75 Ohm RF Board to Board Multi-port Coplanar & Backplane Connectors

Slides:

Advertisements

Similar presentations

GIG-Array® High Speed, High Density Mezzanine Connectors

Advertisements

High Density Mezzanine Connector System (1.00mm)

XFEL 2D Pixel Clock and Control System Train Builder Meeting, MANNHEIM 02 July 2009 Martin Postranecky, Matt Warren, Matthew Wing.

Triple-Play Service Testing

6935 Oakland Mills Road, Suite G

Power Cables - An assembly of two or more electrical conductors, usually held together with an overall sheath. The assembly is used for transmission of.

Agenda Super-Cells Multi-Cells

Orion Telecom Networks Inc Slide 1 E2, 2Mbps x 4 Opti Multiplexer Integrated E2, OLTE and Multiplexer Updated : January, , Avenue of Fountains,

MFS, MPO 4/8/12-Fiber connectors and Fan-Out assemblies.

Clear WiMax Business Applications Anne L Holmes IEEE Your clear contact Anne Lacey Holmes

© 2006 Cisco Systems, Inc. All rights reserved Introducing VoIP Networks.

Troubleshooting DOCSIS 3.0. Confidential & Proprietary Agenda  DOCSIS Why?  DOCSIS Features  System Considerations  Troubleshooting Process.

University of Kansas ITTC Research Overview Victor S. Frost Dan F. Servey Distinguished Professor Electrical Engineering and Computer Science Executive.

Enclosures & ComponentsBackplanesSystem PlatformsSwitches, Knobs & LEDsCabinets 1 Cooling Unit.

The middleware that makes real time integration a reality.

Data and Computer Communications

Advantys® STB High Density Discrete I/O Modules. AGP - English 2 Advantys® STB Advantys STB delivers customer value in distributed I/O Smart Built-in.

ELECTRONIC WORKSHOP. The point at which a peripheral attaches to. Communicates with a system unit so that the peripheral can send data to or receive information.

Commercial Portfolio Overview – Rev. 1 Commercial Portfolio Minitek Pwr™ Hybrid 4.2 & 3.0 March 2015.

Controlled Impedance An introduction (No electronics background required)

Safecom INGRESS GATE technology (Patent p) UPSTREAM RF & INGRESS NOISE BLOCKER Solving the “Funneling Effect” at HFC & RFoG networks.

Amphenol PCI Express 1.1/2.0 Solution. Page 2 PCI Architecture Roadmap During the Intel® Developer Forum in September 2007, Intel Fellow Ajay Bhatt provided.

Modified_ CIRCUIT PROTECTION SOLUTIONS Confidential and Proprietary to Littelfuse, Inc. ® Littelfuse, Inc All rights reserved. CIRCUIT PROTECTION.

Asis AdvancedTCA Class What is a Backplane? A backplane is an electronic circuit board Sometimes called PCB (Printed Circuit Board) containing circuitry.

ICE PLUG MONITORING SYSTEM Ice plug is an efficient method of providing isolation on liquid filled (water, heavy water) pipes to perform maintenance and.

System Elements HighPoint Broadband Delivery System Sector 1 Sector 3

© 2006 Avaya Inc. All rights reserved. Avaya – Proprietary & Confidential. For Limited Internal Distribution. The information contained in this document.

Confidential and proprietary material for authorized Verizon Wireless personnel only. Use, disclosure or distribution of this material is not permitted.

Slide 1 Orion Telecom Networks Inc xcvcxv Updated: April,2010Orion Telecom Networks Inc VCL-MX™ Version 5 12 E1 Voice & Data Multiplexer.

Packetizer ® Copyright © 2008 H.325 Beyond Today’s Second Generation Systems Paul E. Jones Rapporteur, ITU-T Q12/16 1.

Exercise 2 The Motherboard

Dr. Tal Lavian UC Berkeley Engineering, CET Wireless Mobile Devices Patents.

High speed internet and digital services On coaxial networks BEIRUT - Horeca 2005 Conference Jean-Michel BRUNEAU - Didier FLAENDERwww.sensinteractive.com.

CONTACT CENTRE SOLUTION Confidential All rights reserved. No part of this work may be reproduced or transmitted in any form by any means, electronic or.

Windrock... A Dover Company

PVX Product Briefing July 2005 For more information, contact: 1 PC Network Inc. 1 PC Network Inc. Phone Fax

MJS1 Computer Society SCC20 Hardware Interface Committee PAR Proposal: IEEE-P Portable-Bench Top Universal Pin Map.

RocketLINK TM ACCESS PRODUCTS The Model 3088 sets the standard for Standards-based high- speed connectivity with it’s low-cost fixed interface design G.SHDSL.

Table of Content – High Power Connector Power + Signal, Blade Style Contact Table of Content – High Power Connector Power + Signal, Blade Style Contact.

Computer Networks. Introduction Computer Network2 A History Lesson of Networking 1969 – ARPANET, first packet switched network consist of UCLA, Stanford,

Computer and Information Science Ch1.3 Computer Networking Ch1.3 Computer Networking Chapter 1.

© 2005 Calix Calix Confidential & Proprietary Service Provide Issues and Trends Frank Wiener – Vice President, Field Marketing.

BROADBAND ISDN Presented by Supreeti Mitra EI

VPX Cover Overview and Update “VPX, Open VPX, and VPX REDI ” are trademarks of VITA.

Copyright CCNA 1 Chapter 4, Part 2 Cabling LANs and WANs By Your Name.

Work at OIF on Interfaces for Optical Modules including Very Short Reach (VSR) and Electrical Interfaces Raj Savara Network Elements Inc.

Evolution towards the Next Generation Network

Jan 24, 06William Rich, Pingtel Corp. IT Expo. Pingtel Corp., William Rich, IT Expo, Jan 24, 06 VoIP is Here… Source: IDC IP PBX vs. TDM PBX.

Internet Protocol TeleVision

Approved for public domain release ( N C-0066 on ) © 2008 BAE Systems - All rights reserved EVOLUTION AND APPLICATIONS OF SYSTEM ON.

Nama: Chuli jimmi Manurung

Femto Network Dr. Monir Hossen ECE, KUET Department of Electronics and Communication Engineering, KUET.

IPC-2221 Connectors and Interconnects

Table of Content – High Power Connector Power + Signal, Blade Style Contact Table of Content – High Power Connector Power + Signal, Blade Style Contact.

Dell Rugged Docking Solutions

Programmable Logic Controllers

Connector Differential Receiver 8 Channels 65 MHz 12 bits ADC FPGA Receive/buffer ADC data Format triggered Events Generate L1 Primitives Receive timing.

Getting faster bandwidth HervéGrabas Getting faster bandwidth - Hervé Grabas1.

Evaluation of Emerging Parallel Optical Link Technology for High Energy Physics John Chramowicz, Simon Kwan, Alan Prosser, Melissa Winchell Fermi National.

Podcasting to enhance geographical field-based teaching and learning AAG, Session 4152: Skills from the landscape Stuart Downward 1, David Livingstone.

NA Sales Training 2007 The Digital Marketing Space.

SAS 3.0 2x and 4x 12Gb/s MultiLink Connector Proposal September 13, 2010 Page 1.

UL/DL Considerations of BDA fed Active DAS

Summary of cable assemblies tested

ANSI/VITA 74 also known as

Data Line Gas Capsule Protectors

Core Chemistry Revision Questions

Analog Switch Products: Ultra Portable Applications

CrystaLatchTM 1x2 Multicasting Solid-State Fiberoptic Switch

Presentation transcript:

75 Ohm RF Board to Board Multi-port Coplanar & Backplane Connectors Description NEW Board to Board Multi-port 75 Ohm Connector for Coplanar & Backplane designs. Product Facts 2 row x 6 column Multi-port configurations, allows flexibility for upstream and down stream signals Configured for Backplane and Coplanar board application Press fit connector to board interface, lower applied cost 75 dB isolation between adjacent connector locations Return Loss: 20 dB True 75 Ohm coax connector Integral rib and channel misalignment quide features for blind mate applications Higher density than discrete connectors Test reports available Design Objective 108-2401 Applications Broadband Communications – Interconnect products for “triple play” voice, video on demand, and high speed data enabling equipment.

Return Loss and Isolation Isolation: Coplanar Return Loss: Coplanar Return Loss: Backplane Isolation: Backplane

PN 2016148-x 75 Ohm Board to Board Multi-port RA Coplanar & Backplane Connector, Jack PN 2016148-x

75 Ohm Board to Board Multi-port RA Coplanar Connector, Plug PN 2016146-x

75 Ohm Board to Board Multi-port Vertical Backplane Connector, Plug PN 2016147-x

75 Ohm RF Board to Board Multi-port Coplanar & Backplane Connector: Design Objective Summary Contacts: RF Product Management – Claude de Lorraine Phone: 717-986-5793, email: cdelorraine@tycoelectronics.com RF Product Engineering – Frank Blasick Phone: 717-986-5016, email: francis.blasick@tycoelectronics.com RF Product Engineering Supervisor – Kevin Weidner Phone: 717-985-2366, email: kevin.weidner@tycoelectronics.com