Technology Department CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTENT 2 In the frame of the Accelerators & Technology Sector at CERN,

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Presentation transcript:

Technology Department CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTENT 2 In the frame of the Accelerators & Technology Sector at CERN, the Technology Department is responsible for technologies specifically related to existing particle accelerators, facilities and future projects The main domains (key technologies) of activities cover:  magnets (superconducting, normal conducting, fast pulsed magnets, electrostatic and magnetic septa),  their machine integration and protection  power converters  cryogenics  high and ultra-high vacuum systems, coatings and surface treatments The Technology Department equally provides support to the experimental detectors, for cryogenics, vacuum, coatings, surface treatments and power converters

3 CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTENT

4 CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTENT Accelerator Beam Transfer group (TE-ABT) Conception, design, development, construction, installation, operation and maintenance of the injection and extraction equipment in the accelerator complex, beam transfer lines between accelerators up to primary targets and beam dump systems, including studies for future projects  pulsed magnets and associated high voltage pulse generators and transmission lines  electrostatic and magnetic septa, including high voltage power supplies for electrostatic septa  electrostatic lenses and deflectors for low-energy beam transfer lines  protection devices  associated equipment-level control systems and software

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 5 Accelerator Beam Transfer group (TE-ABT) Fast pulsed systems (kickers) LHC injection kickers Septum magnet Positioning system Vacuum tank very short pulses (from100 ns to100 μs) high voltage (up to 80 kV), high current (up to 30 kA) high voltage assemblies and circuitry, switches (gas tubes or semiconductor), cables, connectors ultra high vacuum (down to mbar), precision mechanics, brazing/welding techniques, various metals, surface coating, ceramic insulators and capacitors (in vacuum) high voltage (up to 300 kV) electrostatic devices (cables, switches, resistors) pulsed (ms to s), high current (up to 40 kA, 100 A/mm 2 ), thin water-cooled septum coils ultra high vacuum (down to mbar), precision mechanics, precision positioning systems, brazing / welding techniques, various metals, surface coating, ceramic insulators

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 6 Cryogenics Group (TE-CRG) Design, construction, installation, operation & maintenance of cryogenic systems for accelerators and detectors  Design, construction, commissioning, installation, operation and maintenance of the cryogenic systems for CERN accelerators and detectors  Operation, maintenance and upgrade of cryogenic test facilities  Support for low-temperature developments and tests at the Central Cryogenic Laboratory  Supply of industrially provided cryogenic fluids on the CERN site  Consultancy and support in cryogenic design and cryogenic instrumentation

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 7 Cryogenics Group (TE-CRG) Helium storage in gaseous phase Helium storage in liquid phase Liquid nitrogen storage 58 units 65 units 6 units 14 units Cryogenic fluids management LHC helium inventory including strategic storage: 150 ton 36’000 ton of cold mass (superconducting magnets) distributed over 26.7 km of the underground accelerator to be cooled at 1.9 K (superfluid helium) Helium cryogenic 4.5 K & 1.8 K

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 8 Electrical Power Converters group (TE-EPC) Design, development, procurement, construction, installation, operation and maintenance of electrical power systems for all accelerators, transfer lines, experimental areas and tests facilities at CERN  Power converters for normal conducting and superconducting magnets  Solid state klystron modulators  Static Var Compensators  The group provides expertise in the fields of power electronics, power quality, analogic and digital electronics, control system, high-precision current and voltage measurements

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 9 Electrical Power Converters group (TE-EPC) 1-quadrant power converters:  [13kA,18V] : 5*[3.25kA,18V]  [8kA,8V] : 5*[2kA,8V]  [6kA,8V] : 4*[2kA,8V]  [4kA,8V] : 3*[2kA,8V] Pulsed Klystron modulators for LINACs (new project Linac 4) Characteristics :  output voltage : 100 kV  output current : 20 A  pulse length : 700  s  flat top stability : better than 1%  2 Hz repetition rate 700 µs Beam Peak power : 2 MW Soft-switching modular power converters

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 10 Machine Protection and Electrical Integrity group (TE-MPE ) Support LHC operation and maintain state ‐ of ‐ the art technology for magnet circuit protection and interlock systems for the present and future accelerators, magnet test facilities and CERN hosted experiments  Provide a CERN central service for the layout, industrialization and production of electronics modules either based on industrial standards or fine pitch detector specific technologies. Make available expertise for application specific designs requiring R&D in the domains where CERN is at the forefront  Responsibility for the electrical integrity of magnet circuits  Responsibility for the electrical quality assurance (ELQA) during magnet interconnections and hardware commissioning as well as for electrical diagnostics and interventions during operation.  Responsibility for the magnet protection system and machine interlocks for the CERN accelerator complex, during design, construction and exploitation.  To guarantee permanence of expertise, follow the state-of-the-art and to develop knowledge for design, construction and operation of failsafe and reliable electronics

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 11 Machine Protection and Electrical Integrity group (TE-MPE) High current, radiation tolerant cold by-pass diodes for LHC main magnets. 600 A energy extraction system. Assembly of 13 kA circuit breakers and dump resistors capable of dissipating 700 MJ. Electrical Systems

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 12 Magnets, Superconductors and Cryostats (TE-MSC) Design, construction and measurements of superconducting and normal conducting magnets for the CERN accelerator complex  Integration in the CERN accelerator complex, magnet cryostats and magnet quality control  Support to operation of the accelerators for magnets, magnet performance, devices (current leads)  Development of associated technologies, namely superconductors, insulation and polymers, superconducting electrical devices and magnetic measurements for present and future accelerators

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 13 Magnets, Superconductors and Cryostats (TE-MSC) LHC: 400 ton of high quality NbTi (47%); Used in 1200 ton km of Cu/NbTi cable; 20,000 measurements at 1.9 K Superconductivity Present LHC application: Ag/Bi-2223 Current : > K (expensive conductor) LHC upgrade: new application with MgB2 Current : > K HTS superconductors 12 cryogenic test benches for the LHC magnets nominally tested before underground installation (24h/24, 7d/7 operation) Magnets Test Facilities

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 14 Vacuum, Surfaces and Coatings (TE-VSC) Design, construction, operation, maintenance and upgrade of high & ultra-high vacuum systems for accelerators and detectors; Coatings, surfaces treatments, surface and chemical analysis for accelerators & detectors  support on thin-walled vacuum chambers, windows and bellows compensation systems  vacuum sealing and leak-tightness technology  dynamic vacuum phenomena  vacuum control systems, vacuum interlocks and monitoring tools  expertise and support in the fields of:  Coatings, electroplating and surface cleaning techniques  UHV characterization of material and surfaces  Degassing analysis and treatments

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 15 Vacuum, Surfaces and Coatings (TE-VSC) Vacuum Engineering for Accelerators CERN-wide support and expertise to accelerators and detectors in the domain of thin film coatings Thin film coating facilities with a special focus on physical deposition techniques: evaporation, diode and magnetron sputtering Complex shape and all types of materials including a-C coatings Specific techniques for plasma processing of surfaces, including plasma cleaning and glow discharge Removal of hydrocarbon contamination on Beryllium beam pipes using an oxygen discharge Expertise for numerical simulations of special cases of coatings, vacuum and plasmas Coatings and plasma processing Surface and chemical analysis Expertise in radiation damage of polymeric materials Outgassing analysis (metals and polymers) and degassing treatments Permeation in polymers and metals Gas analysis by chromatographic techniques Chemical and surface analysis Outgassing of amorphous carbon films

CERN-GREECE INDUSTRY DAY Monday, 31 March 2014 TECHNOLOGY DEPARTMENT 16 Thank you for your attention