Design Automation and Test Challenge for Flexible Hybrid Electronics (FHE) T.-C. Jim Huang1 and K.-T. Tim Cheng2 1 Hewlett-Packard Laboratories, Palo Alto 2 University of California Santa Barbara

What is Flexible Electronics Thin-film, light-weight, and low-cost Bendable, durable, and large-area Flexible substrates Plastics and metal foils Non-photolithography manufacturing Ink-jet printing Roll-to-roll imprinting [1] Roll-to-roll process, PolyIC; [2] Ink-jet printed electronics, Phillips Flexible electronics has recently attracted much attention because of their potential in providing cost-efficient solutions to large-area applications such rollable displays and TVs, e-paper, smart sensors and transparent RFIDs. The key advantages of flexible electronics, compared with current silicon technologies, are low-cost manufacturing (e.g. ink-jet printing and roll-to-roll imprinting) and inexpensive flexible substrates (e.g. plastics). These advantages make flexible electronics an attractive candidate for next-generation consumer products which require lightweight, bendable, portable, and low-cost electronics. [1] [2]

Flexible Hybrid Electronics – Fusion of Flex/Rigid CMOS Fujifilm American Semiconductor MC1 0 Univ. Tokyo LG Display Opportunity Create unique industrial designs from biomedical, consumer electronics, to internet of things (IoT) Challenge 1.Heterogeneous integration 2.Additive manufacturing 3.Multi-physics simulation 4.Reliabillty under bending 5.Robust design and test 6.Physical design and verify BioMedical Healthcare Consumer Flex silicon-on-polymer/plastics technology by American semiconductor Functional ink-jet printer by Fujifilm Dimatix material printer MC10  vital sign monitor for babies Univ. Tokyo  insole pedometer with piezoelectric energy harverster LG Display  flexible display for mobile phones

* Source: DoD presentation on Proposers’ Day, Feb. 19, 2015

DA and Test for FHE - Opportunities Compact modeling: validated, computationally efficient models that can capture process-dependent variations and time-dependent degradations Process design kits (PDK): for various printing processes that are compatible with CMOS EDA tools to facilitate CMOS-FHE co-simulations Physical design and verification: tools for FHE additive manufacturing including DRC/LVS/DFM Robust design and design for manufacturability (DFM): robust design library and DFM for high production yields Design for reliability: methodologies to evaluate system reliability under repeated bending with various bending radii Design toolset integration: integrated interdisciplinary design, simulation, and analysis toolsets for designs with hybrid components