doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics / Marketing Committee Report La Jolla July 2000

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 2

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 3

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 4 Guide the formulation of documentation that clearly & distinctly explains the purposes and services of the various IEEE WPAN standards Support the dissemination of information about IEEE Working Group activities internally (among 802 working groups) and externally (among the electronics industry). Determine how best to promote the public demonstration of interoperability between products built using standards. Create and maintain liaisons with other selected industry marketing groups (e.g. Bluetooth, HomeRF) and standards bodies (e.g ETSI). Foster two-way communications between suppliers and consumers of WPAN products. Encourage and foster creation of value-added industry marketing groups as appropriate (e.g. WECA, Collect and maintain the application and usage scenarios generated by the CFAs. Facilitate task groups in reaching convergence and consensus on technical requirements. Objectives of the WPAN Marketing Committee

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics Plenary Meeting in Albuquerque IEEE Marketing committee minutes Tuesday, 9 May, :30MC chair called the marketing committee meeting to order 3:30Agenda review (IEEE /027r0) 3:32Secretary reviewed minutes from Albuquerque meeting (IEEE /043r0) Motion to approve the minutes was made by P Kinney, seconded by J Allen. Following no objections, motion passed unanimously. 3:37MC chair presented the Bluetooth SIGnal report (IEEE /121r0) Chair reviewed the schedule for future articles, next 3 dates are May 12: TG1, July 14:TG2, Sep 15: TG3. J Allen asked if sidebars could be included to advise of upcoming activities. 3:43MC chair presented the IEEE Pocket Guide Report (IEEE /122r0) Approved to go forward 3:47MC chair presented the IEEE Handbook report (IEEE /123r0) T Siep, I Gifford are authors 3:50MC chair presented the WPAN trademark report (IEEE /125r0) Action Item: MC to submit protest to internic.com concerning the use of WPAN as a domain names by other concerns. Action Item: MC to look into trademarking Action Item: MC to update templates and webpage with notices on use of the trademark of the term WPAN 4:03MC chair discussed a future presentation to the IEEE Comsoc Chapter (IEEE /124r0) 4:05R Alfin presented a description on the proposed updates to the website Question: Updating the website will create a different look between and , why not update ? Reply: (BH) Yes, let’s see how the site works then work on migrating our other sites to this same “look”. Action Item: K Marquess, R Alfin, B Bailey, J Allen, S Shellhammer to review the website page formatting and do some prototyping. 4:28B Bailey presented a proposed draft for a template design (IEEE /151r0) Comment: add a graph to this template on how many companies are attending meetings. Comment: add a slide describing the family. Comment: put out requesting collateral material to add to this template. 4:43S Shellhammer presented TG3 marketing status 4:45Other topics Action Item: MC to look into possibility of working with WECA and WLANA on similarity of interests and possible collaboration. 4:52Meeting adjourned.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 6 Bluetooth SIGnal Sub Report

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 7 Summary Obtained a recurring column in the Bluetooth™ SIGnal Newsletter to maintain a communication channel for the IEEE Projects. The “WPAN column” will highlight sub Working Groups e.g., Task Groups, etc. max. ~250 words ea. Additional areas can also be covered Bluetooth™ IEEE WG f2f summaries, IEEE-SA Sponsor Balloting, IEEE 802 Technical Advisory Groups (TAG), etc. Articles will be submitted to the Marketing Committee. The MC will assist in article generation. The WG Liaison Officer or MC Chair will communicate the FINAL articles to the SIGnal Editor.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 8 Issue No. 2 Source:

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 9 Issue No. 5 Source:

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 10 Issue No. 6 Source:

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 11 List of SIGnal Publication Dates and IEEE Planning Calendar  23Sep99 Issue no. 2 15Nov99 Issue no. 3 1Feb00 Issue no. 4  1Apr00 Issue no. 5  1Jun00 Issue no. 6  1Aug00 Issue no. 7  1Oct00 Issue no. 8  1Dec00 Issue no. 9 IEEE IEEE 802  IEEE [  ]  IEEE TG1 [Std.] IEEE TG2 [?] IEEE TG3 [?] IEEE-SA [Pocket Guide] etc.  = Actual or Planned = Opportunities = Assigned in WG = Published in SIGnal = Not Assigned Each of the IEEE Sub Working Groups should identify an Author for their respective issues.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 12 SIGnal Placement Schedule JJASONDJFMAMJJ Copyright Signed D JFMAM The graphic above indicates the current planning for the SIGnal placement of IEEE Column Articles & topics. TG1 has overlaid their balloting phases for clarity/focus. + Rev 1.0 B spec - FM Source 3Dec99 + Rev 1.0 A spec - FM Source 26Jul99 v1.1? A SON v2.0? + Issue no. 4 -Not addressed SIGnal + Issue no. 5 -WG 17Mar00 + Issue no. 6 -TG1 12May00 + Issue no. 7 -TG2 July 14 + Issue no. 8 -TG3 + Issue no. 9 -IEEE-SA Working Group Sponsor + Issue no. 2 -WG Aug99 + Issue no. 3 -Not addressed + Issue no. 1 -Not addressed

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 13 IEEE Column Article Themes IEEE-SA (SIN/Press) –Pocket Guide, etc. IEEE 802 –802 Family Press Release, etc. IEEE WPANs [See Issue no 2] –Introduction for Adopters/Associates/Promoters] IEEE P [See Issue no 5] –Special Interest Group + Standards Development Organization = Standards-Making success IEEE P TG1 [See Issue no 6] –Derivative precedent, follow on work e.g., Radio2, etc. IEEE P TG2 –Coexistence Modeling, etc. IEEE P HRSG –CFA/CFP, etc. IEEE P MC –Companion, Handbook, (in support of TG1) etc.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 14 Typical Column Article Creation Cycle Time Draft 1 (20 Days) Draft 2 (5D) Draft 3 (5D) Days Phase 1 Phase 2 (very likely) Phase 3 (Probable not mandatory) For example for the 1Apr00 Issue no. 5 we needed to complete & submit by 17Mar00. Each column article needs to be signed off by MC. -21 days “The deadline for articles is three weeks before the publication date.” Roger Peacock Usually falls on an Interim or Plenary Which allows for MC discussions.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 15 IEEE Column Article Handoff Process IEEE Articles MC Review & Approval Liaison Officer MC does not need to receive WG or Sponsor Approval for these non-IEEE Columns but we will copy to WG, Sponsor & IEEE-SA prior to submission. Issue no. 6 TG1 -IanG –00/055r1 -8May00 Submit Draft MC -9May00 Review - 00/055r May00 Feedback to Author -10May00 MC approve Final Draft Liaison -12May00 submit Final Draft Example:

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 16 Next Steps Next 3 SIGnal Publication (deadline) dates: –1Aug00 Issue no. 7 (~14Jul00) - TG2 –1Oct00 Issue no. 8 (~15Sep00) - TG3 –1Dec00 Issue no. 9 (~9Nov00) - IEEE-SA Identify new Bluetooth SIG Publisher/Editor for SIGnal

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 17 IEEE Web Site Sub Report

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 18 Summary The IEEE and its previous incarnations has had a web presence since Jan97 The Home Page is over one (1) year old The WG has indicated interest in providing a new “look and feel” to the Home Page and sub pages We have created a new  eta web site to initiate WG discussion and feedback. Please visit: – Over next week new pages will become default, comments welcome

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 19 Web page from indexb

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 20 Web Site has numerous hits! Electronic Presence is strong for The Web Site is very active: – –For 1May00 Note: Use browser to search on HTML Page for occurrences of “802/15” this bring you to URL %’s We will try to highlight: –Browser Hits daily, weekly, monthly, etc. –Browser Downloads of docs linked to the page –etc.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 21 Mailing List(s) Traffic is Light! Electronic usage of Mailing Lists for could be stronger 144 Messages on WG Public Mailing List – 27 Messages on TG2 Public Mailing List – 210 Messages on WG Private Mailing List – 1 Message on Joint & Private Mailing List – 1 Messages on TG1 Private Mailing List –x The addresses & URLs provided are for traffic & access to the archives. Note some of them are password protected and available to WG Membership only. Note: IEEE uses their Lists 2x to 3x our rate. Web posting per doc, etc.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 22 5 WG Mailing Lists! We currently have five (5) WG Mailing Lists, all have archives. TG3 and Radio2 SG may increase the number of Mailing Lists.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 23 Press Kit Sub Report

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 24 Summary It has become increasingly obvious that there is a strong demand for IEEE WPAN information Additionally there is no official information i.e., Press Kit, etc. that stays current and/or that the AC or WG approves As a start, TG1 will take the following initiatives –Produce a "Press Kit Module" specific to TG1 on or before the Sep00 Interim –Produce a Promotional Brochure on or before the Sep00 Interim –Work w/ anyone who has interest in this area Extensions would ideally cover the WG and/or all the Wireless IEEE 802 WGs i.e., , , and , same w/ Brochure

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 25 IEEE Press Kit Suggestions If the press kit is being used at trade show/exhibit, it typically includes: –copies of other product or service (program) news releases send out –copies of articles about the product, service or activity –a positioning "paper" describing the company or group putting out the media or press kit –testimonials about the product, service, etc from related partners, users, manufacturerers –contact information for editors –collateral materials describing the product, etc. (such as promotional brochures, capability brochures)

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 26 WPAN™ Press Kit, a Modular Approach can be updated easily Scenario: Someone wants to know what the latest information is and does not want to wade through the Web Site, Minutes, etc. Solution: The user could go to the WPAN™ Press Kit html page and down load PowerPoint, News Releases, Minutes, etc. WPAN™ Press Kit – Working Group, etc. [?] –Module 1 – Task Group 1 [responsibility - Ian Gifford] –Module 2 – Task Group 2 [responsibility - ?] –Module 3 – Task Group 3 [responsibility - ?] –etc. –Module 0 – Study Group [responsibility - ?]

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 27 TG1 Summary TG1 requires MC coordination because it is a subset of the Bluetooth™ Foundation Specification Coordination with BT SIG very important In terms of marketing there are “push and pull” activities related to TG1 we are primarily interested in reporting on the TG1 push activities e.g., Bluetooth™ SIGnal Column Articles, IEEE Handbooks, etc. TG1 is very interested in working with MC to help –Fully support the WPAN standards activities being conducted in the IEEE Working Group. –Contribute technical resources to facilitate convergence and consensus on technical specifications. –Provide resources to establish and demonstrate product interoperability. –Create and maintain liaisons with other selected marketing and standards bodies bodies. –Foster two-way communications between suppliers and consumers of WPAN products. –Clearly & distinctly differentiate the IEEE WPAN wireless activities

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 28 Bluetooth IEEE Pocket Guide & Handbook Sub Report

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 29 Summary The IEEE has been granted a license from Bluetooth™ SIG touse as the basis for IEEE Standards Project P The IEEE will publish the Std in early 2001 The IEEE wants to publish additional collateral in support of the Std –IEEE Designer’s Companion –IEEE Bluetooth™ Pocket Guides The Bluetooth™ SIG is working with the IEEE Standards Publishing Programs to publish a Pocket Guide based on the Bluetooth™ Version 1.0 Foundation Core & Profiles Specification for the Fall It will be ~150pg. There will be more Pocket Guides. A Designer’s Companion will be needed also.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 30 Bluetooth Specifications 1522 Pages IEEE Standard 773 (D0.7.2) Pages Core Specification Pgs Profiles Specification Pgs Standard Pgs. 773 (D0.7.2) These documents are very detailed and offer an unparalleled source of information on the Bluetooth Technology. However, additional collateral help with technology adoption.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 31 The IEEE Bluetooth Pocket Guides will offer a complement to the Specification. More Complexity More Pages Less Complexity Less Pages Pocket Guides Designer’s Companion: MAC & PHY Layer The collateral that will help with technology adoption could take the form of Pocket Guides Which are page books that complement the Specification.

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 32 IEEE Pocket Guide Report Telecon & Meetings –15Jun00 IEEE Author met with BSIG Marketing Chair –29Jun00 IEEE Contract Officer talked w/ BSIG Marketing Chair –Miscellaneous ’s to IEEE –27Jun00 on Pocket Guide Copyright License Agreement –Miscellaneous ’s from IEEE –12Jun00 on Pocket Guide Copyright License Agreement –5Jul00 on Pocket Guide Copyright License Agreement –Miscellaneous Next Steps –Finalize and Sign Pocket Guide Copyright License Agreement –Write manuscript for PG –Identify Topics for Next Pocket Guide(s)

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 33 IEEE Pocket Guide Milestones May00 –Sign contract –Select Writer Jun00 –The IEEE/Publisher agrees to provide a copy of the final manuscript to the contact persons for review sometime in June 2000 [early Jul00 ok] CY00-Q3 –Manuscript published by IEEE available in softcopy & hardcopy, for a fee –Target date for BSIG Developers Conference, early Dec00 CY00-Q4 –More Pocket Guides? Jul00 Aug00 Contract signing delay estimates

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 34 IEEE Handbook Report Telecon & Meetings –Miscellaneous ’s to IEEE –Miscellaneous ’s from IEEE –Miscellaneous Next Steps –Submit IEEE PRESS STANDARDS INFORMATION NETWORK Proposal Specifications –Submit Copyright License Agreement to BSIG –Identify BSIG Mentor –Identify Publication Schedule w/ IEEE 15.1

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 35 Marketing Plan Overview Sub Report

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 36 Overview from Web Site The IEEE Working Group for WPANs™ has provided the following online Marketing Plan to profile the Marketing Communications from the WG. The focus of the plan is on the "push" side vs. the "pull" side of our Marketing Communications or rather we are asked individually to submit articles from time to time into Magazines, speak at Trade Shows, etc. this is "pull". The Marketing Committee does not portend to control "pull" but rather just tries to monitor and archive. The Marketing Committee is primarily concerned with creating "push" communications in support of the Projects and one of the three types of IEEE Standards documents: standard, recommended practice, or guide they have as a deliverable. These IEEE Standards documents are depicted below in terms of timelines and the individual Working Group, Task Groups, or Committee life cycles authorized to the Projects by our Sponsor. Source:

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 37 Summary The WG is finite and each project has its own lifecycle The Marketing Committee should be planning during the entire lifecycle of a project The following report is snapshot of the Marketing Plan for the participating projects If you want to participate please contact Bruce Kreamer or Ian Gifford

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 38 WG Life Cycle

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 39 Marketing Plan

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 40 Marketing Plan (cont.) PLACEMENT TITLE AUTHOR(S) PUB DATE WG TG1 TG2 TG3 SIZE LINK

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 41 Marketing Plan (cont.) PLACEMENT TITLE AUTHOR(S) PUB DATE WG TG1 TG2 TG3 SIZE LINK

doc.: IEEE /179r0 Submission July 2000 Bruce Kraemer, Intersil & Ian Gifford, Tyco Electronics 42 Events 00/080r4P802-15_MC-Events-List