THEMIS Instrument PDRMission Assurance- 1 UCB, October 15-16, 2003 THEMIS Mission Assurance Preliminary Design Review Ron Jackson University of California – Berkeley (510)

THEMIS Instrument PDRMission Assurance- 2 UCB, October 15-16, 2003 Status of PAIP UCB At GSFC for approval TUBS (FGM) At GSFC for approval CETP (SCM) At GSFC for approval SWALES (Probe) At GSFC for approval

THEMIS Instrument PDRMission Assurance- 3 UCB, October 15-16, 2003 QA Requirements and Documentation Performance Assurance Implementation Plan (PAIP) THM_pa_001A.doc Version A-2003-Sept 30

THEMIS Instrument PDRMission Assurance- 4 UCB, October 15-16, 2003 Responsibilities of Mission Assurance Flow-Down of PA Requirements FGM / TUBS SCM / CETP Probe / Swales Use of Previously Flown Hardware Will be subject to PA requirements Comply with EWR127-1 requirements for safety Establish and support spacecraft system safety plan Perform Preliminary Hazard Analysis (PHA) Maintain hazard control verification log Develop safety noncompliance reports as required

THEMIS Instrument PDRMission Assurance- 5 UCB, October 15-16, 2003 Responsibilities of Mission Assurance EEE Parts Requirements GSFC-311-INST-001 Parts Derating Radiation tolerance Alerts Parts age control Parts Control board Materials and Processes Controls Hazardous materials requirements Vacuum outgassing requirements Materials lists Alerts

THEMIS Instrument PDRMission Assurance- 6 UCB, October 15-16, 2003 Responsibilities of Mission Assurance Procurement and Subcontractor Controls Receiving Inspection Clean Room Controls Manufacturing and ESD Controls Calibration Controls Personnel Training and Certification to NASA Standards

THEMIS Instrument PDRMission Assurance- 7 UCB, October 15-16, 2003 Manufacturing, Assembly, and Quality Control of Electronic System will be in compliance to the following NASA technical standards: NASA-STD Workmanship Standards for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies NASA-STD Workmanship Standard for Surface Mount Technology NASA-STD Soldered Electrical Connections NASA-STD Crimping, Interconnecting Cables, Harness, and Wiring NASA-STD Electrostatic Discharge Control

THEMIS Instrument PDRMission Assurance- 8 UCB, October 15-16, 2003 In-process Inspection and Test Monitoring During Manufacturing Integration and Testing Readiness Review / Test Witness Verification and Environmental Test Review Final Acceptance Data Package Problem Failure Reporting and Review Configuration Management and Data Control Internal and External Auditing Support Test Readiness Reviews and Pre-Ship Reviews Contamination Control Plan Software Assurance Plan

THEMIS Instrument PDRMission Assurance- 9 UCB, October 15-16, 2003 Supplier Audit Status CETPC SwalesP University of ColoradoP ICS Radiation TechP Valley CircuitsA Speedy CircuitsA Wyle LabsA CorwilA MaxwellA ECR LabsA Golden Altos Inc.A UTMCA Sierra CircuitsA Rigiflex TechA TUBSC Notes: Approved = A Pending = P Conditional = C