Pressure Cure Oven (PCO)

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Presentation transcript:

Pressure Cure Oven (PCO)

Introduction Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications PCO pressurizes air into a rigid vessel and heats & cools with forced convection Heaters, heat exchangers and blowers are internal to the pressure vessel When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools

(for primary industry) PCO Introduction Viable applications for PCO PCO [Autoclave] Semi. Glass Display Food & etc Medical Test/ Lab. Composite forming (for primary industry) Die attach curing Wafer laminating Thermal compress bonding Underfill curing Via filling Film & Tape bonding

Introduction Air bubbles Solder ball Substrate PCO is applied for curing die attach adhesive and removing voids in adhesive or already soldered products

Process Specification Process time: Generally 120 min or User’s spec Operating temp: 60oC ~ 200oC Maximum temp: 220oC Operating pressure: 1 bar – 10 bar Capacity: 24 Magazines (typical) Cooling method: PCW (17oC - 23oC) Cooling water pressure: 25 – 40 psi Representative Pressure/Temp Profiles (User Configurable) 200℃ 60℃ Temp. 30min 90min 120min Time 10 bar 20min 110min Cooling process Curing process Rising process Pressure.

System Dimensions 1,700㎜ 2,200㎜ ※ Wight: About 2.7 Ton 1,700㎜

Chamber Dimensions 199.5mm 440mm 189mm 716.5mm 608mm

Chamber with Shelves Extended

Fan motor & mechanical seal Return air assistance damper System Air Flow Heater module Fan motor & mechanical seal Door inside cover Return air assistance damper radiator

Vacuum Module Option Vacuum Module (Optional) Vacuum in/out line Gauge Vacuum pump