High Voltage Cards & 2000 Electronic/Thermal Model. CMS ECAL End Cap Meeting CERN 19 June to 23 June 2000A.B.Lodge - RAL -1 ECAL End Cap 1 EE End Cap Engineering.

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Presentation transcript:

High Voltage Cards & 2000 Electronic/Thermal Model. CMS ECAL End Cap Meeting CERN 19 June to 23 June 2000A.B.Lodge - RAL -1 ECAL End Cap 1 EE End Cap Engineering John Hill

J A Hill - Rutherford Appleton Lab ECAL End Cap 2 Timescales Driven by –Installation in late 06/early 07 –Long lead time for large mechanical items Parallel critical/near critical paths: –Large mechanical items –Backplate/Positional Spacers –Support Ring –Environmental Shield Assembly

J A Hill - Rutherford Appleton Lab ECAL End Cap 3 EE End Cap Layout

J A Hill - Rutherford Appleton Lab ECAL End Cap 4 EE End Cap Engineering ECAL End Cap Engineering Design Update General Assembly of End Cap (using 50 channel readout box units) 90% complete. Super Crystal positions fixed, positional spacers (super crystal seating elements) fixture to backplate now specified. Backplate with cooling circuit designed to 50 channel scheme, inclusion of EE assembly and installation fixtures. Support Ring designed within parameters of EDR specification, accommodation for End Cap electrical/cooling patch panels, interface to HE as requested Environmental Shield Assembly currently being detailed with IHEP Protvino

J A Hill - Rutherford Appleton Lab ECAL End Cap 5 EE Backplate EE Backplate (known details) - Major dimensions (radii, thickness). - Material (Al/Alloy) - Location and fixture of positional spacers (Super Crystals). - Assembly/Installation brackets fixing points. - Environmental Shield fixing points. EE Backplate (unknown details) - Super Crystals Slot positions (opening for SC electronics cable/connector and fibre optic monitoring. - Support system for Electronics and services - Backplate Cooling circuit (details of arrangement)

J A Hill - Rutherford Appleton Lab ECAL End Cap 6 EE Support Ring EE/HE Interface Support Ring (current) - Detailed to 50-channel layout - Detailed with support fixtures to EE Backplate (with provision for insulation). - Provision for EE Services Patch Panel. - HE Integration fixtures as proposed layout (including shim). EE/HE Interface Support Ring (future) - Agreement on EE/HE Fixture - Design and arrangement (in particular depth) may change due to new design of electronics (effect on HE?). - Template requirement for fixture holes between EE-HE.

J A Hill - Rutherford Appleton Lab ECAL End Cap 7 EE Environmental Shield Assembly EE Environmental Shield (current) - Layout/scheme of outer, inner, front shield produced by RAL, to within CMS/EE parameters, clearance to Super Crystals (outer, inner and front). - Detailed engineering and thermal analysis in progress by IHEP Protvino.