Tel: 惠州市永隆电路有限公司 Wing Lung(Hui Zhou)PCB CO.,Ltd

Tel: Company Map(1)

Tel: Company Map(2)

Tel: Company Overview Name:Wing Lung(Hui Zhou)PCB CO.,Ltd Founded:August,2005 Total investment :HKD30Millions Total Area :20000 m 2 Floor Area :10000m 2 Production Capacity:400000m 2 /year

Tel: WL Organization Structure

Tel: Human resources FundationDistribution Manager and supervisor 5 Engineer10 Technician15 Operator162 Total192

Tel: Production Lead-time Sample Lead-time Double side : 5~7days 4~6 layer : 7~8days Above 8 layer : 10~12days Mass Production Double side 2 weeks 4~6 layer 3 weeks 3~ Above 8 layer 3~4weeks

Tel: Process Capability cv ItemCapability description 1 Layers count2~10 layers 2 Finished Board Thickness16~118 mil(0.40 mm – 3.0 mm) 3 Max. panel size18” × 24” (457mm × 610mm ) 4 Available Laminates MaterialFR-4, CEM-1,CEM-3, High Tg, High CTI, Halogen Free. 5 Finished board Thickness tolerance ±10% 6 Inner thin core Min. thickness 4mil (0.10mm) 7 Min. Inner Line Width/Spacing 4mil (0.10mm) 8 Min. outer line width/spacing 4mil ( 0.10mm) 9 Layer-layer registration tolerance ± 3mil (± 0.076mm ) 10 Copper foil thickness18u, 35u, 70 u, 105u (1/2oz-3oz) 11 Min. finished hole size0.25mm (10mil)

Tel: s/n ItemCapability description 12 Min. drilling bit size0.25mm 13 Max. drilling bit size6.00mm 14 Finished hole size tolerance (PTH) ± 0.08mm (±3mil) 15 Finished hole size tolerance (NPTH) ± 0.050mm (±2mil) 16 Drill hole true position tolerance (Compared with CAD data) ± 0.08mm (±3mil) 17 PTH hole copper thickness>=20um (0.8mil) 18 Max. Aspect ratio8:1 19 Impedance Control±10% ohm 20 Min SMT PAD Pitch & precision tolerance 0.4mm/±4mil 21 Min. solder mask opening3mil (0.076mm) 22 Min. Solder mask coverage3mil (0.076mm) 23 Min. solder dam0.10mm (4mil)

Tel: s/n ItemCapability description 24 Surface Finished Hasl(Lead free),OSP,Flash gold,Gold finger,Immersion gold,Immersion Tin,Immersion silver 25 G/F Au thickness 1~30U" 26 ENIG Au thicknessNi: 100~150U" / Au: 1~5U" ( um / um) 27 Immersion silver6-12U" (0.15um-0.30um) 28 Immersion Tin >=31.5U" (>=0.8um) 29 OSP um 30 V-Cut angle30° 31 Min. V-cut board thickness0.60mm 32 Gold finger Chamfer angle 20° 、 30° 、 45° 33 Profiling mode Routing & Punching 34 profiling tolerance ± 0.10mm (4mil) 35 E-Test voltage 250 ± 50V 36 Max. E/T Insulation resistance100 MΩ 37 Min. E/T conductive resistance10Ω

Tel: Production Chart

Tel: Quality Assurance policy Quality systems development roadmap: Registration UL: E ISO9001 ： 2000 certificate of registration 2007 Plan to apply for TS/ Plan to apply for ISO14001