Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron1EUG.

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Presentation transcript:

Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron1EUG - 1/30/2016

Vital expertise for experiments’ upgrades Serial links from front-end chips to GBT (or alike) – 40 – 320/640 Mbits/s (or higher ?) – Electrical distance: 10cm to 1 – 2 m (pre-emphasis and filters) – Low mass / low power (low current/voltage) / low noise / Low BER/ Low failure rate/ low ? – SEE Optical FE links (Versatile/GBT) – 5 – 10 Gbits/s – Short distance electrical: cm. – Long distance electrical if deported optoelectronics: 1 – 2 m ! (pre-emphasis and filters) – SEE Communication between FPGA's on same board. – 1 – 10G – 1 – 30cm Communication between boards via backplanes/cables (trigger, TCA, etc.) – 1 – 10G – 10cm – 100cm – Connectors – Pre-emphasis, filters, etc. DAQ interface links. – 10G – 100G commercial TTC optical links. – Compatible to GBT but no SEE problem Etc. J. Christiansen, S. Baron2EUG - 1/30/2016

Tools What we need: A tool to make PCB and sub-structure simulation: Pre-Layout analysis (use of models, S-parameters, BER simulation, eye diagram) Post-Layout verification (EMC hot spots on entire PCB, crosstalk, timing..) 2-D, 3-D field solvers Tools available at CERN – Ansoft Maxwell 2D and 3D – CST Microwave Studio (3D EM field solver) – Allegro AMS (former P-Spice, circuit simulation) – Do we have Cadence PCB SI/PI or any other PCB simulation tool? – Latest experience within our group: few years ago with SpectraQuest and Maxwell, recent with CST Some of us have briefly played with some other tools – Agilent ADS – Mentor Hyperlynx – Ansoft HFSS, AWR Microwave Office – Partners using Stateye (public domain) J. Christiansen, S. Baron3EUG - 1/30/2016

PH/ESE plans PH/ESE working group being set-up to: – Identify a common set of tools we will use for the group and on which we will get expertise (if possible within the CERN tool kit, of course) – Organize the interface with EN-ICE on the specific subjects of high-speed transmission links: layout rules and simulation PCB library (vias, material,..) PCB QA – Try to identify the companies able to build boards and prototypes according to the rules previously set J. Christiansen, S. Baron4EUG - 1/30/2016