1 Web Site: material introduction

2 UP-HTC Tetra-functional Laminate Features 1.Excellent thermal conductivit 2.Lead free compatible FR-4 laminate 3.Excellent thermal resistance 4.UL94-V0 5.Low Water absorption

3 Composition Single sideDouble side Cu foil HTC layer Al,Cu, plate

4 Ability Cu foil 1/3 ~6 oz HTC layer >15 um Metal layer >0.15mm

5 Applications 1.LED substrate 2.High speed PCB 3.High voltage PCB 4.Auto-Mobile PCB 5.Communication PCB

6 Offering CharacteristicMaterialsTYPEAnnotation PRODUCT SIZE405*610mm MetalAl( ) mm InsulantResin and Fill um CircuitCu 1oz 2oz 3oz

7 Properties Test condition UP- HTC Test Method thermal conductivit(w/m-k) C-96/25/652ASTM D5470 Dielectric breakdownD/48/50 40 TM Peel strength C-96/25/65 ≧ 10 TM Thermal stress 288 ℃ /10sec/cooling ≧ 10 TM Water absorptionD/24/ TM T260 TMA ≧ 60 TM T288 ≧ 30 T300 ≧2≧2 TGDSC 130 TM Z-CTE(%) TMA50~260 ℃ 5.0~6.3 TM Dielectric constantC/96/25/65,1Mhz 4.5~5.0 TM Dissipation factorC/96/25/ TM

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