Setup, Tests and Results for the ATLAS TileCal Read Out Driver Production J. Alberto Valero Biot IFIC - University of Valencia 12th LECC - September.2006 (VALENCIA)

2 Outline Introduction Setup & tools for ROD production Production tests Results and conclusions

3 The TileCal ROD system ATLAS ROD crate TileCal  3 Barrels-4 partitions: 64 modules/partition.  Data redundancy system: 2 fiber links/module.  128 fiber links per barrel. oExtended barrel: 32 channels / fiber link. oLong barrel: 48 channels / fiber link. ROD system  4 barrels  4 ROD crates, 8 ROD systems/crate.  ROD system: OMB  ROD  TM.  TOTAL: 32 ROD systems.  We have tested RODs + TMs ( OMB designing)

4 Outline Introduction Setup & tools for ROD production Production tests Results and conclusions

5 Setup for ROD production DUAL TIMER Trigger frequency Trigger width Handling of vetos OMB 6U prototype Trigger detection Data injection OPTICAL BUFFER Data buffer 1:16 ROD CRATE 4 RODs to be tested 4 Transition Modules 1 TBM COMPUTERs Full system configuration 2 FILAR cards Data storage Data check

6 O ptical M ultiplexer B oard - 6U prototype VME_FPGA ALTERA ACEX FPGA EP1K100 VME R/W registers Status/control CRC error registers Provides communication between VME bus and CRC_FPGAs. 2 CRC_FPGAs Altera Cyclone® FPGA Real-time CRC check Internal memory lets us download and inject real events towards the ROD. Event counter generator CRC injection OPTICAL I/O 4 Optical transceivers I/O (Infineon®V23818-K305-L17) 2 Inputs / 1 Output per each CRC_FPGA SERIALIZERS/ DESERIALIZERS 4 receivers (HDMP 1034) 2 transmitters (HDMP1032) The same ones as the I.C.s VME INTERFACE FP connectors LEMO input conectors: Trigger and busy UNITS 1 Valencia LAB 1 CERN 2 Inoperative

7 OMB 6U: Functionality CRC MODE (Main function in final OMB version) 4 Inputs / 2 Outputs Copy mode - No data modifications Real time decision Registers with CRC error counters LEDs for notice CRC errors

8 OMB 6U: Functionality (II) INJECTION MODE 2 Optical Outputs Internal memory for inject events from a file Internal counter for automatic events generation CRC word injection on each event sent External/Internal trigger selection Frequency selection for internal trigger

9 Optical buffer 1:16 VME bus, used to take 3,3V power supply and grounding from the backplane connectors. Size: VME 9U standard (367 x 400 mm). Approximately power consumption Front-panel:  One RJ-45 style LC connector input.  16 RJ-45 style LC connectors outputs.  One power LED. Multimode 850 nm and GBd Fibre Channel Infineon ® transceivers (V23818-K305-L17) Four Freescale ® Clock drivers ( MC100ES6111 ) 16 OUTPUTS

10 Computers and software PC_1 : FILAR and DATA storage  Supermicro dual Xeon CPU  2 FILAR cards; read out 4 RODs  Data storage in a shared file system PC_2 : Monitoring tasks  Slinksampler - Access to the shared file system  CRC calculation and checking PC_3 : TDAQ- Main partition  IGUI (System configuration )  JAVA panel for dynamic tests

11 Setup at LAB (IFIC –Valencia) DUAL TIMER OMB 6U OPTICA L BUFFER ROD crate PC_3PC_2 PC_1

12 Outline Introduction Setup & tools for ROD production Production tests Results and conclusions

13 ATLAS calorimeters common ROD tests At the industry (PCB ‘TechCI’ (France) and components assembly ‘Seisystem’ (Italy)) RODs will be delivered with :  General tests and mechanical checks (installation of pieces, connectors)  JTAG boundary scan tests with final PU installed  X-ray tests on PUs University of Geneva tests  Static tests  Data path tests: send data from the Staging FPGA via the PU to the OC  Dynamic tests: Injector  ROD  Slink (or SDRAM)  Different frequencies  Full & Staging mode

14 RODs modifications for TileCal Hardware: HW modifications in order to adapt the ROD for TileCal requirements related to the frequency of data reception in G-Links (clocks, passive components) and number of PUs used per ROD, 2 instead of 4. Firmware: Firmware specific for Tiles: Staging FPGA (v.5.2.0) Also specific firmware for InputFPGA and DSP code, downloaded at configuration time. Firmware upgrades: Output_FPGA(v ) and VME_FPGA(30a.06.05).

15 Production database Every time a ROD is modified, it is labeled. We associate to every ROD, two Processing Units and one Transition Module. All the group is labeled and tested together. Every test done to any ROD, is saved in the database with all the information about the test: RODid, time, events, rate, events checked, errors and result. Once a ROD has passed all the tests, this ROD with the PUS and TMs associated are labeled with a FINAL label (sticker), and is installed in the pit together.

16 ROD production test protocol LEVELRODsRATETIME (at least) 0Three DVS tets Hz4 h. 211 KHz8 h. 341 KHz72 h. DVS : It is run from the TDAQ software and write and read in all the registers testing the correct functionality of all the registers in the ROD. It also boots the DSPs and injects three events from the DSP and read these by the VME bus. LEVEL 1: At this rate we can check all the events passing across the ROD. LEVEL 2: We check the ROD with busy signals produced saving data in disk. We check 40% of events and we test the busy handling in the DSP. LEVEL 3: We check half crate with busy signals. The number of events checked are ~ 10%, but in 72 hours we check up to 22 Mevents per ROD. Checking: All events include the CRC16 word for the whole event, and we check this word when the event arrives to the data storage computer. Besides, the TDAQ checks for lost events.

17 Outline Introduction Setup & tools for ROD production Production Results and conclusions

18 ROD production results RODs validated: spares Different problems found and solved: RODF24 : ORx replaced RODF30 : DC/DC replaced RODF25 : scratch over a data bus. Repaired at UniGe. RODs repaired were revalidated after their reparation.

19 ROD production results (II) Level 1Level 2Level 3Extra runs Time (h) Events processed 268 x ,6 x10 9 7,1 x ,7 x 10 9 Events checked 268 x x x x 10 6 Total hours: 3225 h. Total events processed: 13 x 10 9 events Total events checked: 1,7 x 10 9 events Each ROD at least 84 hours, 264 x 10 6 events processed and 38 x 10 6 checked events without errors. Events injected for the production of 175 words ( 9 samples / 1 gain ) It represents a bit error rate for all the bits checked better than

20 Temperature tests The common ROD is prepared for water cooling, due to LAr G-links are clocked beyond the nominal specifications. Tests done in the lab and in USA15. Emulating the final situation with 8 RODs and 8 OMB. Air cooling better in USA15 than in the lab. In USA15, temperature below 50ºC in all the cases. Staging_FPGA reprogrammed to switch on the LED in the front panel if temperature in any G-Link is above 60ºC.

21 Conclusions 36 RODs validated / 24 installed in USA15. Currently in commissioning period, RODs are being integrated in the ATLAS data taking system. BER ( ) better than the G-Link specifications ( ) The production test-bench is used to develop ROD firmware upgrades and DSP reconstruction code.