Fabrication Process for Micro Structures Prepared for ESS 4810 微系統製造與實驗 Si Lab 1: 1. Wafer cleaning 2. Thermal Oxide Wet Oxide Lab 2-1: 1. Lithography (PR AZ 5214, mask #1 for bulk etching window) Si PR AZ 5214 (positive) Si Lab 2-2: Break wafer into A, B BOE wet etching B, RIE dry etch A PR strip,wafer cleaning Part A Part B Dry etch wet etch Lab 3: E-beam evaporate Cr/Ni 0.05/0.15m on A TMAH bulk etch B Si Cr/Ni Si Lab 4-1: Lithography patterning Ni by wet etching (mask #3) Lab 4-2 AZ4620 lithography Plating Si AZ4620 Ni Lab 5: 1. PR strip and Oxide sacrificial etching (surface micromachining) Fan-Gang Tseng 9/9/02

Part B Part A Wafer Layout Over View Bulk micromachining Surface micromachining Bulk micromachining Part A Part B

Alignment Mark and Letters

Part A Surface micromachining Wing Structures Cantilever Beams

Part B Bulk micromachining Bridges Cantilever beams Long Slots Different Shapes