Laser drilling of a Copper Mesh

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Laser drilling of a Copper Mesh 7th RD51 Collaboration Meeting 13-15 April 2011 - CERN Laser drilling of a Copper Mesh Vincenzo Berardi U.O.S. Bari, Italy Dip. Interuniversitario di Fisica “M. Merlin”

Laser Ablation Definition Laser ablation is the process of removing material from a solid surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Timescales of the laser ablation process fs ps ns µs energy absorption by free electons electron - lattice energy transfer ablation by phase explosion or evaporation Thermal diffusion Melting and resolidification Mazur et al. Nature Materials 2, 217 (2002) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Laser drilling strategies for high accuracy Trepanning optic for helical drilling F. Dausinger et al., Springer (2004) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Thermal Conductivity (W m-1 K-1) Vaporization temperature (°C) Cu Parameters Material Density (g cm-3) Thermal Conductivity (W m-1 K-1) Melting point (°C) Vaporization temperature (°C) Copper Metal 8.94 400 1084 2562 Finding optimal laser process parameters (pulse duration, wavelength, fluence, drilling strategy) Copper oxide around the hole walls (post process cleaning could be required) Advantages Flexible technology: complete control of the hole morphology (taper, diameter) and geometry (density of the holes mm-2, distribution) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Microchip laser fiber amplifier (100 ps) Quasi-monolithic Q-switched microchip laser mm Pump diode 0.55 m PM-DC 1.5 m PM-PCF 18 Watt 5 Watt Yb-doped photonic crystal fiber Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

CNR-IFN Bari - Laser materials processing lab Short pulse 100 ps fiber laser Specifications Wavelength 1064 nm Pulse duration 100 ps Repetition rate ≈ 100 kHz Pulse energy max. 100 μJ Average power 10 W Peak power max. 1 MW Collaboration CNR-IFN Bari FSU JENA Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Post process Analysis Electron Microscopy - Field Emission EDS (EDX) (Energy Dispersive X-ray Spectroscopy) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

A look at the surface(s) 5m 18m 5mm layer front surface 5 mm layer back surface Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

EDS Metallic surface Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Single layer drilling Array of 400 x 400 holes 1cm x 1 cm (post processing 20 x 20) Average Pitch (center to center) d = 24mm Average size (diameter) = 13 mm Laser Power = 500mW Overall processing time = 2 hours and 30 mins 5m 18m Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Single layer drilling 5m 18m Diameter (mm) Pitch (mm) 5mm layer 13.10 (0.8) 24.50 (1) 18 mm layer 7.50 (0.8) 23.55 (1) Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Double layer drilling 5mm 18mm 1 2 3 4 Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Double layer drilling 5mm 18mm 1 2 3 4 Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

EDS Hole edge Between holes 5m 18m Hole edge Between holes Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

EDS Near Hole edge Hole edge 5m 18m Near Hole edge Hole edge Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

Summary Cu meshes can be drilled to obtain 12-14 micron diameter holes with a pitch of 20-25 microns (focusing spot down to < 10 μm) Only percussion drilling can be reliably used and Oxide formation can be limited but not avoided by flowing inert gas on the surface. Contamination can be reduced by changing the geometry as follows 5m 18m Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting

IFN Group INFN Group Antonio Ancona CNR-IFN, Staff Teresa Sibillano Francesca Di Niso Dept of Physics, PhD student INFN Group Gabriella Catanesi INFN, Staff Vincenzo Berardi Dept of Physics, Staff Emilio Radicioni Vincenzo Berardi - 14 April 2011 CERN – 7° RD51 Collaboration Meeting