V i t a l i s ECE Spring 2013 TEAM 13 Wireless Biometric Sensor Design Review

Team Members Paste a photo of team members here, annotated with names of team members. Shantanu Joshi /Aakash Lamba / Di Mo / Yi Shen

PCB Layout: Overall PCB (3.8 x 3.25) Power Board Main Board

PCB Layout: Top Copper

PCB Layout: Bottom Copper

PCB Layout: Silk Layer

Trace Size for 3.3 V, 5 V and GND is PCB Layout: Overall PCB (2.9 x 1.15) (GND Highlighted)

PCB Layout: Overall PCB (2.9 x 1.15) Power Connect 5 V Step Up Fuel Gauge Charger/Booster Decoupling Capacitors (C1,C2) for Power Traces

PCB Layout: Main PCB (2.8x 3.25) (GND Highlighted) Trace Size: 3.3 V, 5 V and GND Others – Hole Size (Diameter): Power Others –

PCB Layout: Main PCB (2.8x 3.25) Decoupling Capacitors for Micro: C3,C7,C9 (Size:0805) Decoupling Capacitors for VCC/GND: C10 Decoupling Capacitors for Accelerometer : C4 Decoupling Capacitors for OLED : C5,C8 Decoupling Capacitors for Wi-Fi : C6 (Size:1210) *All passive components are surface- mounted

PCB Layout: Main PCB (2.8x 3.25) (Debugging Connectors Highlighted) Power SPI RESET JTAG

PCB Layout: Main PCB (2.8x 3.25) (Sensor Connectors and Others Highlighted) Accelerometer BUTTON Temperature Sensor POWER Wi-Fi SPO2 LED OLED