LiH Absorber R&D Alan Bross January 26, 2009. LiH Absorber in Cooling Channel  LiH absorbers are now the “baseline” for the initial 4D cooling u Replaced.

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Presentation transcript:

LiH Absorber R&D Alan Bross January 26, 2009

LiH Absorber in Cooling Channel  LiH absorbers are now the “baseline” for the initial 4D cooling u Replaced LH 2  The issues have to do with the material properties of LiH u Thermal characteristics s Thermal conductivity s Stability u Radiation Stability  Program Goal u Test Thermal properties of Hot-Isostatic Pressed LiH s Claimed to yield material with 98%+ theoretical density s Best thermal conductivity 2 Alan Bross NFMCC Meeting March 2008

LiH Disc Fabrication Subcontracted for production at Y12 Produced by Hot Isostatic Pressing Produced using existing mold design Mechanical properties of final parts will be measured Density, hardness, etc Final Parts to be chemically tested X-Rayed by Radiography to ensure no voids Machined to size Dimensional inspection Coated with vapor barrier Process steps STILL under discussion and Need to be finalized Packaged in drum type container Shipped to FermiLab via Fed-X Production will consist of 30 and 50 cm diameter disks (+2” disks for destructive testing) 3 Alan Bross NFMCC Meeting March 2008

Instrumented 30  cm Disk 4 Alan Bross NFMCC Meeting March Blind holes for housing thermo-couples

Thermal Measurement Test Setup 5 Alan Bross NFMCC Meeting March 2008 Stainless steel base structure High temp glass ceramic High temp low k gasket 1” copper tube with heaters 12” dia steel ring Machined LiH disc Thermocouples X12 Foam board & gasket Flexible cooling tube

MICE Step III.1  Produce 50 cm  X 6.5 cm thick disk for MICE for first “cooling” measurment 6 Alan Bross NFMCC Meeting March 2008 LiH Disk inside the Spool piece CalorimeterCerenkov Detector Time-of-flight Detector Solenoid

LiH Absorber for MICE Step III.1 7 Alan Bross NFMCC Meeting March 2008

Status of Negotiations with Y12  All the technical specifications and production issues are resolved  The only outstanding issue was coating the parts with a water vapor barrier u Parylene C (Preferred) u Epoxy  The coating is a safety issue only u For both Fermilab and RAL  But has led to a protracted discussion because of cost 8 Alan Bross NFMCC Meeting March 2008

Parylene C  Provides 10X better vapor barrier than epoxy 9 Alan Bross NFMCC Meeting March 2008

Procurement  Although Parylene C is preferred, the system at Y12 needs to be re-commissioned and this is adding a large ($50k) cost to the project u Negotiating cost-sharing  No commercial vendor for coating with Parylene (there are many) would do it on the LiH  Fermilab Safety prefers we DO NOT do the coating in-house  Setting up a phone meeting next week with Y12 with all the principals (has been EXTREMELY difficult) to resolve this issue once and for all. u Spray epoxy is fall-back 10 Alan Bross NFMCC Meeting March 2008