CBC2: CMS microstrip readout for HL-LHC [D. Braga], G. Hall, M. Pesaresi, M. Raymond (Imperial College) D. Braga, L. Jones, P. Murray, M. Prydderch (RAL)

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Presentation transcript:

CBC2: CMS microstrip readout for HL-LHC [D. Braga], G. Hall, M. Pesaresi, M. Raymond (Imperial College) D. Braga, L. Jones, P. Murray, M. Prydderch (RAL) D. Abbaneo, G. Blanchot, A. Honma, M. Kovacs, F. Vasey (CERN)

Background CMS upgrade under consideration for many years – objective to reach 3000 fb -1 in next decade or so – High Luminosity LHC (Phase II) requires new Tracker around 2023 – Requirements: lower material budget increased granularity enhanced radiation tolerance tolerable power consumption affordable cost all compatible with physics objectives –some of which remain uncertain – e.g. will new physics be discovered in next running period? – but solid long term programme of Higgs & top studies, searches, etc… Geoff HallHSDT9 Sep 20132

Evolution of objectives Original goal – new – improved - tracker with similar angular coverage, constrained by re-using existing services – provide some part of tracker data to L1 trigger to contain rate to 100 kHz More recent developments – Baseline Tracker design now adopted “conventional” barrel-endcap layout looks optimal – but CMS exploring enhancing forward region physics as well as standard physics programme – uncertainty if L1-track triggering will reduce rate to 100 kHz in 6.4µs ideas (and detector requirements) not yet validated by simulations possible objective of L1 readout up to 1 MHz/10-20µs both approaches require on-detector data reduction Geoff HallHSDT9 Sep 20133

Baseline tracker layout (pixels not shown) Double layer readout compatible with trigger Geometry compatible with forward extension Geoff HallHSDT9 Sep S short strip double-layers (~7500 modules) PS strip-strixel double-layers (~10,000 modules)

ASIC development Earliest developments foresaw conventional outer tracker, plus some dedicated trigger (and pixel) layers – 128 channel CMS Binary Chip (CBC) produced and proven 2011 – Readout architecture followed original tracker, using APV25 – Analogue data abandoned for practical reasons digital optical link components now commercially standard, ADC power 130 nm CMOS makes analogue memory cells harder to implement Subsequently, outer modules with trigger capability agreed – 254 channel CBC2 successfully developed – delivered 2012 – optimised for new assembly method with mass production in mind Geoff HallHSDT9 Sep 20135

Present CMS Tracker architecture Analogue unsparsified readout – APV25 in 0.25µm commercial CMOS – synchronous – occupancy independent data volume – 2.7mW/chan for 10-20cm µstrips – analogue data transmission to external ADC & zero-suppression, clusters semi-custom optical 40Msps 1310 nm single-mode Fabry-Perot lasers very successful reflected state of technology at the time – benefits simple and easy to debug/evaluate robust against noise Geoff HallHSDT9 Sep pipeline 128x x preamp/shaper APSP + 128:1 MUX pipe logic bias gen. control logic 7.1 mm 8.1 mm Analogue Optical Hybrid

Basic trigger module concept Compare binary pattern of hit pixels on upper and lower sensors Geoff HallHSDT9 Sep High p T tracks can be identified if hits lie within a search window in R-  (rows) in second layer ~200μm Upper Sensor Lower Sensor Pass Fail ~100μm 1-2 mm R  ~mm-cm  (rows) z  (columns) Sensor separation and search window determines p T cut z-segmentation determines vertex capability

2S PT-module with CBC2 Track & trigger µstrip module for outer tracker region – CBC2 logic correlates hits on two sensors to reject those from low p T tracks Geoff HallHSDT9 Sep x 254 channel chips bump-bonded to hybrid 8 x 254 channel chips bump-bonded to hybrid chips on top surface only; signals from lower sensor via’d through substrate ~5 cm 90 µm pitch strips sensors wire-bonded above and below ~5 cm concentrator & controller two layers of sensors low mass, high density interconnect layer

First version: CBC main features – IBM 130nm CMOS process – binary, unsparsified architecture retains chip and system simplicity but no pulse height data – designed for ~ cm µstrips < ~ 10 pF – 128 channels, 50  m pitch wire-bond either polarity input signal – not contributing to L1 trigger – powering test features: 2.5 -> 1.2 DC-DC converter LDO regulator (1.2 -> 1.1) feeds analogue FE – fast (SLVS) and slow (I2C) control interfaces Geoff HallHSDT9 Sep 2013 amplifiers & comparators 256 deep pipeline + 32 buffers 128 channel input 2.5->1.25 DC-DC converter bias generator linear drop out regulator 7 mm 4 mm 9

CBC measured performance Geoff HallHSDT9 Sep – analogue (21 x C [pF]) µW/chan – digital < 50 µW/chan – total (21 x C[pF]) µW/chan e.g. < 300 µW /channel for C = 5 pF simulation: open circles Very quick snapshot of CBC results (2011)

CBC comparator Geoff HallHSDT9 Sep thresholds adjusted satisfactorily timewalk within spec events above threshold comparator global threshold [mV] 128 channels before tuning after threshold uniformity V CTH timewalk: threshold at 1 fC VDDA postamp O/P O/S adjust 8-bit value (per channel) 16k V CTH hysteresis 2k 4k 8k 16k 500k postamp O/P comparator

Beam telescope Based on CMS Tracker DAQ readout hardware, software (used for UA9 studies) FED, APV25s, 100m fibres, custom control system, multi-core PCs 50 kHz data taking during 10s spill, 10 kHz to disk, Geoff HallHSDT9 Sep Goniometer p + beam upstream downstream XY Plane 1XY Plane 2 XY Plane 3 UV Plane 4 XY Plane 5 Crystal Granite Table 10,289mm 295 mm 416 mm 214 mm 9,960mm Trigger Scintillators spatial resolution: µm angular resolution: 5.2 µrad

APV plane CBC sensor 5 mV / division beam profile CBC beam tests 2011 CERN H8 beam line – 400 GeV/c protons Geoff Hall HSDT9 Sep cm p-on-n 150 mm pitch 320 µm thick 64 x 150 µm pitch strips bonded to 5 cm long, 320 µm thick fan shaped p-on-n sensor

CBC performance in beam Successful operation Digital logic works well – no pipeline errors – no CBC errors in > 30M events Geoff HallHSDT9 Sep use telescope to select events at CBC module - single track events only (pileup eliminated) - incident on CBC sensor (transverse to strips) - incident in 3mm along strips (const p=134um) - events within 7ns of sampling clock measure resolution of CBC module from residual - using telescope for track extrapolation - factoring out telescope spatial resolution resolution:29.4 um better than pitch/√12 due to contribution from 2 strip clusters close to binary resolution from 1 strip clusters

CBC -> CBC2: New features 250µm pitch C4 layout aim for commercially assembled module some gains in bond inductance back edge wire-bond pads for wafer probe 254 channels for strips correlation logic for stub formation between top & bottom strips vetoes wide clusters Test pulse no time to implement on CBC & other minor circuit improvements Improved DC-DC (CERN) received Jan 2013 – fully functional HSDT9 Sep DC-DC LDO pipeline + buffering 254 amplifier/comparator channels CWD, offset correction and colleraltion logic bandgap bias gen. 254 inputs 5 mm 11 mm inter- chip signals inter- chip signals Geoff Hall

16 notch wafer name: A4PNFAH CBC2 reticle CBC2 C4 wafers (shared with RAL XFEL ASIC) Geoff HallHSDT9 Sep 2013

Stub finding Logic Stubs shift register Individual mask for noisy channels →254b from I2C reg. (can be also used to inhibit coincidence logic) Need to be able to inhibit stub shift register operation →1b EN from I2C reg. 254-OR of channel outputs to signal any activity on chip 127-OR of stubs to control the stubs SR readout

Stub logic features Cluster width – exclude clusters wider than 3 strips Offset correction and correlation – programmable window, selects pT up to +/-8 channels – programmable offset, adjust lateral displacement up to +/-3 channels Geoff HallHSDT9 Sep n n+1 n-1 1/2/3 strip cluster on channel n channel comparator outputs p = ∞ IP R-  view offset

19 first wafer probed manually to select chips for module assembly Geoff HallHSDT9 Sep 2013

20 CBC2 bad chip 112 reticles 108 good chips 4 bad chips reticle final yield for 1 st wafer bad chips due solely to physical damage from probe card supply current - all chips no defective channel found on any of 112 chips tested on this first wafer => 100% yield perhaps not too surprising if overall wafer yield high CBC2 is relatively small area of reticle & significant fraction of CBC2 area not occupied by active circuitry Geoff HallHSDT9 Sep 2013

2S module Development with CMS team Substrate development mainly by CERN – Hybrid procured and assembled commercially First version: 2 chip hybrid – electrical validation Geoff HallHSDT9 Sep mount capacitors here to simulate interstrip capacitance small pitch adapter board (wire-bond pitch to 1.27mm connector) calibrated charge injection (both sensor layers)

Result with test pulse – Proves basic functionality but need real data for better test Geoff HallHSDT9 Sep

2S mini-module Prototype assembled with two sensors – Now under test in lab Geoff HallHSDT9 Sep Some illustrations of logic tests using  source follow

beta source data frame width scope in persistence mode Sr-90 source scintillator signal CBC2 trigger output hits in the data stream 24Geoff HallHSDT9 Sep 2013

CBC2 triggered data output CBC2 trigger output scintillator/PM signal hits in the data stream 25Geoff HallHSDT9 Sep 2013

CBC2 triggered data output 2 consecutive hits => track passed through strips directly above each other 50 ns 26Geoff HallHSDT9 Sep 2013

single strip clusters offset by 1 strip 75 nsec 27Geoff HallHSDT9 Sep 2013

2 strip cluster in one plane correlates with 1 strip cluster in the other 28Geoff HallHSDT9 Sep 2013

2 strip cluster in one plane correlates with 1 strip cluster in the other 29Geoff HallHSDT9 Sep 2013

2 strip cluster in lower sensor correlates with 1 strip cluster in the other, offset by 7 strip 375 nsec 30Geoff HallHSDT9 Sep 2013

Rough road map Geoff HallHSDT9 Sep CBC1 - analogue front end in 130nm - wirebonded - binary logic - L1 triggered readout only, non- sparsified CBC1 - analogue front end in 130nm - wirebonded - binary logic - L1 triggered readout only, non- sparsified CBC2 - C4 bump-bonded - full hit correlation logic - L1 triggered non-sparsified readout, fast trigger OR CBC2 - C4 bump-bonded - full hit correlation logic - L1 triggered non-sparsified readout, fast trigger OR CBC3 - full readout architecture defined - final data format - additional correlation logic CBC3 - full readout architecture defined - final data format - additional correlation logic CBC4 - optimisation - final version CBC4 - optimisation - final version S-Pt prototype module studies 2S-Pt final module studies start production

Summary & conclusions Two successful iterations of new outer Tracker ASIC First prototype version of 2S module in hand – functions well in lab environment – first beam tests foreseen late 2013 Road map for future developments – detailed schedule depends on complete upgrade plan and HL-LHC approval process Geoff HallHSDT9 Sep

Backup slides

A B upper layer strip 256 (lower layer strip 1) lower layer strip 256 upper layer strip 1 ch.1 ch.254 ch.1 ch chip A chip B upper sensor lower sensor chip channel vs. sensor strip # channel to strip no. mapping 2 edge channels on each sensor not bonded (i.e. strips inclusive bonded) 34

Comparison logic Geoff HallHSDT9 Sep Modules are flat, not arcs Compensate for Lorentz drift Orientation of module => position dependent logic d Luminous region (large!) R-z view z offset  dependent search window to allow for luminous region and quantization => 3 pixels (if not tiny) p = ∞ IP R-  view ~200µm ~12mm  = 2.5 Family of modules with offsets in z

CBC3 - the “final prototype” bottom top 8 bits to describe cluster address in bottom layer 5 bits to describe correlating cluster address in top layer window 1 or 3 strip cluster centred on channel n 2 strip cluster centred on n and n+1 n n+1 n-1 next version of chip should incorporate all features required for HL-LHC final choices for front end ½ strip cluster resolution 2 strip cluster position assigned to mid-point stub data definition 8 bits address (for ½ strip resolution) of cluster in bottom layer 5 bit bend information address of correlating cluster in top layer stub data formatting & transmission to concentrator 13 bit / stub, up to 3 stubs/BX => 39 bits +1 bit unsparsified L1 triggered readout data => 40 bits / 25 nsec e.g. 10 lines at 160 Mbps (per chip) other useful features e.g. slow ADC to monitor bias levels … concentrator CBC 10 lines / CBC 25 ns S1 B1 S2 B2 S3 B3 R 25 ns CBC data to concentrator Geoff HallHSDT9 Sep 2013

Principle of Beam Collimation Secondary halo p p e  Primary collimator Core Diffusion processes Shower Beam propagation Impact parameter ≤ 1  m Sensitive equipment Primary halo (p) e  Shower p Tertiary halo Secondary collimator... two stage cleaning... Walter Scandale, 2010

p Beam propagation Primary halo (p) Absorber  Coherent deviation of the primary halo  Very small probability of inelastic interaction in the crystal  Larger collimation efficiency  Less impedance  Reduced tertiary halo Crystal Crystal collimation Beam Core E. Tsyganov & A. Taratin (1991)  = O(100µrad) l = O(10 -2 m)

The main curvature due to external forces induces the anticlastic curvature seen by the beam Crystal size: 0.9 x 70 x 3 mm 3 Strip crystals Built at IHEP - Protvino and at INFN - Ferrara Main radius of curvature Radius of anticlastic curvature

Quasi-Mosaic effect (Sumbaev, 1957) The crystal is cut parallel to the planes (111). An external force induce the main curvature. The anticlastic effect produces a secondary curvature The anisotropy of the elastic tensor induces a curvature of the crystal planes parallel to the small face. Beam direction Quasimosaic crystals Built at PNPI - Gatchina Crystal size: 0.7 x 30 x 30 mm 3

Rotation angle (µrad ) Angular profile (µrad) 1 -“amorphous” orientation 2 -channeling (50 %) 3 -de-channeling (1 %) 4 -volume capture (2 %) 5 -volume reflection (98 %) Angular beam profile as a function of the crystal orientation The particle density decreases from red to blue The angular profile is the change of beam direction induced by the crystal The rotation angle is angle of the crystal respect to beam direction 9mm long Si-crystal deflecting 400GeV protons