layers 0,1 from inside

Stave flex routing to the boards

Inner layers flexes

Cooling pipes manifolded in the space between layer 3 and the cards Small number of external cooling connections (~20 per side)

Inner layers tube fittings allow disconnection and removal of 2 inner layers without disturbing the services of the outer 2 layers

Outer layers after the removal (or before the installation) of the inner layers

Alpine pixel layout for Letter of Intent comparisons Letter of Intent baseline pixel layout 4.6 m 2 pixel area 8.2 m 2 pixel area EOSEOS Pixel interconnection board applicable to other layouts

Material comparison In the Alpine layout all material is on the stave In the LoI layout the services material is playing a big role Alpine LoI Current ATLAS LoI: EOS cards only, no cables, no pipes

Summary Fully integrated pixel package for fast installation and maintenance Installation/removal time of entire pixel comparable to that of the inner 2 LoI layers Inner 2 layers replaceable without disconnecting outer layers Pixel interconnection boards Electrical to optical conversion – reduced services Multi-fibre (<=24) optical connectors reduce connection time 2 to 3 external electrical connectors per board 16 boards per side Manifilding in the mpackage Mandatory for fast installation