Tae- Hyoung Kim, Hanyong Eom, John Keane Presented by Mandeep Singh

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Presentation transcript:

Tae- Hyoung Kim, Hanyong Eom, John Keane Presented by Mandeep Singh Utilizing Reverse Short Channel Effect for Optimal Sub threshold Circuit Design By Tae- Hyoung Kim, Hanyong Eom, John Keane and Chris H. Kim Presented by Mandeep Singh

Contents • Introduction (Sub threshold Operation) • HALO Impact in Sub threshold Region • Proposed Transistor Sizing Utilizing RSCE – Optimal Channel Length for Maximum Current per width – Optimal Channel Length for Minimum Capacitance – Impact of Process Variation – Sub threshold Swing & Ion-to-I off Ratio • Experimental Results • Conclusions

Introduction Subthreshold logics are becoming increasingly popular for ultra-low power applications, where minimal power consumption is the primary design constraint Subthreshold circuits, which operate at supply voltages lower than the threshold voltage , are considered for ultralow-power systems This paper describes a sizing method by utilizing the RSCE to improve drive current, capacitance, process variation, subthreshold swing, and improved energy dissipation.

Subthreshold Operation

HALO Impact in Super threshold

HALO Impact in Sub threshold

Proposed Transistors Sizing Considering RSCE • RSCE and the exponentially increasing current with a lower Vth results in – L opt=0.55μm for max. drain current – L opt=0.36μm for max. performance

Derivation of Optimal Channel Length

Optimal Channel Length for Min. Cap. • Moderate increase in CG due to depletion capacitance • Significant reduction in CJ due to smaller width • Net effect: minimum capacitance at longer channel length

Process Variation • Increased transistor gate area with optimal sizing reduces the impact of random dopant fluctuation • Delay variation (σ/μ) reduces from 0.24 to 0.15 • 30% average power reduction due to reduced junction capacitance

Sub threshold Swing & Ion-to-Ioff Ratio

Layout Comparison • Smaller layout area and junction capacitance • ‘Fat’ transistors with longer L and smaller W

Delay and Power Simulation Results • 38.7% reduction in delay variation for corner parameters • 10-39% reduction in power consumption due to reduced junction capacitance

ISCAS Benchmark Simulations • Two sets of libraries for delay and power comparison • 7.8-10.4% reduction in delay due to reduced junction capacitance • 8.4-34.4% power savings due to reduced junction capacitance

Conclusions • RSCE utilized for sub threshold circuits • Reduced Vth at longer channel length increases operating current due to exponential behavior • Junction capacitance reduced by using a smaller device width for the same current drivability • Proposed transistor sizing scheme achieves – 7.8~28% delay improvement – 8.4~34.4% power savings – 38.7% less delay variation • 0.13μm test chip confirms the benefits

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REFERENCES [8] C. H. Kim, H. Soeleman, and K. Roy, “Ultra-low-power DLMS adaptive filter for hearing aid applications,” IEEE Trans. Very Large ScaleIntegr. (VLSI) Syst., vol. 11, no. 6, pp. 1058–1067, Dec. 2003. [9] J. J. Kim and K. Roy, “Double gate-MOSFET subthreshold circuit forultra-low power applications,” IEEE Trans. Electron Devices, vol. 51,no. 9, pp. 1468–1474, Sep. 2004. [10] B. C. Paul, “Device optimization for digital subthreshold logic operation,”IEEE Trans. Electron Devices, vol. 52, no. 2, pp. 237–247, Feb.2005. [11] R. R. Troutman, “VLSI limitations from drain-induced barrier lowering,”IEEE Trans. Electron Devices, vol. ED-26, no. 4, pp. 461–469,Apr. 1979. [12] C. Y. Lu and J. M. Sung, “Reverse short-channel effects on threshold voltage in submicrometer salicide devices,” IEEE Electron DeviceLett., vol. 10, no. 10, pp. 446–448, Oct. 1989. [13] C. Subramanian, “Reverse short channel effect and channel length dependenceof boron penetration in PMOSFETs,” in Int. Electron Device Meeting, Dec. 1995, pp. 423–426. [14] J. Keane, T. Kim, H. Eom, and C. Kim, “Subthreshold logical effort: A systematic framework for optimal subthreshold device sizing,” in Proc. Design Autom. Conf., Jul. 2006, pp. 425–428. [15] Y. Taur, C. H. Wann, and D. J. Frank, “25 nm CMOS design considerations,” in Int. Electron Devices Meeting, 1998, pp. 789–792. [16] M. Tohmason, J. Prasad, and J. De Greve, “Suppression of the reverse short channel effect in sub-micron CMOS devices,” in Proc. Int. Semiconductor Device Res. Symp., Dec. 2003, pp. 420–421.