Test of Single Crystal Diamond Pixel Detector at Fermilab MTEST Simon Kwan Fermilab April 28, 2010

Sept 7, 2009 RD42 Collaboration Meeting, Bristol, England Fermilab Test Beam Fermilab has a dedicated test beam facility: Versatile beamline in which users can test equipment or detectors in a beam of high energy particles (1-120 GeV) at moderate intensities (~1-100 kHz). Beam characteristics: – From 1 to 6 batches per spill – Each batch from 0.2 to 1.6  sec in length – Full batch equals 2E11 protons – Three spill options exist: single 4 sec spill/minute, two 1 sec spills/minute, or several millisecond level bursts/minute – Test beam runs 12 hours a day Facility provides a pixel telescope

Motivation Goal is to test future CMS vertex detector prototypes: – Diamond sensors – 3D sensors – MCz planar silicon sensors Telescope provided by the current CMS silicon pixel detector : – The telescope is made of grade B modules rejected during CMS forward pixel production (failed HV requirement) 3

Sept 7, 2009 RD42 Collaboration Meeting, Bristol, England T992 Test beam proposal submitted to Fermilab Study different sensor material for SLHC: diamond, 3d sensors, mCZ Si, p-Si Three year program Every year up to 3 slots of beam time each of two weeks in duration Also request lab space for detector preparation, support for using pixel telescope, computing support So far, very positive response from the Lab Now in the process of collecting signatures

Sept 7, 2009 RD42 Collaboration Meeting, Bristol, England 5 The CMS Pixel Telescope Pixel size 100x150 um 2. Analog output digitized by DAQ ADC(12 bits). Estimated resolution at the test beam with 4 stations (20 degrees) and 12 bits ADC is in between 7-10  m. 2cm 4cm Multichip module The telescope is made of grade B modules rejected during the CMS forward pixel production. The modules we are using didn’t pass the High Voltage requirements ( needed for the LHC high radiation environment, but for test-beam purposes there is no problem. We used 2 different kind of modules made of 6 (2x3) and 8 (2x4) readout chips (ROCs). The overlap area between modules is about 2x2 cm 2. 7/6/09

Telescope Silicon Detector 2cm 4cm 2x4 Plaquette 6

Diamond Detector 7 Active Area

3D Detector 8 1cm

Telescope Overview CONTROL ROOM TELESCOPE ENCLOSURE BEAM FERMILAB NETWORK DUTPIXEL PLANESCINTILLATORS 3.7V POWER SUPPLY ACCELLERATOR CLOCK CLOCK AND TRIGGER DISTRIBUTION 9 GIGABIT ETHERNET LOCAL NETWORK GIGABIT ETHERNET FERMI NETWORK

Telescope Overview Cont. CAPTAN STACK DUT PIXEL DETECTOR SCINTILLATOR 10 TRACKING STATION BASIC CELL

Telescope Overview Cont. CAPTAN STACKPOWER SUPPLYDUT SENSOR BIASTELESCOPE BOX ROUTERSCINTILLATOR 11

Sept 7, 2009 RD42 Collaboration Meeting, Bristol, England  The CAPTAN DAQ system has been developed by the DIG (Detector Instrumentation Group) of CD/ESE. There are 3 basic concepts behind the system: 2)A set of core boards: 1)Vertical standard bus NPCB – Node Processing and Control Board DCB – Data Conversion Board 3)Horizontal connectivity Gigabit Ethernet Link Interface Boards Level Translator USB The CAPTAN DAQ system  The software is a multithreaded application running on windows 12

March 2010 Beam test Beam test at FNAL MTEST from March 23- Mar GeV protons About 100k/spill (2.4s in 60s) Allowed to take beam about 12 hours/day Tests SC-diamond (courtesy of Rutgers), 3d (SINTEF) and McZ-Si sensors bump-bonded to CMS pixel ROC Diamond ~ 4.7mmx 4.7mm2 Others are single chip devices 13

Diamond Sensor Charge Sharing vs HV Number of Columns per Cluster Number of Rows per Cluster HV = -250 V  Sensor rotated to ~ 20  in row direction.  More charge collected with higher bias HV till saturation.  Need more work on gain calibration to extract the absolute charge (MPV of Landau distribution). 04/18/10Jianchun Wang14 Preliminary

Diamond Sensor Residual Center vs HV  Tracks are at ~ 20  with respect to normal of sensor plane in row direction.  Use the same set of telescope spatial configuration parameters.  With low bias HV, charges generated near readout electronics have more chance to be collected, equivalent to thinner effective sensor. Thus the residual center shifts.  In extreme case, the maximum possible shift ~ tan(  )*d/2 ~ 90  m. 04/18/10Jianchun Wang15 Preliminary

Diamond Sensor Charge Sharing vs Angle  Diamond sensor is biased at -250 V.  Sensor was perpendicular to beam, or rotated by ~10  & ~20  in row direction.  Gain and threshold of the electronics are different from that of HV scan. 04/18/10Jianchun Wang16 Preliminary

Diamond HV Scan at Angle What we want to extract from the testbeam for different bias HVs: – Total charge collected per particle hit in terms of MPV of the Landau distributions. – For a fixed threshold how the charge sharing information the detector can deliver, in terms of number of rows, or columns per particle hit cluster. – Spatial resolution. – Shift of spatial position measurement due to partial charge collection and tracks at angle. This can give us some ideas on effective depth, and charge trapping. Status of each task: – Need more work on readout electronics gain and pedestal calibrations. It is difficult to compare the absolute charge before that. (Perhaps not worth doing for this detector; problem on the analog output driver) – Numbers of pixels per hit vs bias HV qualitatively agree with expectation. We need to obtain precise thresholds from bench test for MC simulation. Then we can have quantitative comparison to test our understanding. – Current resolution is not as good as expectation. Need more work on gain curve and telescope alignment. – Shift of center residual shows correct trend. It will be revised after the spatial measurement optimization. 04/18/10Jianchun Wang17

MTEST Results: SC Diamond 18