VELO upgrade news 19 January 2010

VELO Upgrade Survey  Not yet filled in, but last answers arriving in the next 24 hours....!  Hope to soon appoint coordinators of each work package. They must be available, enthusiastic, and able to: Establish contact with all interested parties and summarise progress to date in upgrade meetings Coordinate and plan activities Maintain web pages linked from  Following slides are indicative only

Strawman layouts  Many groups volunteered to provide ideas for layouts. One week to go! See Marco’s presentation from today me, or upload any idea (however crazy!) to

Work Package I Finalise ‘Strawman’ Layout  CAD drawings, cooling options, RF shield studies, physics impact of design variations (SU)  Addition of hybrid geometry option (SU) PIDC Contribute ideas (by 25 th January) 14 Study selected layouts with parametric simulation 14 Study selected layouts with full simulation 31 Contribute engineering cartoons11 Thermal simulations12 Foil R&D assessment11 Impact on electronics design3 Comments received (abbreviated!) and work in progress

Work Package II CO 2 vs LN 2 cooling choice PIDC Specify baseline CO2 solution1 Specify baseline LN2 solution 1 Risk Assessment3 Comments received (abbreviated!) and work in progress

Work Package III Module Cooling Structure PIDC CVD diamond procure test pieces12 CVD diamond irradiation tests02 CVD diamond thermal measurements 22 CVD diamond mechanical measurements 22 CVD diamond brazing and gluing3 CVD diamond Thermal simulations 12 CVD diamond cooling tube connection 21 Microchannel cooling assessment3 TPG/CF solution1 Cooling connections off module and at vacuum flange 1 Comments received (abbreviated!) and work in progress  Very small glass capillaries (several tenth of mm) for cooling as alternative for metal tubes connected to diamond. (N)  System Issues (SU)  Heat pipes (SU)  General CVD diamond studies (N)  Cooling pipe attachment, and feasibility studies of orbital welding of cooling tubes (N)  Alternative vendors (SU, Bristol)  Collaboration with DM for diamond irradiation and thermal properties (CERN)

Work Package IV Hybridisation Options PIDC CVD diamond metallisation tests2 Thin kapton, power tape development 1 MCM-D technology1 Hybrid connector choices2 Module wire bonding1 CVD diamond brazing1 CVD diamond gluing1 Interposer R&D1 BCB R&D1 Assembly of timepix to thinned silicon 11 PIDC Assembly of thinned timepix to thinned silicon 11 Assembly of first timepix stave21 Final module mechanical design (Jan 2012) 3 TSV technology11 Bump bonding technology11

Work Package IV (cont.)  Extra topic: relationship to tank structure. Gluing not just limited to CVD diamond gluing. (SU)  Information gathering excercise on metallisation, bump bonding, TSV, wafer thinning: study of Fermilab sampes (SU)  Bump bonding experience (SU)  RELAXD development synergy: Assembly of thinned timepix, TSV, Bump bonding (N) Comments received (abbreviated!) and work in progress  Collaboration with CERN PCB workshop for metallisation and multilayer substrate tests (CERN)  Collaboration with DM for diamond metallisation (CERN)

Work Package V Link Technology PIDC Optical/Copper transition31 High Speed Copper cables22 Feedthrough investigation31  Collaboration with NA62 useful  Initial contact with candidate vendor established (CERN)  Rad Hard FPGA investigation relevant? (SU) Comments received (abbreviated!) and work in progress

Work Package VI Sensor Technology Development PIDC Planar silicon: Guard ring options11 Planar silicon: silicon thickness optios 1 Planar silicon: prototype production and bond to timepix 2 Planar silicon: Evaluation of non- irradiated and irradiated modules 11 3d silicon sensor development for LHCb 1 3d sensors bonded to timepix1 3d sensors: Evaluation of non- irradiated and irradiated modules 1 Diamond sensor development for LHCb 2 Diamond sensors bonded to timepix 2 Diamond sensors: Evaluation of non-irradiated and irradiated modules 2  CVD diamond characterisation already started (strip detectors, soon modules with timepix/medipix, irradiation, characterisation (SU)  Edgeless sensors within RELAXD project (N)  Prototype production synergy with RELAXD project (N) Comments received (abbreviated!) and work in progress

Work Package VII Simulation Software Development PIDC Parametric Studies: Geant 3 based21 Parametric Studies: supply hit distributions etc. from Gauss+Boole 1 Boole core development11 Brunel core development: Pattern recognition1 Brunel core development: Tracking11 Use of official software to investigate electronic features 11 Electronic readout schemes in boole Trigger algorithms11 Gauss XML description, material budget1 Implement detector variations in XML1 Evaluate performance in selected physics channels11  Standalone simulation, Parametric simulation (GEANT3) Data flow simulation (SU)  Parameteric studies (N) Comments received (abbreviated!) and work in progress

Work Package VIII Electronics R&D PIDC Contribute new ideas for architecture 12 Chip design (digital or analog part)12 Provide simulations12 Design chip readout scheme and link integration 12 Test and irradiate prototypes2  Collaboration with Bruco started to develop ASICS for high speed links and r/o architectures. Will address Velopix issues (N)  Lab study of timepix (SU)  Day long work shop should be planned Comments received (abbreviated!) and work in progress

Work Package IX Infrastructure PIDC Timepix Telescope arm: Relaxd11 Timepix telescope arm: Interface Board 1 Timepix telescope arm: Chipboard1 Timepix telescope arm: Mechanics11 Timepix telescope arm: Services Timepix telescope arm: Pixelman Timepix telescope arm: PMTs11 Timepix telescope arm: Timing unit 12 DUT mechanics for telescope11 Development of test vacuum tank1 PIDC Outgassing testing facility1 Proton irradiation of components2 Other irradiation of components2 Development of laser scanning stand 3 Development of cosmic ray stand2  CO2 cooling test facility available (N)  Ensure infrastructure is available for sources as well as laser/cosmics (SU)

Designs in progress and construction....

Work Package X Foil R&D PIDC CF foil: assessment of R&D schedule 1 CF foil development1 Other11  Prototype fabrication (SU)  prototype testing (SU)  RF shield test stand (SU)  Material selection and tests, prototype fabrication and testing already initiated (SU)  Milling and super plastic deformation of AL foils) (N) Comments received (abbreviated!) and work in progress

Work Package XI Strip Option PIDC Strip parametrisation for Hamamatsu1 Follow Strip Chip development2 Comments received (abbreviated!) and work in progress