Dummy Modules The next step is to build and test 10 thermal modules for tests and distribution. What do we want to test? Thermal performance and variation Assembly techniques Parts fabrication Adhesives Flatness Alignment HV performance Possible grounding schemes Paralyne coatings

Parts Parts and materials Dummy ROICs and Sensors – Patterned Al parts from Cornell Include edge breakdown test structures Include alignment targets for assembly checking – extend bottom sensor Backside Al to test HV robustness? – Blank silicon from FNAL – Bonded assemblies from RTI (or another vendor) Test underfill, flux options Test edge breakdown Rods – FNAL – Tilted barrel - CERN

Parts Heaters and RTDs – Heaters ordered by Fermilab Design connectors for parts so modules are easily interchanged – RTD locations Carbon fiber – Parts will be machined when layups are done for FPIX – Any changes? AL-CF – Machine new designs Split between FNAL and universities – Look at carbon foam alternatives – Explore larger material for water jet cutting Wrap-around – Simple circuit to check wirebonding

Assembly Hand assembly for initial thermal modules Begin to exercise techniques and fixtures – Glue application – B-stage epoxy films? Paralyne coating – Test robustness Alignment – Include features to check alignment Tests – CMM and CO2 system at FNAL – Send to DESY … Grounding – Can we build a properly grounded assembly – What changes would be needed?

Who does What? To be discussed CF – Fermilab Overall thermal test definition – Purdue? Al-CF – FNAL/Brown/Cornell/Rutgers? – Each a few? Sensors – Design FNAL/UCD – Fabrication – Cornell Module assembly – FNAL/Brown/Purdue/Rutgers (2-3 each) QC – FNAL+ - need to understand what is needed for local QC testing Time scale – parts in hand this summer – modules in fall