1 Thermal tests planning for mock-up TM0 Thermal tests planning for CLIC prototype module type 0 July 17, 2012 F. Rossi

2 Thermal tests planning for mock-up TM0 INTRODUCTION: CLIC prototype modules 1) Currently under assembly and installation 2) Main components under procurement 3) Last module TM1TM0 TM4

3 Thermal tests planning for mock-up TM0 INTRODUCTION: CLIC prototype modules Prototype modules in LAB Prototype modules in CLEX Demonstration of the two-beam module design This implies the assembly and integration of all components and technical systems, such as RF, magnet, vacuum, alignment and stabilization, in the very compact 2-m long two-beam module Demonstration of the two-beam acceleration with two-beam modules in CLEX Address other feasibility issues in an integrated approach Industrialization and mass production study

4 Thermal tests planning for mock-up TM0 INTRODUCTION: CLIC prototype modules Assembly and integration of all technical systems (dummy RF structures and quadrupoles can be used – real dead weight and interfaces to other systems) Validation of different types of girders and movers Full metrology of the module components Pre-alignment of girders and RF structures on girders in the module environment, including fiducialisation Validation of interconnections and vacuum system Stabilization of main beam quad in the module environment Vibration study of all systems and identification of vibration sources Measurement of resonant frequencies (both in lab and in the tunnel/underground area) Simulation of several thermal cycles: measurements of thermal transients (e.g. how long it takes to achieve a new equilibrium state), fiducialisation verification Transport of the module and verification of alignment

5 Thermal tests planning for mock-up TM0 Experimental program for thermal tests HEATING No active heating in RF structures HEATING No active heating in RF structures COOLING No active cooling in RF structures COOLING No active cooling in RF structures MEASUREMENTS 1.Temperature 2.Alignment Laser tracker Romer arm WPS Micro-Triangulation system MEASUREMENTS 1.Temperature 2.Alignment Laser tracker Romer arm WPS Micro-Triangulation system STEP 1 – Heating environment ENVIRONMENT T amb = °C in steady-state conditions and by steps of 5 °C ENVIRONMENT T amb = °C in steady-state conditions and by steps of 5 °C HEATING PETS by steps up to 110 W/unit HEATING PETS by steps up to 110 W/unit COOLING PETS < max calculated T COOLING PETS < max calculated T MEASUREMENTS 1.Temperature 2.Volumetric flow rate 3.Alignment Laser tracker Romer arm WPS Micro-Triangulation system MEASUREMENTS 1.Temperature 2.Volumetric flow rate 3.Alignment Laser tracker Romer arm WPS Micro-Triangulation system STEP 2 – Heating only PETS ENVIRONMENT T amb = 20 °C in steady-state conditions ENVIRONMENT T amb = 20 °C in steady-state conditions HEATING AS by steps up to 400 W/unit HEATING AS by steps up to 400 W/unit COOLING AS < max calculated T COOLING AS < max calculated T MEASUREMENTS 1.Temperature 2.Volumetric flow rate 3.Alignment Laser tracker Romer arm WPS Micro-Triangulation system MEASUREMENTS 1.Temperature 2.Volumetric flow rate 3.Alignment Laser tracker Romer arm WPS Micro-Triangulation system STEP 3 – Heating only AS ENVIRONMENT T amb = 20 °C in steady-state conditions ENVIRONMENT T amb = 20 °C in steady-state conditions HEATING AS + PETS + DBQ by steps up to max power/unit HEATING AS + PETS + DBQ by steps up to max power/unit COOLING AS + PETS + DBQ < max calculated T COOLING AS + PETS + DBQ < max calculated T MEASUREMENTS 1.Temperature 2.Volumetric flow rate 3.Alignment Laser tracker Romer arm WPS Micro-Triangulation system MEASUREMENTS 1.Temperature 2.Volumetric flow rate 3.Alignment Laser tracker Romer arm WPS Micro-Triangulation system STEP 4 – Heating all module ENVIRONMENT T amb = °C in steady-state conditions and by steps of 5 °C ENVIRONMENT T amb = °C in steady-state conditions and by steps of 5 °C G. Riddone, A. Samoshkin, CLIC Test Module meeting MEASUREMENTS a.Comparison between laser tracker and WPS measurements (no movements of girders) b.Alignment tests by moving girders via actuators and comparison between laser tracker and WPS measurements MEASUREMENTS a.Comparison between laser tracker and WPS measurements (no movements of girders) b.Alignment tests by moving girders via actuators and comparison between laser tracker and WPS measurements STEP 0 – Alignment tests ENVIRONMENT T amb = 20 & 40 °C ENVIRONMENT T amb = 20 & 40 °C ALL THE TESTS ARE PERFORMED WITH NO VACUUM

6 Thermal tests planning for mock-up TM0 TOPICS Topics and updates concerning the status of: 1.CLIC prototype module type 0 2.Laboratory environment (air conditioning, ventilation, etc. ) 3.Heating system (heaters, temperature sensors, etc.) 4.Cooling system (water supply, inlet/outlet cooling circuits, control valves, etc.) 5.Numerical simulations 6.Measurements

7 Thermal tests planning for mock-up TM0 1. CLIC MODULES CLIC module type 1 Constraints for CLIC module type 1

8 Thermal tests planning for mock-up TM0 1. CLIC PROTOTYPE MODULE TYPE 0 Cooling circuit Vacuum flange RF flange Manifold Interconnection flange RF waveguide Accelerating structure (AS) Super-accelerating structure (SAS) Test Module type 0 (TM0) D. Gudkov ToleranceMock-upReal D ext ± 4 μm± 2.5 μm Ra0.4 μm0.025 μm Flatness10 μm1 μm

9 Thermal tests planning for mock-up TM0 1. CLIC PROTOTYPE MODULE TYPE 0 Brazing of 1st stack Fiducialisation EBW of 2 stacks Brazing of 2nd stack Fiducialisation TIG welding of vacuum flanges W36 W37 Installation on girders W38 EBW tooling manufactured by COMEB

10 Thermal tests planning for mock-up TM0 1. CLIC PROTOTYPE MODULE TYPE 1 Real super-AS for CLEX CLIC prototype module type 1 will be also used to test real RF structures: o 1 super-AS having real RF geometry o PETS on-off mechanism These tests are necessary to validate current assembly procedures developed for mock-ups as well as to check current alignment requirements Real RF structures used for TM1 can be also used for RF tests in CLEX PETS on-off mechanism

11 Thermal tests planning for mock-up TM0 2. LABORATORY ENVIRONMENT Lab dimensions (169-S-039): 17 x 6 x 3 m Current annual temperature excursion: °C Required: environmental temperature for Lab - adjustable range °C Max temperature inside module: o MB: 43 °C o DB: 34 °C Temperature field inside module (SAS = 820 W, PETS unit = 78 W, T amb = 25 °C)

12 Thermal tests planning for mock-up TM0 2. LABORATORY ENVIRONMENT VENTILATION SUPPLY °C T ± 0.5 °C T ± 1 °C SUPPLY

13 Thermal tests planning for mock-up TM0 2. LABORATORY ENVIRONMENT VENTILATION T = °C VENTILATION T = °C PREVIOUS CONFIGURATIONMODIFIED CONFIGURATION SUPPLY

14 Thermal tests planning for mock-up TM0 2. LABORATORY ENVIRONMENT Boundary conditions: laser tracker position inlet/outlet assembly of hydraulic circuit transport test HVAC for thermal test on CLIC prototype modules in building 169 transport test inlet/outlet assembly

15 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: heaters Experimental conditions to be reproduced: G. Riddone, A. Samoshkin, CLIC Test Module meeting All heaters are currently stored in the lab HEATERS AS P = 3050 W V = 240 V I = P/V = 12.7 A 2 PETS UNITS P = 2*480 = 960 W V = 240 V I = P/V = 4 A 2 DBQ P = 2*1600 W = 3200 W V = 240 V I = P/V = 13.3 A AS + 2 PETS UNIT + 2 DBQ I = 30 A

16 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: temperature sensors solid state relay temperature sensors heaters IL Hardware thermal interlock (2 for AS, 1 for each PETS and DBQ) max. temp. limit: 50 °C All temperature sensors are currently stored in the lab 1 DOF for each heating sub- system (AS, PETS and DBQ)

17 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: air temperature 2 m 1.2 m 1 m 1.3 m 5 thermocouples for each section 15 thermocouples in total Continuous acquisition during tests NI Channel Thermocouple Input Module

18 Thermal tests planning for mock-up TM0 3. HEATING SYSTEM: software I. Kossyvakis, CLIC Test Module meeting Software interface Panel for control valves The acquisition process is fully automatized and in principle no human intervention is necessary

19 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM Demineralized water Nominal volumetric flow rate: 0.36 m 3 /h Water inlet temperature: 25 °C Water outlet temperature: ~45 °C Max. pressure allowed: 5 bar Inlet/outlet interface Water supply

20 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: AS TS7 TS1 TS2 TS6 TS4

21 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: PETS TS17 TS22 TS23 TS24 TS25 TS26

22 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: control valves 1.Delivered to Lab 2.Electric scheme under design

23 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: water supply Water pump Heat exchanger Temperature regulator Inlet/outlet port Water tank Water supply delivered to Lab and tested -> OK Max. pressure: 5 bar Responsible: F. Rossi (S. Lebet) POWER SOCKET Max. 16 A POWER SOCKET Max. 32 A air cooling

24 Thermal tests planning for mock-up TM0 4. COOLING SYSTEM: electric networks AS heater PETS heater DBQ heaters Temperature sensors (q.ty 29) CONNECTORS PANEL #2 for: Control valves (q.ty 7) Flow transducer (q.ty 1) Pressure sensor (q.ty 1) Supporting system for: Control valves (q.ty 7) Flow transducer (q.ty 1) Pressure sensor (q.ty 1) CONNECTORS PANEL #1 for: Temperature sensors (q.ty 29) Solid state relay systems for heaters (q.ty 3) Electric scheme for control valves, heaters, temperature sensors, etc. under design (J. Blanc) CUPBOARD for: NI cDAQ slots (q.ty 1) NI cDAQ slots (q.ty 1) Solid state relay devices (q.ty 3) 24 V supply Digital control electronics for proportional valves (q.ty 7) POWER SOCKET Max. 63 A POWER SOCKET Max. 63 A Improvement of current electric network of Lab in progress

25 Thermal tests planning for mock-up TM0 5. NUMERICAL SIMULATIONS Deformed shape of prototype module type 0 due to applied thermal RF loads (values in µm) Displacements [  m] (location and load type) Prototype type 0 MB (RF load)183 DB (RF load)47 MB (vacuum load)30 DB (vacuum load)131 MB (gravity load)27 DB (gravity load)40 Resulting displacements on the DB and MB lines due to thermal, vacuum and gravity loads Temperature [°C]Prototype type 0 Max temp. of module43 Water output temp. MB35 Water output temp. DB30 Resulting temperatures inside the modules R. Raatikainen (SAS = 820 W, PETS unit = 78 W, T amb = 25 °C)

26 Thermal tests planning for mock-up TM0 6. MEASUREMENTS Measuring arm Romer Multi Gage With a length of 60 cm, this kind of portable CMM allows to measure fiducials by probing or by one point. According to Romer, the maximum permissible error is less than 18 µm. Laser tracker Leica AT401 According to simulation calculations, the expected accuracy of AT401 measurements on a girder and its components is about 5 µm rms (up to 40 °C). Fiducials are measured with respect to a fixed reference system. Measurements taken from different stations can be elaborated and combined together. The measuring device must be at the same temperature of the parts to be measured. Micro-Triangulation system The principle of Micro- Triangulation is to use the full potential of a theodolite by substituting a CCD camera instead of the eye of an operator. This method has clearly demonstrated its high precision capability on the 2 m long mock-up where a precision about 10 µm along each axis has been obtained in the determination of the illuminated fiducials locations. Fiducials dedicated to Micro-triangulation The aluminium main part of this fiducial (made in CERN) is equipped with a breakthrough ceramic ball with a diameter of 8 mm, a removable drawer which contain a LED allows to illuminate the accurate ball. S. Griffet et al. WPS system

27 Thermal tests planning for mock-up TM0 CONCLUSIONS: THERMAL TESTS STRATEGY NAMELAB CONFIGURATION PARAMETERS HeatingCoolingVacuum TT1TM0VVX TT2TM0 + TM0VVX TT3TM1 + TM0VVV TT2 TT3

28 Thermal tests planning for mock-up TM0 CONCLUSIONS: schedule Presentation at the project meeting (September 2012) Review following the thermal tests on TM0 (Q2, 2013)