Doping-type Dependence of Damage in Si Diodes Exposed to X-ray, Proton, and He + Irradiation MURI Meeting - June 2007 M. Caussanel 1, A. Canals 2, S. K.

Slides:



Advertisements
Similar presentations
C.Manfredotti, Quartu S.Elena, WOCSDICE 2001 GaAs IBIC analysis of gallium arsenide Schottky diodes C.Manfredotti 1,2, E.Vittone 1,2,F.Fizzotti.
Advertisements

Semiconductor detectors
MURI Neutron-Induced Multiple-Bit Upset Alan D. Tipton 1, Jonathan A. Pellish 1, Patrick R. Fleming 1, Ronald D. Schrimpf.
Università degli Studi di Perugia Università degli Studi di Perugia IMM Bologna 1 Measurements and Simulations of Charge Collection Efficiency of p+/n.
REACTIONS OF INTERSTITIAL CARBON WITH BACKGROUND IMPURITIES IN N- AND P-TYPE SILICON STRUCTURES L.F. Makarenko*, L.I. Murin**, M. Moll***, F.P. Korshunov**,
Role of Hydrogen in Radiation Response of Lateral PNP Bipolar Transistors I.G.Batyrev 1, R. Durand 2, D.R.Hughart 2, D.M.Fleetwood 2,1, R.D.Schrimpf 2,M.Law.
Trapping in silicon detectors G. Kramberger Jožef Stefan Institute, Ljubljana Slovenia G. Kramberger, Trapping in silicon detectors, Aug , 2006,
3D simulations of device performance for 3D-Trench electrode detector Jianwei Chen a,b, Hao Ding a,b, Zheng Li a,b,c, *, Shaoan Yan a,b a Xiangtan University,
Radiation damage in SiO2/SiC interfaces
Department of Aeronautics and Astronautics NCKU Nano and MEMS Technology LAB. 1 Chapter IV June 14, 2015June 14, 2015June 14, 2015 P-n Junction.
Radiation Effects in Microelectronics EE-698a Course Seminar by Aashish Agrawal.
Department of Information Engineering256 Semiconductor Conduction is possible only if the electrons are free to move –But electrons are bound to their.
MURI Total Ionizing Dose Effects in Bulk Technologies and Devices Hugh Barnaby, Jie Chen, Ivan Sanchez Department of Electrical Engineering Ira A. Fulton.
J.Vaitkus et al., WOEDAN Workshop, Vilnius, The steady and transient photoconductivity, and related phenomena in the neutron irradiated Si.
Total Dose Effects on Devices and Circuits - Principles and Limits of Ground Evaluation-
KINETICS OF INTERSTITIAL CARBON ANNEALING AND MONITORING OF OXYGEN DISTRIBUTION IN SILICON PARTICLE DETECTORS L.F. Makarenko*, M. Moll**, F.P. Korshunov***,
Measurement and Simulation of the Variation in Proton-Induced Energy Deposition in Large Silicon Diode Arrays Christina L. Howe 1, Robert A. Weller 1,
NEEP 541 Ionization in Semiconductors - II Fall 2002 Jake Blanchard.
LW4 Lecture Week 4-1 Heterojunctions Fabrication and characterization of p-n junctions 1.
Fluence–dependent lifetime variations in neutron irradiated MCZ Si measured by microwave probed photoconductivity and dynamic grating techniques E.Gaubas,
Ion Implantation and Ion Beam Analysis of Silicon Carbide Zsolt ZOLNAI MTA MFA Research Institute for Technical Physics and Materials Science Budapest,
Jim Brau, Amsterdam, April 2, Nikolai Sinev and Jim Brau University of Oregon April 2, 2003 Radiation Damage Studies of Vertex Detector CCDs First.
Engineering & Computer Science 1 RADSAFE - An Integrated Radiation Effects Simulation Framework Robert A. Weller,
ULIS 2003-Udine Italy Evolution of Si-SiO 2 interface trap density under electrical stress in MOSFETs with ultrathin oxides F. Rahmoune and D. Bauza Institut.
Photodetection EDIT Internal photoelectric effect in Si Band gap (T=300K) = 1.12 eV (~1100 nm) More than 1 photoelectron can be created by light in silicon.
SILICON DETECTORS PART I Characteristics on semiconductors.
Recent related paper: Solid State Phenomena, (2011) 313 Positron Annihilation on Point Defects in n-FZ –Si:P Single Crystals Irradiated With 15.
WODEAN, June-07 Some DLTS results…. J.H. Bleka et al. University of Oslo, Department of Physics, Physical Electronics, P.O Blindern, N-0316 Oslo,
6/4/2016 I. Shlimak "C-V characteristics..." 1 Electron tunneling between surface states and implanted Ge atoms in Si-MOS structures with Ge nanocrystals.
D. Menichelli, RD50, Hamburg, august TSC, DLTS and transient analysis in MCz silicon Detectors at different process temperature, irradiation.
1 S.K. Dixit 1, 2, X.J. Zhou 3, R.D. Schrimpf 3, D.M. Fleetwood 3,4, S.T. Pantelides 4, G. Bersuker 5, R. Choi 5, and L.C. Feldman 1, 2, 4 1 Interdisciplinary.
Ultrafast carrier dynamics Optical Pump - THz Probe Ultrafast carrier dynamics in Br + -bombarded semiconductors investigated by Optical Pump - THz Probe.
Vanderbilt MURI meeting, June 14 th &15 th 2007 Band-To-Band Tunneling (BBT) Induced Leakage Current Enhancement in Irradiated Fully Depleted SOI Devices.
MURI kick-off: 5/10/05 Total-Dose Response and Negative-Bias Temperature Instability (NBTI) D. M. Fleetwood Professor and Chair, EECS Dept. Vanderbilt.
ATOMIC-SCALE THEORY OF RADIATION-INDUCED PHENOMENA Sokrates T. Pantelides Department of Physics and Astronomy, Vanderbilt University, Nashville, TN The.
SALIENT FEATURES OF SHALLOW DONOR INTERACTIONS IN PROTON-IRRADIATED SILICON V.V. Emtsev and G.A. Oganesyan Ioffe Physicotechnical Institute Russian Academy.
Effects of Surrounding Materials on Proton-Induced Energy Deposition in Large Silicon Diode Arrays Christina L. Howe 1, Robert A. Weller 1, Robert A. Reed.
Si-detector macroscopic damage parameters during irradiation from measurements of dark current evolution of with fluence Craig Buttar, University of Sheffield.
J.Vaitkus. RD50 Workshop, Liverool, May, 2011 Deep level system Gaussian approximation according the extrinsic photoconductivity in irradiated Si.
INTERSTITIAL DEFECT REACTIONS IN P-TYPE SILICON IRRADIATED AT DIFFERENT TEMPERATURES L.F. Makarenko*, S.B. Lastovski**, L.I. Murin**, M. Moll*** * Belarusian.
UNCLASSIFIED Impact of Complex Material Systems on the Radiation Response of Advanced Semiconductors Robert A. Reed Institute for Space and Defense Electronics.
Hydrogen Studying the Effect of Molecular Hydrogen on Silicon Device Radiation Response Using Gated Bipolar Transistors Jie Chen, David Wright, and.
Characterization of irradiated MOS-C with X-rays using CV-measurements and gated diode techniques Q. Wei, L. Andricek, H-G. Moser, R. H. Richter, Max-Planck-Institute.
Suppression of Random Dopant-Induced Threshold Voltage Fluctuations in Sub-0.1μm MOSFET’s with Epitaxial and δ-Doped Channels A. Asenov and S. Saini, IEEE.
Lecture 14 OUTLINE pn Junction Diodes (cont’d)
Mitsuru Imaizumi HTV-5 Spacecraft Power System, Kyusyu Inst. Tech. Dec. 11, 2015.
Effects of Device Aging on Microelectronics Radiation Response and Reliability D. M. Fleetwood, M. P. Rodgers, L. Tsetseris, X. J. Zhou, I. Batyrev, S.
Fluence dependent recombination lifetime in neutron and proton irradiated MCz, FZ and epi-Si structures E.Gaubas, J.Vaitkus, T.Čeponis, A.Uleckas, J.Raisanen,
Radiation Damage Quick Study Edward Cazalas 3/27/13.
Radiation Damage Studies for Si Diode Sensors Subject to MRaD Doses Bruce Schum UC Santa Cruz July
Radiation Damage Studies for Si Diode Sensors Subject to MRaD Doses Bruce Schum UC Santa Cruz June
7 th RD50 Workshop CERN Geneva November Università degli Studi Università degli Studi di Perugia di Perugia 1 Radiation Hardness of Minimum.
June 13, MURI Annual Review X. J. Zhou, et al 1 Effects of Switched-Bias Annealing on Charge Trapping in HfO 2 high-  Gate Dielectrics X. J.
Fluence and isochronal anneal dependent variations of recombination and DLTS characteristics in neutron and proton irradiated MCz, FZ and epi-Si structures.
TCAD Simulation – Semiconductor Technology Computer-Aided Design (TCAD) tool ENEXSS 5.5, developed by SELETE in Japan Device simulation part: HyDeLEOS.
ATOMIC-SCALE THEORY OF RADIATION-INDUCED PHENOMENA Sokrates T. Pantelides Department of Physics and Astronomy, Vanderbilt University, Nashville, TN and.
June MURI Review1 Total Dose Response of HfO 2 /Dy 2 O 3 on Ge and Hf 0.6 Si 0.2 ON 0.2 on Si MOS Capacitors D. K. Chen, R. D. Schrimpf, D. M.
Deep Level Transient Spectroscopy study of 3D silicon Mahfuza Ahmed.
Revision CHAPTER 6.
Kai Nia, Enxia Zhanga, Ronald D. Schrimpfa,
HG-Cal Simulation using Silvaco TCAD tool at Delhi University Chakresh Jain, Geetika Jain, Ranjeet Dalal, Ashutosh Bhardwaj, Kirti Ranjan CMS simulation.
Radiation Damage Studies for Solid State Sensors Subject to Mrad Doses
Results from the first diode irradiation and status of bonding tests
TCAD Simulations of Silicon Detectors operating at High Fluences D
Radiation Damage Studies for Solid State Sensors Subject to MRaD Doses
Radiation Damage in Silicon
Total Dose Response of HfSiON MOS Capacitors
Testbeam Results for GaAs and Radiation-hard Si Sensors
Quantum Mechanical Description of Displacement Damage
Mitsuru Imaizumi Space Solar Cells -- II -- SLATS
Presentation transcript:

Doping-type Dependence of Damage in Si Diodes Exposed to X-ray, Proton, and He + Irradiation MURI Meeting - June 2007 M. Caussanel 1, A. Canals 2, S. K. Dixit 3, M. J. Beck 4, A. D. Touboul 5, R. D. Schrimpf 6, D. M. Fleetwood 6, and S. T. Pantelides LP2A, Université de Perpignan Via Domitia, Perpignan, 66860, FRANCE 2 - TRAD, Labege, 31674, FRANCE 3 - Interdisciplinary Materials Science Program, Vanderbilt University, Nashville, TN 37235, USA 4 - Department of Physics and Astronomy, Vanderbilt University, Nashville, TN 37235, USA 5 - LAIN-UMR CNRS 5011, Université Montpellier II, F Montpellier cedex 5, FRANCE 6 - Department of Electrical Engineering and Computer Science, Vanderbilt University, Nashville, TN, 37235, USA Work supported by the AFOSR MURI Program Outline - Context - Samples & Experimental Set-up - Results and Discussion on - Lifetime measurements - I-V Characteristics - Summary

MURI Meeting - June Context: For more than 40 years n-Si ≠ p-Si under radiation (1/2) & 1988: disparities after electron irradiation from very low energy (a few 100 keV [1]) to high energy [2] 1. H. Flicker et al., Phys. Rev., 128, p (1962) 2. C. J. Dale et al., IEEE Trans. Nucl. Sci., 35, p (1988)

MURI Meeting - June Context: For more than 40 years n-Si ≠ p-Si under radiation (2/2) - n-Si/p-Si difference ∝ fraction of damage due to low-energy PKA [4] 3. G. P. Summers et al., IEEE Trans. Nucl. Sci., 40, p (1993) [3]: for NIEL<1 keV cm 2 /g in n-Si: Damage Coefficient ∝ NIEL in p-Si: Damage Coefficient ∝ NIEL J. R. Srour et al., IEEE Trans. Nucl. Sci., 50, p. 653 (2003)

MURI Meeting - June Experimental Description Radiation Sample Type Characterization TypeDose/Fluence Measure ments Method X-rays Up to 500 krad (SiO 2 ) by steps n + /p junctions (N A = 4×10 16 cm -3 ) I-V Parameter Analyzer 1.8 MeV H + From 5.5×10 10 to cm -3 p + /n junctions (N D = 2.7×10 15 cm -3 ) Minority carrier lifetime Open-Circuit Voltage Decay method (OCVD) 1.4 MeV He +

MURI Meeting - June Sample Structure - Top View (Sandia TA 629TDC)

MURI Meeting - June Sample Structure - Cross-Section G1916A/W33 – includes 1100 C N 2 Post gate anneal before poly-Si

MURI Meeting - June Sample Structure - Ion range

MURI Meeting - June Minority Carrier Lifetime Measurement Set-up Method based on the Open-Circuit Voltage Decay method (OCVD) Lifetime value is extracted from the linear part of the curve: Vg removed

MURI Meeting - June Reliability of the OCVD method: Measured lifetime checked with literature data Hole lifetime in n-Si (may be reduced by High-T post-ox anneal) Source: IOFFE Institute

MURI Meeting - June Reliability of the OCVD method: Measured lifetime checked with literature data Electron lifetime p-Si Source: IOFFE Institute

MURI Meeting - June I-V Characteristics under X-ray Radiation Evidence that carrier trapping occurs at certain surfaces within the sample. ➙ This sensitivity of the surface regions of these diodes to defect buildup is consistent with recent results obtained on VDMOSFETs [6] 6. J. A. Felix et al., IEEE Trans. Nucl. Sci., 52, p (2005)

MURI Meeting - June X-ray Irradiation Impact on the Voltage Drop across the Junction during Lifetime Measurement The voltage drop across the sample is reduced after the X-ray irradiation : - the higher the dose, the higher the reduction. - n + /p reduction > p + /n reduction. ➙ Also evidence of trapped charge at a SiO 2 /Si interface

MURI Meeting - June Ion Irradiation Impact on the Voltage Drop across the Junction during Lifetime Measurement - Like X-rays, ion irradiation lowers the closed-circuit voltage drop across the sample. ➙ trapped charge within bulk - p + /n reduction > n + /p reduction ➙ this trend is opposite to X-ray radiation Consistent with recent theoretical work [5], which demonstrated that Frenkel pairs are generally more stable in p-Si than in n-Si. (Frenkel pairs act as electron trap in n-Si) 5. M. J. Beck et al., IEEE Trans. Nucl. Sci., 53, p (2006)

MURI Meeting - June Ion Irradiation Impact on Bulk Lifetime Electron lifetime in p gets reduced more by both H + & He + irradiations than hole lifetime in n by a 2-3× factor This is despite the n doping being ~ 13x lower than the p doping

MURI Meeting - June Summary - Surface trapping: n + /p more sensitive than p + /n - Bulk trapping: n + /p less sensitive than p + /n - Agreement with recent experiments and theory X-ray, H + and He + irradiation of n + /p and p + /n diodes (I-V & lifetime measurements)