Project Title: CPS 2 Cyber Physical Systems (CPS-Equipment) enable manufacturing of CPS-Products Jochen Reisinger, Infineon Technologies Austria AG Villach in Austria, Market 1: Manufacturing Equipment e.g. Germany 6000 companies (#1) – employees Leading position of Europe in danger!! Market 2:CPS – OEM, Tier 1, Tier 2 e.g. Semiconductor !! – CPS Software

Multi Domain & Multi Physics R&D The T-Model = New Concept to link the R&D-Flows HW&SW development chain from Tier 2 to OEM (Fig 1) Product Challenge driven Innovation of Manufacturing Equipment R&D (Fig 2) Full Chain from Requirement Management to Validation – Standardization Multiple Research Domains & Markets - Fix: Semiconductor (Sensor, Signal processing, Control, Drivers,..) - Mechanical Engineering – System view depending on OEM partnerships Focus on ASP1: Methods and processes for safety-relevant embedded systems And ASP4: Embedded Systems for manufacturing and process automation

Real ECSEL approach: CPS 2 should start within ARTEMIS (System View) Strong intention to go also for ENIAC (Component View) There are some ideas to address EPOS (Umbrella) H2020 Challenges will be taken into account (project links in mind) Infineon offers Semiconductor Solutions for Mobility / Automotive Power / Energy Efficiency Safety & related Communication Challenges Infineon offers Semiconductor Solutions for Mobility / Automotive Power / Energy Efficiency Safety & related Communication Challenges

Consortium Status: Well established partnerships from FP7, ARTEMIS, ENIAC and National (DE & AUT) projects Partners involved: Siemens, Infineon Technologies AG, Infineon Technologies Austria AG, CISC, Joanneum Research, edacentrum Partners Contacted: STM, NXP, AIT Missing expertise: - additional OEM (Manufacturing Equipment) – ind, sme - as we are addressing a new collaboration and interaction concept at all => all new ideas are very welcome, FoF, Industry 4.0, IoT, ….