WP3_Bham; 29May 2014; John Wilson1 Heated plate curing Tests with 130nm hybrids and glass ASICs the glue thickness is controllable. i)Room temp curing.

Slides:



Advertisements
Similar presentations
Bardia Baheri Rotary High Voltage Motor Physics project.
Advertisements

Adhesives And Their Uses
Tenon Cork Replacement Remove all the old cork plus any residue of the old glue Use the tenon itself to measure where to cut the replacement cork strip.
By: Alex Brett, R.T.P.O.(c).  Cast (with minimum 2” of plaster above trim line)  400ML Silicone Cartridge (durometer of your choice)  400ML Injection.
 Torque is the tendency of a force to cause or change rotational motion of a body.
Hybrid assembly at Glasgow. Placing ASICs Arrange 20 ASICs in ASIC tray with strip bond pads facing outwards – ASICs to be used in ‘Cat A’ sample boxes.
Design Ash finished electric hybrid tracing to connector fields –Changes to allow for HCC-less and HCC running on one hybrid awaiting final confirmation.
Specification section 3.3
SEACORK INSTALLATION ON A CATAMARAN The first step is to make templates of all corner pieces to be cut from sheet material, which will be used for border.
Standard Grade Craft & Design Gameboy Storage Box By Jo Bloggs SCN: Spring 2005.
Sample Preparation or Sample Prep. Always Handle samples with GLOVED HANDS!
PERSISTENT SURVEILLANCE FOR PIPELINE PROTECTION AND THREAT INTERDICTION Micromachining of Inertial Confinement Fusion Fast Ignition Targets Michael Mauldin.
Physics 101: Lecture 26, Pg 1 Physics 101: Lecture 26 Temperature & Thermal Expansion l Today’s lecture will cover Textbook Sections
Placing glue dots 18 x 18 (324) dots on 5mm grid takes ~5min.
Sectioning or Microtomy
Drafting Rear Elevations. Start with outer frame when drafting standard flat. Heights are generally in multiples of 2’-0”. Outer Frame.
Stave core assembly Stephanie Yang WP4 face to face meeting, Lancaster University 20 Feb 2014.
Wall Coverings  Selected according to: ○ Function ○ Size ○ Existing furnishings ○ Budget ○ Maintenance.
TOOL: Radial Arm Saw NEXT STEP: Radial Arm Saw RESULTS: Finish Top Apron Pieces at 9” L x 4” W x ¾ “ Th PROJECT Square Plant Stand PART Top Apron # NEEDED.
Preparing & Exposing Photographic Silkscreens For use with Lesson 3 FOR EDUCATION USE ONLY ©2009 The Andy Warhol Museum, a museum of Carnegie Institute.
CONSTRUCTING A FIVE CABIN LATRINE
IB stave assembly A. Di Mauro, C. Gargiulo, J. Van Beelen ITS-MFT mini-week
Bonding and Riveting By Peter Coffey Bodyshop Solutions Ltd.
June 8-th 2004W.Baldini1 Ferrara production center Ferrara production center Production Readiness Review OverviewOfOperations P R R.
LHQ Coil Fabrication Experience and Plan Miao Yu 04/08/2013.
Received new "130nm" jigs from Liverpool and after the "module workshop" 25/3/15 at Liverpool and ready to make dummy modules New jigs need to be slotted.
Screen Printing Steps “Rembrandt Tulips” Edition of 25 By Dorothy Markert, 2007 Creating an original print with one screen.
Mid Term Review Homework Check – Glue-up – Turning – Band saw.
BE PREPARED TO TAKE A FEW NOTES TODAY… Pick up the pink sheet at the front.
Soldering.
Silicon /pcb assembly R Thompson, J Freestone LAL 3 June 08.
And now for something completely different First results from the DC-DC Stavelet Peter & Ashley with Giulio & John.
PS Module Gluing Tests USCMS Outer Tracker Workshop Ulrich Heintz, Meenakshi Narain, Bill Patterson, Sinan Sagir, Adam Lanman, Eric Spencer, Juan Trenado,
Conductors and insulators
Assembly Procedure ALICE Outer Barrel Stave 14 Module 2 Cold Plates 1 StaveMarco Kraan Paul Kuijer.
W. Ebenstein Duke University Encapsulated Wirejoints Motivation: To use existing “proven” glass joints but protect them from chemical attack Design: start.
Hybrid Mechanical/Thermal Design Ray Thompson / Manchester FP420 meeting Torino 11/12 July 06.
Hybrid panel heated plate study Currently the curing of the ASIC glue for the hybrid panels are done at room temperature. This is a study to determine.
WP3_Bham; 10July 2014; John Wilson1 Gluing: more investigations (Simon and Sam) New clamping method provides a good base for systematic studies. Sketch.
David Bailey Gluing. Silicon /pcb assembly Previously Using Sony Robot and precision dispenser Have established acceptable glue dot parameters Dot electrical.
G.Barber/Peter Cooke: Mechanical Design Update Imperial 22 July Mechanical Update for Tracker workshop Contents:- New Station Layout Light Guide.
1 Learning Objectives The Importance Of Company Logos The Importance Of Company Image The Importance Of Packaging / Presentation Rules governing what should.
Gluing, measuring and shearing Heated plate curing Is the process feasible? Tests with 130nm hybrids Measure resulting glue thickness Determine the shear.
Thermal Model of Pixel Blade Conceptual Design C. M. Lei 11/20/08.
LET´S MAKE THE EARTH Materials needed: Tissue paper Blue Green A Big, Black card Scissors Glue.
S Pyatt 1 UV glue dispensing studies on the Dima Dotmaster Glue gap checks.
Conductive glue tests. J.Wickens 12/7/04 Used small pieces of HV kapton cut from redundant (old) stock, glued to silicon test structures from Karlsruhe.
WP3; 15 Jan 2015; John Wilson.1 Birmingham Update All back and operational after Christmas! Simon in contact with Dario Ariza at DESY re gluing (Boron.
Stave Tooling & Plans for Future Stave-building (Tim)
WP3_Bham; 15May 2014; John Wilson1 Heated plate curing Tests with 130nm hybrids and glass ASICs i) Room temp curing the glue thickness is controllable.
Birmingham Status ASIC shear tests (250nm Panel with hybrids cured at room temp and with heated plate, sent to Berlin for shear testing. (Complication:
Dye Solar Cell Assembly Glass handling Titania deposition Sintering process Sensitizer impregnation Platinum deposition Sealing electrodes Electrolyte.
Year 8 Fuse Tester Design & Technology PCB Information Fixed value resistors 470R = Yellow, Purple, Brown This component is soldered directly onto the.
"Cryptex Style" Maze Coin Puzzle
Lecture 23Purdue University, Physics 2201 First midterm violet, second - pink.
T. Bowcock University of Liverpool
Bonding study of wrapping part of PA1/2
→ need to guide UV light into gap; also beware temp effects
Glue curing studies (contd)
Ladder Assembly All tools and jigs produced Glue dispensing works
Sapphire Fused Silica and EP30-2
Hybrid Issues.
Depends on the movement and spacing of its particles
Gluing jigs for Demonstrator
Equipment for Assembly – UK Experiences
Group meeting, 2nd Sept, 2013; JAW
Update from Birmingham
Part 2 – Evaluation of Findings (distinction) Broken down into 5 areas: Evaluation of statistical data Evaluation of conclusions drawn Evaluating.
Kinetic Theory and Thermal Expansion
Pixel module assembly tooling
Presentation transcript:

WP3_Bham; 29May 2014; John Wilson1 Heated plate curing Tests with 130nm hybrids and glass ASICs the glue thickness is controllable. i)Room temp curing : 5 hybrids ii) Heated plate curing: 6 hybrids Hybrid panel (+35C)Panel vacuum jig Metal block Heating element Insulating sheet of glass 1

WP3_Bham; 29May 2014; John Wilson2 Tests with glass ASICs All hybrids (except those over-glued) shear tested on Dage 4000 after the curing has ended. Most often the glue joint breaks at the glue layer i.e. significant glue left on the ASIC and on the hybrid. But usually one (+ -1) ASIC shears off leaving hardly any glue stain on the hybrid pad. Is the surface clean? Surfaces are wiped with alcohol but more may be required. Try cleaning with Safewash soon (but not yet). 2

WP3_Bham; 29May 2014; John Wilson3

kg kg kg kg kg kg kg kg kg Glue/Substrate failure 8.671kg Glue/Substrate failure % Coverage 44% 63% 78% 57% 58% 54% 46% 52% 56% 51% Heated plate Glass ASICs after gluing Hybrid pads after shear testing

WP3_Bham; 29May 2014; John Wilson5 Shear Height Vs Glue Thickness for Heat Cured ASIC’s – Arranged in groups of % Coverage

WP3_Bham; 29May 2014; John Wilson6 Production still tricky: e.g. too much glue!

WP3_Bham; 29May 2014; John Wilson7 Bare glue dot : cured on glass ASIC (Mech Eng Alicona G4 (IF) system) 2.16mm 2.85mm 726mum Glue adhering to stencil at pull off Edge of glue dot? “Bleeding” between stencil and glass. “Slumping” of glue after stencil removed?

WP3_Bham; 29May 2014; John Wilson8 Expected dot pattern from stencil Stencil dots: 2mm diam and 135 microns high Closest dist between edges of adjacent dots = (5.40 – 4.0)/2 = 0.7mm Therefore for dots to touch their radii must increase from 1.0 to 1.35mm Ideal stencil dot (1.0mm rad x 135microns high) will be compressed to a dot of radius 1.30mm if the glue thickness is 80microns. Therefore in ideal case (80 microns), the 5 glue dots will not quite merge. But, in practice, bleeding + slumping will spread out the dots -> merging.

WP3_Bham; 29May 2014; John Wilson9 Conclusions (after lots of gluing!) No clear correlation between shear strength and glue thickness Correlation emerging between shear strength and coverage (as expected!) No apparent difference in shear strength between the two methods (room temp and heated plate curing) Systematic effects becoming apparent with experience/practice e.g. glue dots slightly larger for ASICS 7,8, 9 as glue is applied here in overlapping swipes. Still scope for putting down variable amounts of glue ! Thanks to Liverpool for sending an extra batch of glass ASICs. Would be very useful to have more glass ASICs in pipeline, please. 9

WP3_Bham; 29May 2014; John Wilson10 Other news Dry storage cabinet (Almit) had been delivered but without the nitrogen circulator (ordering mishap) We have now received the missing N2 unit. Good …. but, it is not “bolt on”, as advertised. A new hole has to be cut in the cabinet to match! 10

WP3_Bham; 29May 2014; John Wilson11 From previous meetings

WP3_Bham; 29May 2014; John Wilson12 All data collected from shear tests Many of the lower results are where there has been a failure at the glue/substrate interface, possibly due to the hybrid surface not being clean

WP3_Bham; 29May 2014; John Wilson13 Not enough glue due to something blocking the stencil holes – next slide. Omit pts with little glue adhering to ASIC pads.

WP3_Bham; 29May 2014; John Wilson14 ASIC with anomalously low shear strength: 2.7kg After curing Glue on ASIC; stencil removed Hybrid after shear ASIC after shear Glue on stencil -> ensure stencil is clean before use.

WP3_Bham; 29May 2014; John Wilson15 Hybrid glued with a pre-heated ASIC vacuum jig. Due to expansion it made the stencil tricky to get on properly and led to too much glue being stencilled on. Average Glue thickness is 75µm This has so far been a one-off. Decide not to preheat the ASIC vacuum jig. Hybrid glued without preheating the ASIC vacuum jig. Stencil fitted on much more easily and because of that the correct glue volume was stencilled on. Average glue thickness is 80µm Although: - P.T.O