HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.

Slides:



Advertisements
Similar presentations
Pixel Chip Testing S. Easo, RAL Current Status of the Pixel Chip Testing. Plans for an LHCb Test Setup at CERN.
Advertisements

1 500cm 83cm 248cm TPC DETECTOR 88us 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 LATERAL.
Front-end electronics for the LPTPC  Connectors  Cables  Alice readout electronics  New developments  New ideas  Open questions Leif Jönsson Phys.
JLab High Resolution TDC Hall D Electronics Review (7/03) - Ed Jastrzembski.
HEP2005, Lisboa July 05 Roberto Campagnolo - CERN 1 HEP2005 International Europhysics Conference on High Energy Physics ( Lisboa-Portugal,
RPC Electronics Status Overall system TDC –Digitizing frequency issue (determine the bin size of the TDC value) Discriminator test result Trigger module.
July 10, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
Sept 25, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
6 June 2002UK/HCAL common issues1 Paul Dauncey Imperial College Outline: UK commitments Trigger issues DAQ issues Readout electronics issues Many more.
Silicon Photomultiplier Readout Electronics for the GlueX Tagger Microscope Hall D Electronics Meeting, Newport News, Oct , 2007 Richard Jones, Igor.
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.
RPC Electronics Overall system diagram –At detector –Inside racks Current status –Discriminator board –TDC board –Remaining task.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
Prototype Test of SPring-8 FADC Module Da-Shung Su Wen-Chen Chang 02/07/2002.
A. Sukhanov, BNL1 NCC Electronics Readout of pad structured sensors ● High dynamic range ● Summing signals from 6 detectors on one preamp ● NCC should.
U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.
A. Sukhanov, BNL1 NCC Electronics Readout of pad structured sensors ● High dynamic range: 14 bit range, 10 bit accuracy ● Summing signals from 6 detectors.
PHENIX upgrade DAQ Status/ HBD FEM experience (so far) The thoughts on the PHENIX DAQ upgrade –Slow download HBD test experience so far –GTM –FEM readout.
Pixel hybrid status & issues Outline Pixel hybrid overview ALICE1 readout chip Readout options at PHENIX Other issues Plans and activities K. Tanida (RIKEN)
Frontend of PHENIX Si pixel K. Tanida (RIKEN) FEM/DAQ meeting for PHENIX upgrade (10/24/02) Outline Overview of PHENIX Si pixel detector ALICE1 chip readout.
HBD FEM the block diagram preamp – FEM cable Status Stuffs need to be decided….
Leo Greiner IPHC DAQ Readout for the PIXEL detector for the Heavy Flavor Tracker upgrade at STAR.
Update on the HBD Craig Woody BNL DC Meeting June 8, 2005.
27 th September 2007AIDA design meeting. 27 th September 2007AIDA design meeting.
HBD FEM Overall block diagram Individual building blocks Outlook ¼ detector build.
First ideas for the Argontube electronics Shaper, simulations Block Diagram for analog path Delta Code Data Reduction Bus system, Controller Max.
The AFTER electronics from a user’s point of view D. Attié, P. Colas Mamma meeting,CERN Feb T2K electronics.
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
1 07/10/07 Forward Vertex Detector Technical Design – Electronics DAQ Readout electronics split into two parts – Near the detector (ROC) – Compresses and.
HBD electronics status All the ADC and XMIT boards are installed. –Top 3 crates are for the ADC, XMIT boards –Bottom crate is for test pulse boards/future.
Performance of Programmable Logic Devices (PLDs) in read-out of high speed detectors Jack Fried INSTRUMENTATION DIVISION PLD ? PLD ? Muon Tracker PLD Muon.
TPC/HBD R&D C.Woody, N.Smirnov, B.Azmoun, M.Sivertz, B.Yu, R.Majka, J. Mitchell, V.Rykov, M.Purschke, C.-Y.Chi PHENIX Collaboration Meeting Nashville,
ERC - Elementary Readout Cell Miguel Ferreira 18 th April 2012
Connector Differential Receiver 8 Channels 65 MHz 12 bits ADC FPGA Receive/buffer ADC data Format triggered Events Generate L1 Primitives Receive timing.
LC Power Distribution & Pulsing Workshop, May 2011 Super-ALTRO Demonstrator Test Results LC Power Distribution & Pulsing Workshop, May nd November.
Fermilab Silicon Strip Readout Chip for BTEV
1 Preparation to test the Versatile Link in a point to point configuration 1.Versatile Link WP 1.1: test the Versatile Link in a point to point (p2p) configuration.
B.Satyanarayana Department of High Energy Physics Tata Institute of Fundamental Research Homi Bhabha Road, Colaba, Mumbai,
TPC electronics Status, Plans, Needs Marcus Larwill April
D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:
Nov 1, 2007 IEEE NSS & MIC 2007 by C. Y. Chi 1 A Faster Digitizer System for the Hadron Blind Detector in the PHENIX Experiment Cheng-Yi Chi Nevis Lab.
HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.
PHENIX Safety Review Overview of the PHENIX Hadron Blind Detector Craig Woody BNL September 15, 2005.
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
D. Attié, P. Colas, E. Delagnes, M. Riallot M. Dixit, J.-P. Martin, S. Bhattacharya, S. Mukhopadhyay Linear Collider Power Distribution & Pulsing Workshop.
1 Carleton/Montreal Electronics development J.-P Martin (Montreal) Shengli Liu & M. Dixit (Carleton) LC TPC Meeting DESY Hamburg, 4 June 2007.
VMM Update Front End ASIC for the ATLAS Muon Upgrade V. Polychronakos BNL RD51 - V. Polychronakos, BNL10/15/131.
Mircea Bogdan Chicago, Oct. 09, BIT, 500 MHz ADC Module for the KOTO Experiment The University of Chicago.
DAQ 1000 Tonko Ljubicic, Mike LeVine, Bob Scheetz, John Hammond, Danny Padrazo, Fred Bieser, Jeff Landgraf.
Overview of TPC Front-end electronics I.Konorov Outline:  TPC prototype development  Readout scheme of the final TPC detector and further developments.
H. Krüger, , DEPFET Workshop, Heidelberg1 System and DHP Development Module overview Data rates DHP function blocks Module layout Ideas & open questions.
PHOTOTUBE SCANNING SETUP AT THE UNIVERSITY OF MARYLAND Doug Roberts U of Maryland, College Park.
Calorimeter Digitizer Electronics Cheng-Yi Chi Columbia University Nov 9-10, 2015sPHENIX Cost and Schedule Review1.
June 2009, Wu Jinyuan, Fermilab MicroBooNe Design Review 1 Some Data Reduction Schemes for MicroBooNe Wu, Jinyuan Fermilab June, 2009.
Data Reduction Schemes for MicroBoone Wu, Jinyuan Fermilab.
FEE for TPC MPD__NICA JINR
A General Purpose Charge Readout Chip for TPC Applications
A Readout Electronics System for GEM Detectors
Power pulsing of AFTER in magnetic field
A Low Power Readout ASIC for Time Projection Chambers in 65nm CMOS
RPC Front End Electronics
RPC Front End Electronics
DCM II DCM function DCM II design ( conceptual ?)
RPC FEE The discriminator boards TDC boards Cost schedule.
New DCM, FEMDCM DCM jobs DCM upgrade path
RPC Electronics Overall system diagram Current status At detector
Digitally subtracted pulse between
PHENIX forward trigger review
Cheng-Yi Chi Nevis Lab Physics Dept Columbia University
Presentation transcript:

HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system architecture d)How DCM will process such large data volume (400 optical fibers)

HBD/TPD readout method HBD: Preamp/shaper mounted on the pad plane. Signal will be driven to the edge of detector. We would like to measure T0 plus total charge. The longer shaping time will allow us to have several samples at the rising edge of the pulse. We will get samples per signal per L1 trigger TPC: Short shaping time (~ 5 samples). 160 samples/channel/L1 trigger to cover 4 microsec drift time. The preamp + ADC + signal processing will be mounted near the detectors.

Design issue HBD will have preamp/shaper on the detector, the output signals will be driven to the edge of the detector, ~.1in per pair of signals TPC pad size is 2mm by 1cm –We know the preamp/shaper has be a custom design –The signal processing (baseline subtraction, buffer zero suppression, buffer etc) is pure digital domain. This can be done We need to find a most economic way to get it done For prototype one can use FPGA –ADC is the key components to be study. It is complicated beast of analog+digital designs It has lowest packing density and highest power per channel

ADC We have been looking for existing proof of multi- channel/low power ADC for a while. We also spend a lots of time to understand these ADC (thanks for medical imaging…) We found –TI has 8 channel 40 MHz 12 bits ADC is 80 pins TQFP ( to be announced) (100mw Multi-channel with serialized output (Nbits -> 2 wires) per channel) –Analog device has 4 channel 8 bits 65 MHz ADC (65mw/channel at 65MHz) 4 channel 12 bits 50/65 MHz ADC (200mw/channel at 50MHZ These two ADC are in chip scale package.

The prototype board We decide to use the TI 12bits ADC as the starting point. –A readout board configuration as 8 8-channel ADC + an Altera Stratix FPGA (~1000 pin BGA) (signal processing) + optical chip set The board should have about 6 “ wide. The packing density should be reasonable to HBD. Once we have a preamp/shaper to interface to we can progress further. (i.e. layout the test board)

Signal processing 8 8 channel ADC requires 8 sets of 8 channel of 480 mps differential LVDS receiver An ALTERA STRATIX has chosen to interface to ADCs The FPGA also server as (code written) –Baseline subtraction –160 samples(25ns/samples) 4 micro-sec L1 delay – 64 channels –Zero suppression –5 Level 1 accepted event buffers – 64 channels –Data formatted for the readout –Serial download. –Receive relative timing signals ( L1 accept, Initialize) (Additional code need to be written) –Test data/pattern –Control for the optical chip set –Busy logic + large event buffers due to zero suppression on the FEM.

What we need to finish the board Preamp/shaper chip –Who will do it –When can we have one can match the ADC Find a connector for the TPC pad plane. Have a preliminary pad plane signal routing examples for TPC Funds We will continue explore the possibility to get a custom chip with multi-channels commercial ADC core + our logics –This is done for ALICE TPC readout It will be helpful to have consistent R&D fund that devotes to this effort